Patents by Inventor Kyoo-Sik Kang

Kyoo-Sik Kang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110038135
    Abstract: Provided is a metal frame for an electronic part and capable of minimizing defects such as an electric short circuit caused by whiskers. The metal frame may include a lead unit electrically connected to an electronic device, and the lead unit may include a first metal layer that contains copper (Cu) as a main component and further contains boron (B) or beryllium (Be).
    Type: Application
    Filed: March 26, 2009
    Publication date: February 17, 2011
    Applicant: ILJIN COPPER FOIL CO., LTD.
    Inventors: Dong Nyung Lee, Sang Beom Kim, Kyoo Sik Kang, Su Chul Im
  • Publication number: 20100092335
    Abstract: The present invention is provided to prevent the generation of whiskers via a lead (Pb)-free solder alloy. To achieve this objective, the present invention provides a Pb-free solder alloy including tin (Sn) as a first element and either boron (B) or beryllium (Be) as a second element.
    Type: Application
    Filed: December 28, 2007
    Publication date: April 15, 2010
    Applicant: ILJIN COPPER FOIL CO., LTD.
    Inventors: Dong-Nyung Lee, Sang-Beom Kim, Kyoo-Sik Kang
  • Publication number: 20100038255
    Abstract: The object of the present invention is to prevent generation of whisker in a Pb-free plating layer. Provided is a Pb-free Sn—B plating solution containing tin sulfate, which is a source of Sn ions, and dimethyl amine borane or trimethyl amine borane, which is a source of B ions.
    Type: Application
    Filed: December 28, 2007
    Publication date: February 18, 2010
    Applicant: ILJIN COPPER FOIL CO., LTD.
    Inventors: Dong-Nyung Lee, Sang-Beom Kim, Kyoo-Sik Kang