Abstract: The electronic component includes: a capacitor body; first and second external electrodes on a mounting surface of the capacitor body; first and second connection terminals respectively connected to the first and second external electrodes; a first bonding portion between the first external electrode and the first connection terminal, and including a first-2-th region and a first-1-th region, the first-2-th region being adjacent to a center of the capacitor body and including a conductive resin, and the first-1-th region being adjacent to one end of the capacitor body and including a high melting point solder; and a second bonding portion between the second external electrode and the second connection terminal, and including a second-2-th region and a second-1-th region, the second-2-th region being adjacent to the center of the capacitor body and the second-1-th region being adjacent to the other end of the capacitor body.

Abstract: A multilayer electronic component includes a body including a dielectric layer and internal electrodes disposed alternately with the dielectric layer in a first direction; a first side margin portion and a second side margin portion disposed on opposing side surfaces of the body; a first external electrode and a second external electrode disposed on opposing end surfaces of the body. When an average size of the first side margin portion is defined as W1, an average size of the second side margin portion is defined as W2, and an average size between external surfaces of the first and second side margin portions is defined as W0, (W1+W2)/W0<0.20 is satisfied, and when an average thickness of the dielectric layer is defined as td and an average thickness of the internal electrode is defined as te, te>td is satisfied.

Abstract: An electronic component is disclosed. The electronic component includes: a capacitor body; first and second external electrodes on a mounting surface of the capacitor body; first and second connection terminals respectively connected to the first and second external electrodes; a first bonding portion between the first external electrode and the first connection terminal, and including a first-2-th region and a first-1-th region, the first-2-th region being adjacent to a center of the capacitor body and including a conductive resin, and the first-1-th region being adjacent to one end of the capacitor body and including a high melting point solder; and a second bonding portion between the second external electrode and the second connection terminal, and including a second-2-th region and a second-1-th region, the second-2-th region being adjacent to the center of the capacitor body and the second-1-th region being adjacent to the other end of the capacitor body.

Abstract: A multi-layer chip capacitor includes a capacitor body; first and second internal electrodes alternately arranged therein and separated by dielectric layers, each of the internal electrodes having at least one opening formed at one or more sides thereof; first and second conductive vias passing through the openings and electrically connected to the first and second internal electrodes, respectively; first and second terminal electrodes of opposite polarities formed on one or more side faces of the capacitor body; and first and second lowermost electrode patterns being coplanar, each pattern including a via contact portion and a lead portion extending therefrom. The first and second lowermost electrode patterns are connected to the first and second terminal electrodes, respectively, through the respective lead portions of the lowermost patterns.