Patents by Inventor Kyol PARK
Kyol PARK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9679874Abstract: A semiconductor device includes a substrate, a first semiconductor package disposed on the substrate, and a second semiconductor package spaced apart from the first semiconductor package on the substrate. The second semiconductor package includes a semiconductor chip stacked on the substrate, an adhesion part covering the semiconductor chip, and a heat-blocking structure disposed between the substrate and the semiconductor chip. Heat generated from the first semiconductor package and transmitted to the second semiconductor package through the substrate is blocked by the heat-blocking structure.Type: GrantFiled: November 11, 2015Date of Patent: June 13, 2017Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jin-Kwon Bae, Jae Choon Kim, Jichul Kim, Kyol Park, Chajea Jo
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Patent number: 9666503Abstract: A semiconductor package and an electronic system including the same include a package board having an electric circuit pattern. A semiconductor chip is mounted on the package board and electrically connected with the circuit pattern of the package board. A non-contact temperature detector is provided with the semiconductor package and detects a temperature of an external heat source without making contact with the external heat source. A temperature controller controls the semiconductor chip according to the temperature of the external heat source that is detected by the non-contact temperature detector.Type: GrantFiled: December 12, 2013Date of Patent: May 30, 2017Assignee: Samsung Electronics Co., Ltd.Inventors: Yun-Hyeok Im, Kyol Park, Hee-Jung Hwang
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Patent number: 9583430Abstract: The inventive concepts provide package-on-package (PoP) devices. In the PoP devices, an interposer substrate and a thermal boundary material layer may be disposed between a lower semiconductor package and an upper semiconductor package to rapidly exhaust heat generated from a lower semiconductor chip included in the lower semiconductor package. The interposer substrate may be formed of one or more insulating layers, conductive vias, heat dissipating members, protection layers, and various conductive patterns.Type: GrantFiled: August 11, 2014Date of Patent: February 28, 2017Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Kyol Park, Jichul Kim, Yunhyeok Im, Eon Soo Jang
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Patent number: 9482584Abstract: A method of predicting a temperature includes operatively coupling a temperature prediction circuit to a device including a semiconductor chip, determining a correlation between a current and voltage of the temperature prediction circuit, and predicting a temperature with respect to power applied to the device using the determined correlation.Type: GrantFiled: February 26, 2013Date of Patent: November 1, 2016Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Yun-hyeok Im, Kyol Park, Tae-je Cho
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Patent number: 9391009Abstract: According to example embodiments, a semiconductor package includes a lower package, upper packages on the lower package and laterally spaced apart from each other, a lower heat exhaust part between the lower package and the upper packages, an intermediate heat exhaust part between the upper packages and connected to the lower heat exhaust part, and an upper heat exhaust part on the upper packages and connected to the intermediate heat exhaust part.Type: GrantFiled: May 29, 2014Date of Patent: July 12, 2016Assignee: Samsung Electronics Co., Ltd.Inventors: Eon Soo Jang, Kyol Park, Jongwoo Park, Jin-Kwon Bae, Yunhyeok Im, Jichul Kim, Soojae Park
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Publication number: 20160133605Abstract: A semiconductor device includes a substrate, a first semiconductor package disposed on the substrate, and a second semiconductor package spaced apart from the first semiconductor package on the substrate. The second semiconductor package includes a semiconductor chip stacked on the substrate, an adhesion part covering the semiconductor chip, and a heat-blocking structure disposed between the substrate and the semiconductor chip. Heat generated from the first semiconductor package and transmitted to the second semiconductor package through the substrate is blocked by the heat-blocking structure.Type: ApplicationFiled: November 11, 2015Publication date: May 12, 2016Inventors: Jin-Kwon BAE, Jae Choon KIM, Jichul KIM, Kyol PARK, Chajea JO
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Patent number: 9293389Abstract: A semiconductor package includes a circuit board having an inner circuit pattern and a plurality of contact pads connected to the inner circuit pattern, at least one integrated circuit (IC) device on the circuit board and making contact with the contact pads, a mold on the circuit board, the mold fixing the IC device to the circuit board, and a surface profile modifier on a surface of the IC device and a surface of the mold, and the surface profile modifier enlarging a surface area of the IC device and the mold to dissipate heat.Type: GrantFiled: December 19, 2014Date of Patent: March 22, 2016Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Kyol Park, Yun-Hyeok Im
