Patents by Inventor KYOCERA SLC TECHNOLOGIES CORPORATIO

KYOCERA SLC TECHNOLOGIES CORPORATIO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • WIRING BOARD AND PROBE CARD USING THE SAME
    Publication number: 20130169305
    Abstract: A wiring board 3 according to the present invention includes a first resin layer 18a formed of a thermoplastic resin; a conductive layer 16 formed partially on the first resin layer 18a; a through hole P for insertion of a screw formed in a region where the conductive layer 16 is not formed and penetrating through the first resin layer 18a in a thickness direction thereof; and a dummy via hole D formed in a region between the through hole P and the conductive layer 16 and penetrating through the first resin layer 18a.
    Type: Application
    Filed: December 27, 2012
    Publication date: July 4, 2013
    Applicant: KYOCERA SLC TECHNOLOGIES CORPORATION
    Inventor: KYOCERA SLC TECHNOLOGIES CORPORATIO