Patents by Inventor Kyoichi Moriyama

Kyoichi Moriyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor pressure sensor module
    Patent number: 5859759
    Abstract: The semiconductor pressure sensor has a pressure sensor unit with a pressure sensor chip for detecting pressure, peripheral circuitry for converting the pressure detected by the pressure sensor unit to an electrical signal and processing the electrical signal, a lead frame for fastening and electrically connecting peripheral circuitry, a package in which the peripheral circuitry and lead frame are integrated in a resin molding including a cavity in which the pressure sensor unit is housed, a cover for closing the opening of the cavity in which the pressure sensor unit is housed, and a pressure opening for conveying a pressure-conveying medium to the pressure sensor chip. The pressure sensor unit is fastened to the inside bottom of the cavity and is electrically connected to a particular part of the lead frame exposed inside the cavity.
    Type: Grant
    Filed: March 18, 1997
    Date of Patent: January 12, 1999
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Kyoichi Moriyama, Katsumi Sakabe, Motomi Ichihashi