Abstract: One aspect of the present invention relates to a method for manufacturing a substrate with a conductive pattern, the method including: a base forming step of forming a plating base in a desired pattern on at least a portion of one surface of a stretchable substrate, wherein the stretchable substrate has a tensile modulus at 20° C. of 0.1 MPa or more and 500 MPa or less, an elongation at break of 100% or more and 1000% or less, and a storage modulus at 250° C. of 0.1 MPa or more; a bending step of bending the stretchable substrate; and a conductive pattern forming step of plating the plating base after performing the bending step to form a conductive pattern on the stretchable substrate.

Abstract: A method for manufacturing a stretchable circuit board includes preparing a laminate in which a metal layer and a first stretchable insulating layer are in contact with each other and a peel strength between the metal layer and the first stretchable insulating layer is 0.5 N/mm or more and 3.0 N/mm or less, a second stretchable insulating layer, and a fluid; forming a via leading from a first surface, in contact with the metal layer, of the first stretchable insulating layer to a second surface opposite to the first surface; filling the fluid in the via; laminating the second stretchable insulating layer on the second surface to seal the via; and patterning the metal layer.

Abstract: An elastic resin sheet that is a resin sheet formed using a resin composition containing a thermosetting resin and a curing agent, in which when a maximum height of a surface roughness on a first surface of the resin sheet is Rz1 (?m), a maximum height of a surface roughness on a second surface facing the first surface is Rz2 (?m), and a thickness is t (?m), the Rz1, the Rz2, and the thickness t (?m) satisfy relation of the following Formula (1): (Rz1+Rz2)/t?0.5 (1), the elastic resin sheet includes a light-diffusing portion having irregularities with an arithmetic mean roughness Ra of 0.3 ?m or more and 5.0 ?m or less on at least one of the first surface and the second surface, and the elastic resin sheet has an initial tensile modulus of 0.5 MPa or more and 500 MPa or less.

Abstract: A stretchable laminate to be fixed to a fabric includes a stretchable circuit board including a stretchable insulating layer having an elongation rate of 10% or more, a fabric base material, and an adhesive layer that bonds the stretchable circuit board and the fabric base material together.

Abstract: An aspect of the present invention relates to a resin composition containing an acrylic resin and a curing agent, in which the acrylic resin contains a polymerization unit (A) of a (meth)acrylate having an epoxy group, a polymerization unit (B) of a (meth)acrylate having a cyano group, and a polymerization unit (C) of a (meth)acrylate having an isobornyl group, a weight average molecular weight of the acrylic resin is 50,000 or more and 3,000,000 or less, and a storage modulus of a cured product of the resin composition at 200° C. is 0.1 MPa or more and 3.5 MPa or less.

Abstract: An aspect of the present invention relates to a conductive resin composition containing an epoxy resin, a curing agent, and a conductive powder, in which a loss modulus of a dried product or semi-cured product of the conductive resin composition at 170° C. is 0.1 MPa or more and 15 MPa or less.

Abstract: A stretchable laminate to be fixed to a fabric includes a stretchable circuit board including a stretchable insulating layer having an elongation rate of 10% or more, a fabric base material, and an adhesive layer that bonds the stretchable circuit board and the fabric base material together.

Abstract: A fiber sheet includes: a resin layer containing a thermosetting resin; and a fiber layer, wherein the fiber sheet is stretchable by 1% or more, and an initial tensile elastic modulus of the fiber sheet is 1 MPa or more and 1 GPa or less.

Abstract: One aspect of the present invention relates to a resin composition containing a polyrotaxane (A), an epoxy resin (B), and a curing agent (C), in which the curing agent (C) contains an acid anhydride (C-1) in an amount of 0.1 parts by mass or more and less than 10 parts by mass based on a total of 100 parts by mass of the polyrotaxane (A), the epoxy resin (B), and the curing agent (C).

Abstract: Provided is a stretchable circuit board including a stretchable insulating layer, and a wiring, in which the wiring is formed of a combination of a metal wiring portion that forms a main portion of the wiring, and a conductive stretchable portion disposed ancillary to the metal wiring portion.

Abstract: The present invention provides a raw material for bulk drugs and a pharmaceutical additive which provide excellent formulation stability and excellent over-time stability of drug efficacy when used to modify a bulk drug, a polypeptide, a bioactive protein, an enzyme, and the like. The present invention relates to a raw material for bulk drugs or a pharmaceutical additive, containing: a polyether composition (A) represented by formula (1), wherein the polyether composition (A) has a unimodal molecular weight distribution, the polyether composition (A) has a ratio (Mw/Mn) of the weight average molecular weight (Mw) to the number average molecular weight (Mn) of 1.

Abstract: The present invention provides a raw material for bulk drugs and a pharmaceutical additive which provide excellent formulation stability and excellent over-time stability of drug efficacy when used to modify a bulk drug, a polypeptide, a bioactive protein, an enzyme, and the like. The present invention relates to a raw material for bulk drugs or a pharmaceutical additive, containing: a polyether composition (A) represented by formula (1), wherein the polyether composition (A) has a unimodal molecular weight distribution, the polyether composition (A) has a ratio (Mw/Mn) of the weight average molecular weight (Mw) to the number average molecular weight (Mn) of 1.

Abstract: One aspect of the present invention relates to a resin composition containing a polyrotaxane (A), an epoxy resin (B), and a curing agent (C), in which the curing agent (C) contains an acid anhydride (C-1) in an amount of 0.1 parts by mass or more and less than 10 parts by mass based on a total of 100 parts by mass of the polyrotaxane (A), the epoxy resin (B), and the curing agent (C).