Patents by Inventor Kyoko Kotsuka

Kyoko Kotsuka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for mounting parts on circuit boards
    Patent number: 4208005
    Abstract: One or more parts having terminals can be mounted on a circuit board by coating an ultraviolet-curing and thermosetting resin composition comprising an ultraviolet-curing resin, an addition polymerizable monomer, a photosensitizer and a heat polymerization initiator, on the circuit board by screen printing with a prescribed pattern, mounting the parts on the printed resin composition, curing the resin composition by simultaneous irradiation of ultraviolet light and heat rays so as to bond the parts to the circuit board, and soldering the parts onto the circuit board.
    Type: Grant
    Filed: February 6, 1979
    Date of Patent: June 17, 1980
    Assignee: Hitachi, Ltd.
    Inventors: Kazuo Nate, Kyoko Kotsuka, Tokio Isogai