Patents by Inventor Kyoichi Gokan

Kyoichi Gokan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrically conductive copper composition
    Patent number: 5248451
    Abstract: The present invention provides a conductive copper composition comprising metal powder, a binder, a dispersant, and a solvent, characterized by containing 100 parts by weight of copper powder in the form of spherical or granule particles coated with silver as the metal powder, 6 to 18 parts by weight of resol resin satisfying the following conditions (a) to (c) as the binder, 0.05 to 1 part by weight of the dispersant, and 2 to 15 parts of the solvent:(a) Dimethylene-ether bonds in the skeletal structure or alkyl-ether bonds are contained 5% more of the bonded formaldehyde;(b) The molar ratio of preparation between formaldehyde and phenol (formaldehyde/phenol) is within the range of 1.0 to 3.
    Type: Grant
    Filed: July 9, 1991
    Date of Patent: September 28, 1993
    Assignees: Mitsui Mining & Smelting Co., Ltd., Gunei Chemical Industry Co., Ltd.
    Inventors: Masayuki Tsunaga, Takao Suzuki, Kazuaki Yuba, Yoshiaki Kurimoto, Kyoichi Gokan, Masaki Hirosawa