Patents by Inventor Kyoji Yuyama

Kyoji Yuyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor integrated circuit device with improved connection pattern of signal wirings
    Patent number: 5117277
    Abstract: A semiconductor integrated circuit device having a plurality of first wirings that are formed on a semiconductor substrate and extend in a first direction and a plurality of second wirings that extend in a second direction defining an acute angle relative to the first direction. The plurality of first and second wirings have at their ends connection portions of a regular hexagonal shape or a circular shape.
    Type: Grant
    Filed: January 24, 1990
    Date of Patent: May 26, 1992
    Assignee: Hitachi, Ltd.
    Inventors: Kyoji Yuyama, Mikinori Kawaji
  • Wiring design for semiconductor integrated circuit
    Patent number: 5046017
    Abstract: A method of designing semiconductor integrated circuits wherein rough routes are designated after a process of design for cells layout is completed, then wirings between cells are supposed automatically on the basis of the designated rough routes, investigation of the characteristic of the wirings is executed, and after a target characteristic is attained, a wiring pattern satisfying all of required electrical and physical conditions, including layout rules, i.e. a detailed wiring pattern, is prepared.
    Type: Grant
    Filed: December 21, 1988
    Date of Patent: September 3, 1991
    Assignees: Hitachi, Ltd., Hitachi Microcomputer Engineering, Ltd.
    Inventors: Kyoji Yuyama, Kouichi Nishizawa