Abstract: [Object] To provide an electrochemical device that permits a thin package, as well as securely prevents an electrolyte or gas in an internal space from leaking outside even when temperature rise occurs in the electrochemical device during the process where the electrochemical device is reflow soldered to a circuit board or encapsulated into an IC card. [Solution] In the electrochemical device RB1, the main body of the package PA includes first cover plate 15, first terminal plate 12, frame plate 14, second terminal plate 13, and second cover plate 16 stacked in this order and bonded at the facing surfaces. The electric storage element SD is encapsulated in internal space IS formed, between the cover plates 15, 16, by the through holes 12a1, 13a1 in the frame sections 12a, 13a of the terminal plates 12, 13 and the through hole 14a in the frame plate 14.

Abstract: Disclosed is an electrochemical capacitor that can be reflow soldered, and wherein film package is used on the capacitor body. The container (20) of the electrochemical capacitor (ECC) stores the film package (11) of the capacitor body (10) within a storage space (SR) such that sealing sections (11a-11c) do not contact the inner surface of the storage space (SR). Inner material (30), which cover the sealing sections (11a-11c) and rear edge of the film package 11 and are adhered to the inner surface of the storage space (SR), affixing the film package (11) within the storage space (SR), are provided in a rectangular framework to the regions in the storage space (SR) of the container (20) that correspond to said sealing sections (11a-11c) and rear edge.

Abstract: An electrochemical device which is free from deterioration of properties due to a process of joining a rigid case and a conductive lid is provided. A welded part PP of a conductive lid 12 and a welded frame member 11d are joined each other by laser welding. A weld bead for joining the welded part PP and the welded frame member 11d is not exposed to an internal space of a rigid package 10; therefore, fused material, the coagulum thereof, or the like created during laser welding are prevented from entering into the internal space of the rigid package 10.

Abstract: An electrochemical device which can keep a conductive lid properly joined to a rigid case is provided. A conductive lid 12 has a reinforcement part RP inside of a ring-shaped welded part PP. The welded part PP of the conductive lid 12 and the welded frame member 11d of a rigid case 11 are joined to each other by welding. Even if stress of risen internal pressure due to reflow soldering or the like concentrates at the interface between the rigid case 11 and the conductive lid 12, the reinforcement part RP relieves the stress.

Abstract: [Object] To provide an electrochemical device that permits a thin package, as well as securely prevents an electrolyte or gas in an internal space from leaking outside even when temperature rise occurs in the electrochemical device during the process where the electrochemical device is reflow soldered to a circuit board or encapsulated into an IC card. [Solution] In the electrochemical device RB1, the main body of the package PA includes first cover plate 15, first terminal plate 12, frame plate 14, second terminal plate 13, and second cover plate 16 stacked in this order and bonded at the facing surfaces. The electric storage element SD is encapsulated in internal space IS formed, between the cover plates 15, 16, by the through holes 12a1, 13a1 in the frame sections 12a, 13a of the terminal plates 12, 13 and the through hole 14a in the frame plate 14.

Abstract: Disclosed is an electrochemical capacitor that can be reflow soldered, and wherein film package is used on the capacitor body. The container (20) of the electrochemical capacitor (ECC) stores the film package (11) of the capacitor body (10) within a storage space (SR) such that sealing sections (11a-11c) do not contact the inner surface of the storage space (SR). Inner material (30), which cover the sealing sections (11a-11c) and rear edge of the film package 11 and are adhered to the inner surface of the storage space (SR), affixing the film package (11) within the storage space (SR), are provided in a rectangular framework to the regions in the storage space (SR) of the container (20) that correspond to said sealing sections (11a-11c) and rear edge.