Patents by Inventor Kyongmin MIN

Kyongmin MIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11176457
    Abstract: A method of generating a 3D microstructure using a neural network includes configuring an initial 3D microstructure; obtaining a plurality of cross-sectional images by disassembling the initial 3D microstructure in at least one direction of the initial 3D microstructure; obtaining first output feature maps with respect to at least one layer that constitutes the neural network by inputting each of the cross-sectional images to the neural network; obtaining second output feature maps with respect to at least one layer by inputting a 2D original image to the neural network; generating a 3D gradient by applying a loss value to a back-propagation algorithm after calculating the loss value by comparing the first output feature maps with the second output feature maps; and generating a final 3D microstructure based on the 2D original image by reflecting the 3D gradient to the initial 3D microstructure.
    Type: Grant
    Filed: October 4, 2019
    Date of Patent: November 16, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seungwoo Seo, Kyongmin Min, Eunseog Cho
  • Publication number: 20200134465
    Abstract: A method of generating a 3D microstructure using a neural network includes configuring an initial 3D microstructure; obtaining a plurality of cross-sectional images by disassembling the initial 3D microstructure in at least one direction of the initial 3D microstructure; obtaining first output feature maps with respect to at least one layer that constitutes the neural network by inputting each of the cross-sectional images to the neural network; obtaining second output feature maps with respect to at least one layer by inputting a 2D original image to the neural network; generating a 3D gradient by applying a loss value to a back-propagation algorithm after calculating the loss value by comparing the first output feature maps with the second output feature maps; and generating a final 3D microstructure based on the 2D original image by reflecting the 3D gradient to the initial 3D microstructure.
    Type: Application
    Filed: October 4, 2019
    Publication date: April 30, 2020
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seungwoo SEO, Kyongmin MIN, Eunseog CHO