Patents by Inventor Kyo-yeol Lee
Kyo-yeol Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11901131Abstract: A multilayer ceramic electronic component includes a ceramic body including a first internal electrode and a second internal electrode disposed to be alternately stacked with a dielectric layer interposed therebetween; a first external electrode connected to the first internal electrode and including a first electrode layer, a first conductive layer, and a first metal layer; a second external electrode connected to the second internal electrode and including a second electrode layer, a second conductive layer, and a second metal layer; and a first coating layer disposed on the ceramic body, the first electrode layer and the second electrode layer. The first conductive layer and the second conductive layer are sintered electrodes including a conductive metal and glass, and the first coating layer includes a plurality of openings disposed on the first electrode layer and the second electrode layer.Type: GrantFiled: September 3, 2021Date of Patent: February 13, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kyo Yeol Lee, Seung Hun Han, In Young Kang, Jung Min Kim, Jeong Ryeol Kim
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Patent number: 11705283Abstract: A multilayer ceramic electronic component includes a ceramic body including a first internal electrode and a second internal electrode disposed to be alternately stacked with a dielectric layer interposed therebetween, a first external electrode connected to the first internal electrode and including a first electrode layer, a first conductive layer, and a first metal layer, a second external electrode connected to the second internal electrode and including a second electrode layer, a second conductive layer, and a second metal layer, and a first coating layer disposed on the ceramic body, the first electrode layer and the second electrode layer, wherein the first coating layer may include an alkyl(meth)acrylate-based polymer.Type: GrantFiled: September 7, 2021Date of Patent: July 18, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kyo Yeol Lee, Seung Hun Han, In Young Kang, Jung Min Kim, Jeong Ryeol Kim
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Patent number: 11594374Abstract: A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and first internal electrodes and second internal electrodes disposed to face each other and alternately stacked with the respective dielectric layers interposed therebetween; a first external electrode connected to the first internal electrodes; a second external electrode connected to the second internal electrodes; and a protective layer disposed on the ceramic body, the first external electrode, and the second external electrode, wherein the protective layer includes an adhesion assisting layer and a coating layer.Type: GrantFiled: June 3, 2021Date of Patent: February 28, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kyo Yeol Lee, Seung Hun Han, Sang Wook Lee, Jung Min Kim, Jeong Ryeol Kim
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Publication number: 20220208456Abstract: A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and first internal electrodes and second internal electrodes disposed to face each other and alternately stacked with the respective dielectric layers interposed therebetween; a first external electrode connected to the first internal electrodes; a second external electrode connected to the second internal electrodes; and a protective layer disposed on the ceramic body, the first external electrode, and the second external electrode, wherein the protective layer includes an adhesion assisting layer and a coating layer.Type: ApplicationFiled: June 3, 2021Publication date: June 30, 2022Inventors: Kyo Yeol LEE, Seung Hun HAN, Sang Wook LEE, Jung Min KIM, Jeong Ryeol KIM
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Publication number: 20220208464Abstract: A multilayer ceramic electronic component includes a ceramic body including a first internal electrode and a second internal electrode disposed to be alternately stacked with a dielectric layer interposed therebetween; a first external electrode connected to the first internal electrode and including a first electrode layer, a first conductive layer, and a first metal layer; a second external electrode connected to the second internal electrode and including a second electrode layer, a second conductive layer, and a second metal layer; and a first coating layer disposed on the ceramic body, the first electrode layer and the second electrode layer. The first conductive layer and the second conductive layer are sintered electrodes including a conductive metal and glass, and the first coating layer includes a plurality of openings disposed on the first electrode layer and the second electrode layer.Type: ApplicationFiled: September 3, 2021Publication date: June 30, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kyo Yeol LEE, Seung Hun HAN, In Young KANG, Jung Min KIM, Jeong Ryeol KIM
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Publication number: 20220208465Abstract: A multilayer ceramic electronic component includes a ceramic body including a first internal electrode and a second internal electrode disposed to be alternately stacked with a dielectric layer interposed therebetween, a first external electrode connected to the first internal electrode and including a first electrode layer, a first conductive layer, and a first metal layer, a second external electrode connected to the second internal electrode and including a second electrode layer, a second conductive layer, and a second metal layer, and a first coating layer disposed on the ceramic body, the first electrode layer and the second electrode layer, wherein the first coating layer may include an alkyl(meth)acrylate-based polymer.Type: ApplicationFiled: September 7, 2021Publication date: June 30, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kyo Yeol LEE, Seung Hun HAN, In Young KANG, Jung Min KIM, Jeong Ryeol KIM
