Patents by Inventor Kyouichirou Nakatsugi
Kyouichirou Nakatsugi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20200194937Abstract: An inner conductor terminal for a shield connector includes a terminal connecting portion to be connected to a counterpart terminal. A base plate is provided continuously with the terminal connecting portion and has a soldering surface on which a conductor of a shield cable is placed and soldered. The shield cable includes the conductor and an insulation coating covering an outer periphery of the conductor. The conductor is exposed at a terminal portion of the shield cable. A conductor holding portion is arranged opposite to the conductor so as to be contactable with the conductor placed on the soldering surface in a direction where the conductor is separated from the soldering surface.Type: ApplicationFiled: March 26, 2018Publication date: June 18, 2020Inventors: Hiroyoshi MAESOBA, Toshifumi ICHIO, Kyouichirou NAKATSUGI
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Patent number: 9226406Abstract: By connecting together connecting electrodes having an organic film serving as an oxidation-preventing film using a conductive adhesive, the manufacturing process can be simplified, and a highly reliable connection structure can be constructed at low cost. An electrode connection method, in which a first connecting electrode 2 and a second connecting electrode 10 are connected together through a conductive adhesive 9 that is interposed between the electrodes, includes an organic film formation step in which an organic film 6 is formed on at least a surface of the first connecting electrode, and an electrode connection step in which the first connecting electrode and the second connecting electrode are connected together through the conductive adhesive. In the electrode connection step, by allowing an organic film decomposing component mixed in the conductive adhesive to act on the organic film, the organic film is decomposed, and thus connection between the connecting electrodes is performed.Type: GrantFiled: June 4, 2010Date of Patent: December 29, 2015Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Masamichi Yamamoto, Kyouichirou Nakatsugi, Yasuhiro Okuda
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Patent number: 8766437Abstract: There is provided an electrode structure to be electrically connected to a connection conductor by being bonded thereto with an anisotropic conductive adhesive mainly composed of a thermosetting resin, the electrode structure including an electrode for connection using an adhesive, the electrode being arranged on a base material, and an organic film serving as an oxidation preventing film configured to cover a surface of the electrode for connection using an adhesive, in which the organic film has a higher decomposition temperature than the maximum temperature of heat treatment to be performed. A wiring body and a connecting structure using an adhesive are also provided.Type: GrantFiled: April 13, 2010Date of Patent: July 1, 2014Assignees: Sumitomo Electric Industries, Ltd., Sumitomo Electric Printed Circuits, Inc.Inventors: Masamichi Yamamoto, Kyouichirou Nakatsugi, Takashi Yamaguchi, Shigeki Kawakami, Michihiro Kimura
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Patent number: 8507803Abstract: The invention offers a board-connecting structure that can provide electrodes with a fine pitch and that can combine the insulating property and the connection reliability. The structure of connecting printed wiring boards 10 and 20 electrically connects a plurality of first electrodes 12 and 13 provided to be adjacent to each other on a first board 11 with a plurality of second electrodes 22 and 23 provided to be adjacent to each other on a second board 21 through an adhesive 30 that contains conductive particles 31 and that has anisotropic conductivity. By heating and pressing the adhesive placed between the mutually facing first electrode 12 and second electrode 22 and between the mutually facing first electrode 13 and second electrode 23, an adhesive layer 30a is formed between the first board 11 and the second board 21 and in the adhesive layer 30a, a cavity portion 33 is formed between the first electrodes 12 and 13 and between the second electrodes 22 and 23.Type: GrantFiled: March 12, 2010Date of Patent: August 13, 2013Assignee: Sumitomo Electric Industries, Ltd.Inventors: Masamichi Yamamoto, Kyouichirou Nakatsugi, Ayao Kariya, Katsuhiro Satou, Yasuhiro Okuda
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Patent number: 8470438Abstract: There is provided a connecting structure with high reliability produced at low cost through the production process simplified by connecting connection electrodes, each including an organic film as an oxidation preventing film, to each other using a conductive adhesive. An electrode-connecting structure in which a first connection electrode 2 and a second connection electrode 10 are connected to each other with a conductive adhesive layer 9 therebetween includes organic films 6 and 11 formed on at least the first connection electrode and conductive particles 8 contained so that major axes of the particles are oriented in a thickness direction of the conductive adhesive layer and the average length of the major axes is larger than the total thickness of at least the organic films and the conductive adhesive layer, wherein the conductive particles pierce the organic films and contact the first connection electrode and the second connection electrode.Type: GrantFiled: June 4, 2010Date of Patent: June 25, 2013Assignee: Sumitomo Electric Industries, Ltd.Inventors: Masamichi Yamamoto, Kyouichirou Nakatsugi, Yasuhiro Okuda
