Abstract: Disclosed herein is a coating composition to prevent contamination of a heater caused by water or steam. Since the coating composition may prevent formation and adhesion of scales on the surface of the heater. The coating composition may be cured at a low temperature and degradation does not occur on the surface of the heater after extended use thereof. As a result, formation of scales may be prevented. The heater of a washing machine includes a heating wire disposed at the center, a magnesium oxide (MgO) layer disposed outside the heating wire to surround the heating wire to transmit heat from the heating wire to the outside, and a stainless alloy layer disposed outside the magnesium oxide layer to surround the magnesium oxide layer. The surface of the stainless alloy layer is coated with a coating composition including a silicon resin containing organopolysiloxane and silicon containing polysilsesquioxane.

Abstract: A method for manufacturing an ink-jet print head including: preparing a single crystal silicon wafer having a (110) crystal plane orientation, as a substrate; forming a heater to heat an ink, on a front surface of a silicon substrate; forming a trench inward of the heater; forming a flow channel layer defining an ink passage, on the front surface of the substrate; forming a nozzle layer having a nozzle on the flow channel layer; and forming an ink supply channel from a rear surface of the substrate to the trench by anisotropic wet etching.

Abstract: A method of manufacturing an inkjet print head that includes an improved process of forming an ink feed hole, thereby enabling an increase in productivity and a favorable ink supply via the ink feed hole. The method includes preparing a substrate on which a heater to heat an ink is formed on the front side thereof, forming a flow passage formation layer on the front side of the substrate such that the flow passage formation layer defines an ink flow passage, forming a nozzle layer provided with a nozzle on the flow passage formation layer, forming a first protective layer such that the first protective layer covers the flow passage formation layer and the nozzle layer, applying a mask material used to etch the substrate to the rear side of the substrate, applying a second protective layer to the lateral side of the substrate to protect the lateral side of the substrate, and forming an ink feed hole on the substrate by wet etching. Tantalum (Ta) is used as the mask material.