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Publication number: 20220208457Abstract: A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and first internal electrodes and second internal electrodes disposed to face each other and alternately stacked with the respective dielectric layers interposed therebetween; a first external electrode connected to the first internal electrodes; a second external electrode connected to the second internal electrodes; and a protective layer disposed on the ceramic body, the first external electrode, and the second external electrode, wherein the protective layer includes an adhesion assisting layer and a coating layer, an average thickness of the protective layer is 70 nm or more and/or less than 400 nm, and a ratio of an average thickness of the coating layer to the average thickness of the protective layer is 0.25 or more and/or 0.75 or less.Type: ApplicationFiled: August 26, 2021Publication date: June 30, 2022Inventors: Kyo Yeol Lee, Seung Hun Han, Sang Wook Lee, Jung Min Kim, Jeong Ryeol Kim
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Patent number: 10811193Abstract: A capacitor component includes a porous body, a first electrode layer covering surfaces of pores of the porous body, a dielectric layer covering the first electrode layer, and a second electrode layer filling the pores of the porous body and covering the dielectric layer.Type: GrantFiled: April 24, 2018Date of Patent: October 20, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jeong Hoon Ryou, Hyun Ho Shin, Byeong Cheol Moon, Chang Soo Jang, Tae Joon Park, Yun Hee Kim, Kyo Yeol Lee, Seung Mo Lim
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Patent number: 10490355Abstract: A thin film capacitor includes a body including a lower electrode formed on a substrate, a plurality of first electrode layers, and a plurality of second electrode layers stacked alternately with the plurality of first electrode layers, with one of the dielectric layers interposed therebetween. The lower electrode and the first electrode layer have the same polarity as each other, and surface roughness of the first and second electrode layers is less than that of the dielectric layers, thereby securing capacitance and characteristics of the dielectric layers.Type: GrantFiled: January 19, 2017Date of Patent: November 26, 2019Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Seung Mo Lim, Hai Joon Lee, Ho Phil Jung, Jong Beom Kim, Kyo Yeol Lee, Dong Joon Oh
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Patent number: 10446324Abstract: A thin film capacitor includes a body including alternately stacked first and second electrode layers and dielectric layers on a substrate, the second electrode layer including a second lower electrode layer and a second upper electrode layer formed on the second lower electrode layer, the second lower electrode layer including a material having a higher band gap energy than the first electrode layer and the second upper electrode layer.Type: GrantFiled: July 17, 2017Date of Patent: October 15, 2019Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kyo Yeol Lee, Hai Joon Lee, Seung Mo Lim, Ho Phil Jung, In Young Kang, Yun Hee Kim, Yun Sung Kang
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Patent number: 10395842Abstract: A thin film capacitor includes a capacitor body formed by alternately stacking first and second electrode layers and a dielectric layer on a substrate, and having the second electrode layer disposed in an uppermost portion thereof, and a stress alleviation layer formed on the uppermost second electrode layer. The stress alleviation layer is formed of a material having a coefficient of thermal expansion higher than those of the substrate and the dielectric layer.Type: GrantFiled: April 12, 2017Date of Patent: August 27, 2019Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kyo Yeol Lee, Seung Mo Lim, Dong Joon Oh, Yun Sung Kang, Hai Joon Lee
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Patent number: 10319526Abstract: A thin-film capacitor includes a body having a plurality of dielectric layers and first and second electrode layers alternately stacked on a substrate, first and second electrode pads disposed on one surface of the body, a plurality of vias having a multistage shape being disposed in the body, a first via of the plurality of vias connects the first electrode layer to the first electrode pad, and penetrates from the surface of the body to a first lowermost electrode layer adjacent the substrate, a second via of the plurality of vias connects the second electrode layer to the second electrode pad, and penetrates from the surface of the body to a second lowermost electrode layer adjacent the substrate and an upper surface of the first electrode layer is exposed in the first via, and an upper surface of the second electrode layer is exposed in the second via.Type: GrantFiled: July 10, 2017Date of Patent: June 11, 2019Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hyun Ho Shin, Yun Sung Kang, Seung Mo Lim, Kyo Yeol Lee, Dong Joon Oh, Woong Do Jung, Ho Phil Jung, Hai Joon Lee
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Patent number: 10305446Abstract: A piezoelectric oscillator, and method of making the same, includes an oscillation substrate comprising an oscillating part and a surrounding part, wherein the surrounding part is thinner than the oscillating part, and oscillating electrodes disposed on an upper surface and a lower surface of the oscillating part. The oscillation substrate is configured according to H=400.59×S+1.75±1.5, wherein H=100×(T2/T1) and S=T2/(L1?L2), wherein L1 represents an entire length of the oscillation substrate, L2 represents a length of the oscillating part, T1 represents a thickness of the oscillating part, and T2 represents a step height between the oscillating part and the surrounding part.Type: GrantFiled: June 10, 2016Date of Patent: May 28, 2019Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jae Sang Lee, Ho Phil Jung, Sung Wook Kim, Tae Joon Park, In Young Kang, Dong Joon Oh, Je Hong Kyoung, Kyo Yeol Lee, Jong Pil Lee, Seung Mo Lim
