Abstract: According to one embodiment, a semiconductor light emitting device includes a substrate that has a surface on which a recessed portion is provided, a light emitting body that is provided on the surface of the substrate, and a first metal layer between the light emitting body and the substrate, and contacts an inner surface of the recessed portion. The light emitting body includes a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type, and a light emitting layer between the first semiconductor layer and the second semiconductor layer.

Abstract: A semiconductor light-emitting device includes first and second semiconductor layer and a light-emitting layer between the first and second semiconductor layers. These layers are on a conductive substrate. A first electrode and a first electrode pad, which are electrically connected to each other, are the first semiconductor layer. A second electrode is between the substrate and the second semiconductor layer. A portion of the second electrode is not covered by the first semiconductor, second semiconductor, and light-emitting layers. A second electrode pad is on the exposed portion of the second electrode. The second electrode pad has a planar area that is less than a planar area of the first electrode pad. A third electrode is on a second surface of the conductive substrate such that the conductive substrate is between the third electrode and the second electrode. The third electrode is electrically connected to the second electrode pad.

Abstract: A semiconductor light-emitting device includes first and second semiconductor layer and a light-emitting layer between the first and second semiconductor layers. These layers are on a conductive substrate. A first electrode and a first electrode pad, which are electrically connected to each other, are the first semiconductor layer. A second electrode is between the substrate and the second semiconductor layer. A portion of the second electrode is not covered by the first semiconductor, second semiconductor, and light-emitting layers. A second electrode pad is on the exposed portion of the second electrode. The second electrode pad has a planar area that is less than a planar area of the first electrode pad. A third electrode is on a second surface of the conductive substrate such that the conductive substrate is between the third electrode and the second electrode. The third electrode is electrically connected to the second electrode pad.

Abstract: According to one embodiment, in a semiconductor light emitting device, a semiconductor laminated body is made by laminating, in order, a first semiconductor layer of a first conductivity-type, a semiconductor light emitting layer and a second semiconductor layer of a second conductivity-type. The semiconductor laminated body includes a plurality of trenches arranged in a periodical manner to penetrate through the second semiconductor layer and the semiconductor light emitting layer and reach the first semiconductor layer. An insulating film is buried into the trenches, and has transparency to light emitted from the semiconductor light emitting layer. A first electrode is electrically connected to the first semiconductor layer. A second electrode covers an upper surface of the second semiconductor layer.

Abstract: According to one embodiment, in a semiconductor light emitting device, a semiconductor laminated body is made by laminating, in order, a first semiconductor layer of a first conductivity-type, a semiconductor light emitting layer and a second semiconductor layer of a second conductivity-type. The semiconductor laminated body includes a plurality of trenches arranged in a periodical manner to penetrate through the second semiconductor layer and the semiconductor light emitting layer and reach the first semiconductor layer. An insulating film is buried into the trenches, and has transparency to light emitted from the semiconductor light emitting layer. A first electrode is electrically connected to the first semiconductor layer. A second electrode covers an upper surface of the second semiconductor layer.

Abstract: According to one embodiment, in a method for manufacturing a semiconductor light emitting device, a transparent conductive film is formed on a semiconductor laminated body of a multilayer structure containing a light emitting unit. The transparent conductive film is a film transmissive to a light of a luminescence wavelength from the light emitting unit. A mask is formed on the portion of the transparent conductive film. The transparent conductive film is removed by wet etching through the mask so as to expose the semiconductor laminated body. The semiconductor laminated body is removed by anisotropically etching through the mask so as to remove the light emitting unit. The mask is removed. A first electrode is formed on the portion of the semiconductor laminated body exposed after removing the light emitting unit. A second electrode is formed on the portion of the transparent conductive film.

Abstract: According to one embodiment, in a method for manufacturing a semiconductor light emitting device, a transparent conductive film is formed on a semiconductor laminated body of a multilayer structure containing a light emitting unit. The transparent conductive film is a film transmissive to a light of a luminescence wavelength from the light emitting unit. A mask is formed on the portion of the transparent conductive film. The transparent conductive film is removed by wet etching through the mask so as to expose the semiconductor laminated body. The semiconductor laminated body is removed by anisotropically etching through the mask so as to remove the light emitting unit. The mask is removed. A first electrode is formed on the portion of the semiconductor laminated body exposed after removing the light emitting unit. A second electrode is formed on the portion of the transparent conductive film.

Abstract: A semiconductor light emitting device includes: a semiconductor multilayer structure including a first semiconductor layer, a second semiconductor layer, and a light emitting layer provided between the first semiconductor layer and the second semiconductor layer; a first electrode connected to the first semiconductor layer of the semiconductor multilayer structure; a second electrode provided on the second semiconductor layer of the semiconductor multilayer structure; and a third electrode connected to the second electrode. The second electrode is provided between the first electrode and the third electrode as viewed in a direction perpendicular to a major surface of the semiconductor multilayer structure, and includes: a first region having at least one notch extending toward a route connecting between the first electrode and the third electrode; a second region provided around the first electrode and having no notch; and a third region provided around the third electrode and having no notch.