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Patent number: 9190338Abstract: A semiconductor package includes a substrate. A lower semiconductor chip is disposed above the substrate. An upper semiconductor chip is disposed on the lower semiconductor chip. A top surface of the lower semiconductor chip at an end of the lower semiconductor chip is exposed. A heat slug disposed above the upper semiconductor chip. A molding layer is disposed between the substrate and the heat slug. The molding layer is configured to seal the lower semiconductor chip and the upper semiconductor chip. An upper spacer is disposed between the lower semiconductor chip and the heat slug. The upper spacer is disposed on the exposed surface of the lower semiconductor chip.Type: GrantFiled: February 25, 2014Date of Patent: November 17, 2015Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Kyol Park, Yunhyeok Im, Eon Soo Jang
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Patent number: 9054067Abstract: A semiconductor package and a method of manufacturing the same are disclosed, wherein the semiconductor package includes a circuit board, a semiconductor chip mounted on the circuit board, an encapsulant positioned on the circuit board and encapsulating the semiconductor chip to the circuit board, and a thermal dissipating member positioned on the encapsulant and having a heat spreader that dissipates a driving heat from the semiconductor chip and a heat capacitor that absorbs excess driving heat that exceeds a heat transfer capability of the heat spreader, such that when a high power is applied to the package, the excess heat is absorbed into the heat capacitor as a latent heat and thus the semiconductor chip is protected from an excessive temperature increase caused by the excess heat, thereby increasing a critical time and performance duration time of the semiconductor package.Type: GrantFiled: December 3, 2013Date of Patent: June 9, 2015Assignee: Samsung Electronics Co., Ltd.Inventors: Yun-Hyoek Im, Kyol Park, Hee-Seok Lee
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Patent number: 9029998Abstract: A semiconductor package device includes a lower package including a lower semiconductor chip mounted on the lower package substrate, a lower molding compound layer disposed on the lower package substrate, a first trench formed in the lower molding compound layer to surround the lower semiconductor chip, and a second trench connected to the first trench to extend to an outer wall of the lower package, the second trench being formed in the lower molding compound layer, an upper package disposed on the lower package. The upper package includes an upper package substrate and at least one upper semiconductor chip mounted on the upper package substrate and a heat transfer member disposed between the lower package and the upper package.Type: GrantFiled: April 2, 2014Date of Patent: May 12, 2015Assignee: Samsung Electronics Co., Ltd.Inventors: Eon Soo Jang, Kyol Park, Yunhyeok Im
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Patent number: 9024434Abstract: Semiconductor package are provided. In one embodiment, the semiconductor package may include a substrate such as a circuit substrate, a semiconductor chip mounted on the circuit substrate, a molding (or an encapsulant) covering the semiconductor chip and the circuit substrate and including a first temperature control member, and a heat dissipation member covering the molding.Type: GrantFiled: May 2, 2012Date of Patent: May 5, 2015Assignee: Samsung Electronics Co., Ltd.Inventors: Yunhyeok Im, Kyol Park, Taeje Cho
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Publication number: 20150115467Abstract: The inventive concepts provide package-on-package (PoP) devices. In the PoP devices, an interposer substrate and a thermal boundary material layer may be disposed between a lower semiconductor package and an upper semiconductor package to rapidly exhaust heat generated from a lower semiconductor chip included in the lower semiconductor package. The interposer substrate may be formed of one or more insulating layers, conductive vias, heat dissipating members, protection layers, and various conductive patterns.Type: ApplicationFiled: August 11, 2014Publication date: April 30, 2015Inventors: Kyol PARK, JICHUL KIM, YUNHYEOK IM, Eon Soo JANG
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Patent number: 9013031Abstract: A semiconductor package includes a lower package including a lower semiconductor chip on a lower package substrate, an upper package on the lower package, and a heat interface material between the lower package and the upper package. The upper package includes an upper semiconductor chip on an upper package substrate including a center portion adjacent to the lower semiconductor chip and an edge portion. The heat interface material is in contact with a top surface of the lower semiconductor chip and the upper package substrate. The upper package substrate includes a heat diffusion via penetrating the center portion and an interconnection via penetrating the edge portion. The interconnection via is spaced apart from the heat diffusion via.Type: GrantFiled: February 20, 2014Date of Patent: April 21, 2015Assignee: Samsung Electronics Co., Ltd.Inventors: Yunhyeok Im, Jichul Kim, Kyol Park, Seongho Shin
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Publication number: 20150104905Abstract: A semiconductor package includes a circuit board having an inner circuit pattern and a plurality of contact pads connected to the inner circuit pattern, at least one integrated circuit (IC) device on the circuit board and making contact with the contact pads, a mold on the circuit board, the mold fixing the IC device to the circuit board, and a surface profile modifier on a surface of the IC device and a surface of the mold, and the surface profile modifier enlarging a surface area of the IC device and the mold to dissipate heat.Type: ApplicationFiled: December 19, 2014Publication date: April 16, 2015Inventors: Kyol PARK, Yun-Hyeok IM
