Patents by Inventor Kyohei Tonoyama

Kyohei Tonoyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140077914
    Abstract: A coil component 1 is provided with coil conductors 10a and 10b and a magnetic metal powder containing resin 22 (22a and 22b) covering the coil conductors 10a and 10b. The magnetic metal powder containing resin 22 includes first metal powder having a first average grain diameter, second metal powder having a second average grain diameter that is smaller than the first average grain diameter, and third metal powder having a third average grain diameter that is smaller than the second average grain diameter. The first average grain diameter is 15 ?m or more and 100 ?m or less. The third average grain diameter is 2 ?m or less. The first metal powder mainly contains Permalloy and the second and third metal powders mainly contain carbonyl iron.
    Type: Application
    Filed: September 4, 2013
    Publication date: March 20, 2014
    Applicant: TDK Corporation
    Inventors: Hitoshi Ohkubo, Kyohei Tonoyama, Makoto Morita, Tomokazu Ito, Hideto Itoh, Yoshihiro Maeda, Manabu Ohta, Yuuya Kaname, Takahiro Kawahara
  • Publication number: 20130249664
    Abstract: In a planar coil element and a method for producing the same, a metal magnetic powder-containing resin containing an oblate or needle-like first metal magnetic powder contains a second metal magnetic powder having an average particle size (1 ?m) smaller than that (32 ?m) of the first metal magnetic powder, which significantly reduces the viscosity of the metal magnetic powder-containing resin. Therefore, the metal magnetic powder-containing resin is easy to handle when applied to enclose a coil unit, which makes it easy to produce the planar coil element.
    Type: Application
    Filed: March 21, 2013
    Publication date: September 26, 2013
    Inventors: Kyohei TONOYAMA, Makoto MORITA, Tomokazu ITO, Hitoshi OHKUBO, Manabu OHTA, Yoshihiro MAEDA, Yuuya KANAME, Hideharu MORO
  • Publication number: 20130249662
    Abstract: In a planar coil element, the quantitative ratio of inclined particles to total particles of a first metal magnetic powder contained in a metal magnetic powder-containing resin provided in a through hole of a coil unit is higher than the quantitative ratio of inclined particles to total particles of the first metal magnetic powder contained in the metal magnetic powder-containing resin provided in other than the through hole, and many of particles of the first metal magnetic powder in the magnetic core are inclined particles whose major axes are inclined with respect to the thickness direction and the planar direction of a substrate. Therefore, the planar coil element has improved strength as compared to a planar coil element shown in FIG. 9A and has improved magnetic permeability as compared to a planar coil element shown in FIG. 9B.
    Type: Application
    Filed: March 19, 2013
    Publication date: September 26, 2013
    Inventors: Kyohei TONOYAMA, Makoto MORITA, Tomokazu ITO, Hitoshi OHKUBO, Manabu OHTA, Yoshihiro MAEDA, Yuuya KANAME, Hideharu MORO
  • Publication number: 20130222101
    Abstract: A coil component includes: an insulating resin layer provided between a first planar spiral conductor formed on a back surface of a first substrate and a second planer spiral conductor formed on a back surface of a second substrate; an upper core covering a third second planer spiral conductor formed on a front surface of the first substrate on which the insulating resin layer is formed; and a lower core covering a fourth planer spiral conductor formed on a front surface of the second substrate on which the insulating resin layer is formed. One of the upper and lower cores is formed of a metal-magnetic-powder-containing resin. The coil component includes connecting portions disposed respectively at center and outside portions of each of the first and second substrates so as to physically connect the upper and lower cores.
    Type: Application
    Filed: October 14, 2011
    Publication date: August 29, 2013
    Applicant: TDK CORPORATION
    Inventors: Tomokazu Ito, Hitoshi Ohkubo, Yoshihiro Maeda, Makoto Morita, Toshiyuki Anbo, Kyohei Tonoyama, Manabu Ohta