Abstract: A method for producing shortened anionically modified cellulose fibers having an average fiber length of 1 ?m or more and 500 ?m or less, the method including cleaving sugar chains of anionically modified cellulose fibers by thermal decomposition under temperature conditions of 50° C. or higher and 230° C. or lower, wherein the average fiber length of the anionically modified cellulose fibers is 700 ?m or more and 10000 ?m or less. By the use of shortened anionically modified cellulose fibers or the like obtained by the method for production of the present invention, a dispersion containing fine cellulose fibers having a low viscosity and excellent handling property can be prepared while at a high concentration, so that the dispersion can be suitably used in various industrial applications such as daily sundries, household electric appliance parts, packaging materials for household electric appliances, automobile parts, and materials for three-dimensional modeling.

Abstract: The present invention provides aqueous chemical mechanical planarization (CMP) polishing compositions that comprise a mixture of (a) one or more alkoxylated diamines having a number average molecular weight (Mn) of from 1,000 to 20,000, or, preferably, from 1000-15000 and having four (poly)alkoxy ether groups each containing from 5 to 100 alkoxy repeat units; (b) from 0.01 to 2 wt. % or, preferably, from 0.1 to 1.5 wt. %, as solids, based on the total weight of the compositions, of one or more aqueous dispersions of elongated, bent or nodular colloidal silica particles, preferably, having a secondary particle size as determined by dynamic light scattering (DLS) of from 20 to 60 nm; and (c) ammonia or an amine base, wherein the compositions have a pH ranging from 9 to 11. The compositions are substantially free of metals, such as alkali or alkaline earth metals that can damage substrates in polishing.

Abstract: The present invention provides aqueous chemical mechanical planarization (CMP) polishing compositions that comprise a mixture of (a) one or more alkoxylated diamines having a number average molecular weight (Mn) of from 1,000 to 20,000, or, preferably, from 1000-15000 and having four (poly)alkoxy ether groups each containing from 5 to 100 alkoxy repeat units; (b) from 0.01 to 2 wt. % or, preferably, from 0.1 to 1.5 wt. %, as solids, based on the total weight of the compositions, of one or more aqueous dispersions of elongated, bent or nodular colloidal silica particles, preferably, having a secondary particle size as determined by dynamic light scattering (DLS) of from 20 to 60 nm; and (c) ammonia or an amine base, wherein the compositions have a pH ranging from 9 to 11. The compositions are substantially free of metals, such as alkali or alkaline earth metals that can damage substrates in polishing.