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Publication number: 20150054148Abstract: According to example embodiments, a semiconductor package includes a lower package, upper packages on the lower package and laterally spaced apart from each other, a lower heat exhaust part between the lower package and the upper packages, an intermediate heat exhaust part between the upper packages and connected to the lower heat exhaust part, and an upper heat exhaust part on the upper packages and connected to the intermediate heat exhaust part.Type: ApplicationFiled: May 29, 2014Publication date: February 26, 2015Inventors: Eon-Soo JANG, Kyol PARK, Jongwoo PARK, Jin-Kwon BAE, Yun-Hyeok IM, Ji-Chul KIM, Soojae PARK
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Patent number: 8921990Abstract: A semiconductor package includes a circuit board having an inner circuit pattern and a plurality of contact pads connected to the inner circuit pattern, at least one integrated circuit (IC) device on the circuit board and making contact with the contact pads, a mold on the circuit board, the mold fixing the IC device to the circuit board, and a surface profile modifier on a surface of the IC device and a surface of the mold, and the surface profile modifier enlarging a surface area of the IC device and the mold to dissipate heat.Type: GrantFiled: November 25, 2013Date of Patent: December 30, 2014Assignee: Samsung Electronics Co., Ltd.Inventors: Kyol Park, Yun-Hyeok Im
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Publication number: 20140367860Abstract: A semiconductor package includes a lower package including a lower semiconductor chip on a lower package substrate, an upper package on the lower package, and a heat interface material between the lower package and the upper package. The upper package includes an upper semiconductor chip on an upper package substrate including a center portion adjacent to the lower semiconductor chip and an edge portion. The heat interface material is in contact with a top surface of the lower semiconductor chip and the upper package substrate. The upper package substrate includes a heat diffusion via penetrating the center portion and an interconnection via penetrating the edge portion. The interconnection via is spaced apart from the heat diffusion via.Type: ApplicationFiled: February 20, 2014Publication date: December 18, 2014Inventors: YUNHYEOK IM, JICHUL KIM, KYOL PARK, SEONGHO SHIN
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Publication number: 20140353813Abstract: A semiconductor package includes a substrate. A lower semiconductor chip is disposed above the substrate. An upper semiconductor chip is disposed on the lower semiconductor chip. A top surface of the lower semiconductor chip at an end of the lower semiconductor chip is exposed. A heat slug disposed above the upper semiconductor chip. A molding layer is disposed between the substrate and the heat slug. The molding layer is configured to seal the lower semiconductor chip and the upper semiconductor chip. An upper spacer is disposed between the lower semiconductor chip and the heat slug. The upper spacer is disposed on the exposed surface of the lower semiconductor chip.Type: ApplicationFiled: February 25, 2014Publication date: December 4, 2014Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Kyol Park, Yunhyeok Im, Eon Soo Jang
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Publication number: 20140339708Abstract: A semiconductor package device includes a lower package including a lower semiconductor chip mounted on the lower package substrate, a lower molding compound layer disposed on the lower package substrate, a first trench formed in the lower molding compound layer to surround the lower semiconductor chip, and a second trench connected to the first trench to extend to an outer wall of the lower package, the second trench being formed in the lower molding compound layer, an upper package disposed on the lower package. The upper package includes an upper package substrate and at least one upper semiconductor chip mounted on the upper package substrate and a heat transfer member disposed between the lower package and the upper package.Type: ApplicationFiled: April 2, 2014Publication date: November 20, 2014Inventors: Eon Soo JANG, Kyol PARK, YUNHYEOK IM
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Publication number: 20140254092Abstract: A semiconductor package and an electronic system including the same include a package board having an electric circuit pattern. A semiconductor chip is mounted on the package board and electrically connected with the circuit pattern of the package board. A non-contact temperature detector is provided with the semiconductor package and detects a temperature of an external heat source without making contact with the external heat source. A temperature controller controls the semiconductor chip according to the temperature of the external heat source that is detected by the non-contact temperature detector.Type: ApplicationFiled: December 12, 2013Publication date: September 11, 2014Applicant: Samsung Electronics Co., Ltd.Inventors: Yun-Hyeok Im, Kyol Park, Hee-Jung Hwang