Patents by Inventor Kyoso MASUDA

Kyoso MASUDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220005636
    Abstract: A soft magnetic powder, including an Fe alloy, and containing 0.1 to 15 mass % of Si, wherein a ratio (Si/Fe) of an atomic concentration of Si and an atomic concentration of Fe is from 4.5 to 30 at a depth of 1 nm from a particle surface of the soft magnetic powder.
    Type: Application
    Filed: October 30, 2019
    Publication date: January 6, 2022
    Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Takeshi KAWAUCHI, Kyoso MASUDA, Kenichi INOUE
  • Patent number: 11041229
    Abstract: An object of the present invention is to provide metal powder that can be used to form an external electrode, which is excellent in solder wettability and solder leach resistance while having a layer structure with fewer layers than in the related art and, furthermore, is excellent in electrical conductivity. This silver-coated alloy powder comprises a coating layer on a surface of an alloy core particle containing copper, nickel, zinc, and inevitable impurities, the coating layer containing silver.
    Type: Grant
    Filed: August 31, 2017
    Date of Patent: June 22, 2021
    Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Kyoso Masuda, Kenichi Inoue, Yuki Kaneshiro, Atsushi Ebara, Yoshiyuki Michiaki, Kozo Ogi, Takahiro Yamada, Masahiro Yoshida
  • Patent number: 10773311
    Abstract: An object of the present invention is to provide a phosphorus-containing copper powder with good volume resistivity and a small carbon content by suppressing an oxygen content to a relatively low value even if a particle size is made small, and a method for producing the same. In the phosphorus-containing copper powder containing phosphorus, a ratio of an oxygen content (wt. %) to a BET specific surface area (m2/g) (oxygen content/BET specific surface area) is 0.90 wt. %·g/m2 or less, a divalent copper compound is present on a surface of particles constituting the phosphorus-containing copper powder, a carbon content is 0.10 wt. % or less, and D50 is 7.11 ?m or less.
    Type: Grant
    Filed: August 18, 2016
    Date of Patent: September 15, 2020
    Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Kenichi Inoue, Atsushi Ebara, Masahiro Yoshida, Kyoso Masuda, Takahiro Yamada, Shinichi Uchiyama
  • Publication number: 20190194778
    Abstract: An object of the present invention is to provide metal powder that can be used to form an external electrode, which is excellent in solder wettability and solder leach resistance while having a layer structure with fewer layers than in the related art and, furthermore, is excellent in electrical conductivity. This silver-coated alloy powder comprises a coating layer on a surface of an alloy core particle containing copper, nickel, zinc, and inevitable impurities, the coating layer containing silver.
    Type: Application
    Filed: August 31, 2017
    Publication date: June 27, 2019
    Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Kyoso MASUDA, Kenichi INOUE, Yuki KANESHIRO, Atsushi EBARA, Yoshiyuki MICHIAKI, Kozo OGI, Takahiro YAMADA, Masahiro YOSHIDA
  • Publication number: 20180243831
    Abstract: An object of the present invention is to provide a phosphorus-containing copper powder with good volume resistivity and a small carbon content by suppressing an oxygen content to a relatively low value even if a particle size is made small, and a method for producing the same. In the phosphorus-containing copper powder containing phosphorus, a ratio of an oxygen content (wt. %) to a BET specific surface area (m2/g) (oxygen content/BET specific surface area) is 0.90 wt. %·g/m2 or less, a divalent copper compound is present on a surface of particles constituting the phosphorus-containing copper powder, a carbon content is 0.10 wt. % or less, and D50 is 7.11 ?m or less.
    Type: Application
    Filed: August 18, 2016
    Publication date: August 30, 2018
    Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Kenichi INOUE, Atsushi EBARA, Masahiro YOSHIDA, Kyoso MASUDA, Takahiro YAMADA, Shinichi UCHIYAMA