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Publication number: 20190088419Abstract: A capacitor component includes a porous body, a first electrode layer covering surfaces of pores of the porous body, a dielectric layer covering the first electrode layer, and a second electrode layer filling the pores of the porous body and covering the dielectric layer.Type: ApplicationFiled: April 24, 2018Publication date: March 21, 2019Inventors: Jeong Hoon RYOU, Hyun Ho SHIN, Byeong Cheol MOON, Chang Soo JANG, Tae Joon PARK, Yun Hee KIM, Kyo Yeol LEE, Seung Mo LIM
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Patent number: 10141115Abstract: A thin film capacitor includes a body having first and second electrode layers and first and second dielectric layers alternately stacked on a substrate. A thickness of the first dielectric layer is 1.2 to 3 times that of the second dielectric layer. Therefore, leakage current characteristics of the dielectric layers may be improved, and capacitance of the thin film capacitor may be secured.Type: GrantFiled: March 20, 2017Date of Patent: November 27, 2018Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kyo Yeol Lee, Yun Sung Kang, Hai Joon Lee, Dong Joon Oh, Ho Phil Jung, Seung Mo Lim
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Patent number: 10062516Abstract: A thin-film ceramic capacitor includes: a body in which a plurality of dielectric layers and first and second electrode layers are alternately disposed on a substrate; and first and second electrode pads disposed on an external surface of the body. The dielectric layer contains a mixed phase of a perovskite phase having ferroelectric properties and a pyrochlore phase having paraelectric properties, the pyrochlore phase being disposed on interfaces between the dielectric layers and the first and second electrode layers in lower portions of the dielectric layers.Type: GrantFiled: June 27, 2017Date of Patent: August 28, 2018Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Yun Sung Kang, Hai Joon Lee, Tae Joon Park, Dong Joon Oh, Yun Hee Kim, Kyo Yeol Lee, Seung Mo Lim, In Young Kang
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Publication number: 20180144873Abstract: A thin film capacitor includes a body including alternately stacked first and second electrode layers and dielectric layers on a substrate, the second electrode layer including a second lower electrode layer and a second upper electrode layer formed on the second lower electrode layer, the second lower electrode layer including a material having a higher band gap energy than the first electrode layer and the second upper electrode layer.Type: ApplicationFiled: July 17, 2017Publication date: May 24, 2018Inventors: Kyo Yeol LEE, Hai Joon LEE, Seung Mo LIM, Ho Phil JUNG, In Young KANG, Yun Hee KIM, Yun Sung KANG
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Publication number: 20180144871Abstract: A thin-film ceramic capacitor includes: a body in which a plurality of dielectric layers and first and second electrode layers are alternately disposed on a substrate; and first and second electrode pads disposed on an external surface of the body. The dielectric layer contains a mixed phase of a perovskite phase having ferroelectric properties and a pyrochlore phase having paraelectric properties, the pyrochlore phase being disposed on interfaces between the dielectric layers and the first and second electrode layers in lower portions of the dielectric layers.Type: ApplicationFiled: June 27, 2017Publication date: May 24, 2018Inventors: Yun Sung KANG, Hai Joon LEE, Tae Joon PARK, Dong Joon OH, Yun Hee KIM, Kyo Yeol LEE, Seung Mo LIM, In Young KANG
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Publication number: 20180144872Abstract: A thin-film capacitor includes a body having a plurality of dielectric layers and first and second electrode layers alternately stacked on a substrate, first and second electrode pads disposed on one surface of the body, a plurality of vias having a multistage shape being disposed in the body, a first via of the plurality of vias connects the first electrode layer to the first electrode pad, and penetrates from the surface of the body to a first lowermost electrode layer adjacent the substrate, a second via of the plurality of vias connects the second electrode layer to the second electrode pad, and penetrates from the surface of the body to a second lowermost electrode layer adjacent the substrate and an upper surface of the first electrode layer is exposed in the first via, and an upper surface of the second electrode layer is exposed in the second via.Type: ApplicationFiled: July 10, 2017Publication date: May 24, 2018Inventors: Hyun Ho SHIN, Yun Sung KANG, Seung Mo LIM, Kyo Yeol LEE, Dong Joon OH, Woong Do JUNG, Ho Phil JUNG, Hai Joon LEE
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Publication number: 20180068798Abstract: A thin film capacitor includes a body having first and second electrode layers and first and second dielectric layers alternately stacked on a substrate. A thickness of the first dielectric layer is 1.2 to 3 times that of the second dielectric layer. Therefore, leakage current characteristics of the dielectric layers may be improved, and capacitance of the thin film capacitor may be secured.Type: ApplicationFiled: March 20, 2017Publication date: March 8, 2018Inventors: Kyo Yeol LEE, Yun Sung KANG, Hai Joon LEE, Dong Joon OH, Ho Phil JUNG, Seung Mo LIM