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Publication number: 20120300426Abstract: There are provided a connection structure of printed circuit boards, and so forth, the connection structure including a first printed circuit board, a second printed circuit board located above the first printed circuit board, and an anisotropic conductive adhesive configured to establish a conductive connection between a conductor of the first printed circuit board and a conductor of the second printed circuit board, in which the anisotropic conductive adhesive contains a conductive filler, and in which the conductive filler is formed of crystallized metal-particle wires produced by allowing metal particles to crystallize and grow linearly. It is thus possible to easily achieve sufficiently high connection strength while a flying lead of one printed circuit board is electrically connected to a conductive lead (substrate pad) of the other printed circuit board.Type: ApplicationFiled: September 2, 2010Publication date: November 29, 2012Inventors: Masamichi Yamamoto, Kyouichirou Nakatsugi, Kou Noguchi, Tetsuga Shimomura
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Patent number: 8235603Abstract: An object is to obtain a module in which an optical fiber can be inserted after a ferrule has been mounted on a circuit board. There is provided an optical module (100) in which at least a ferrule (33) and an electric component (57) are mounted on a circuit board (35) on which external electrodes (63) have been mounted; a fiber through-hole is formed in the ferrule (33) in a position in which the optoelectric conversion device (31) is mounted on one end surface and that corresponds to an active layer of an optoelectric conversion device (31); and the optoelectric conversion device (31) of the ferrule (33) is electrically connected to the electric component (57). In the ferrule (33), an opening in the one end face of the fiber through-hole that faces the optoelectric conversion device (31) is blocked by a transparent substance (61), and a portion that excludes the fiber through-hole at the other end surface is are monolithically covered with a molding resin (55).Type: GrantFiled: March 19, 2009Date of Patent: August 7, 2012Assignee: Sumitomo Electric Industries, Ltd.Inventors: Mitsuaki Tamura, Wataru Sakurai, Hideki Matsubara, Hideaki Toshioka, Kyouichirou Nakatsugi, Masahiro Adachi, Yasuhiro Okuda
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Patent number: 8231766Abstract: A novel board for printed wiring comprising a fine conductor wiring having a clear and favorable boundary line and fabricated by an ordinal printing method such as screen printing, a printed wiring board using the same, and methods for manufacturing them. A board for printed wiring and a method for manufacturing the same are characterized in that the surface of a board is subjected to one of the surface treatments: (a) roughening, (2) plasma treatment, (3) roughening and then plasma treatment, and (4) roughening and then forming of a metal film coating by sputtering. A printed wiring board and a method for manufacturing the same is characterize in that a conductor wiring is fabricated by printing using a conductive paste containing metal particles the average particle diameter of which is 4 ?m or less and the maximum particle diameter of which is 15 ?m or less.Type: GrantFiled: October 25, 2007Date of Patent: July 31, 2012Assignee: Sumitomo Electric Industries, Ltd.Inventors: Noriki Hayashi, Yoshio Oka, Masahiko Kanda, Narito Yagi, Kenji Miyazaki, Kyouichirou Nakatsugi
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Publication number: 20120085580Abstract: By connecting together connecting electrodes having an organic film serving as an oxidation-preventing film using a conductive adhesive, the manufacturing process can be simplified, and a highly reliable connection structure can be constructed at low cost. An electrode connection method, in which a first connecting electrode 2 and a second connecting electrode 10 are connected together through a conductive adhesive 9 that is interposed between the electrodes, includes an organic film formation step in which an organic film 6 is formed on at least a surface of the first connecting electrode, and an electrode connection step in which the first connecting electrode and the second connecting electrode are connected together through the conductive adhesive. In the electrode connection step, by allowing an organic film decomposing component mixed in the conductive adhesive to act on the organic film, the organic film is decomposed, and thus connection between the connecting electrodes is performed.Type: ApplicationFiled: June 4, 2010Publication date: April 12, 2012Inventors: Masamichi Yamamoto, Kyouichirou Nakatsugi, Yasuhiro Okuda
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Publication number: 20120067619Abstract: [Object] Provided are a connection method and an electronic device, in which the manufacturing process can be simplified, and a connection structure using an adhesive can be produced at low cost. [Solution] A connection method according to the present invention includes a step (a1) of preparing base materials 10 and 21 each including an electrode for connection using an adhesive, a step (b1) of covering electrodes 12 and 22 for connection using an adhesive with organic films 15 configured to prevent oxidation, the electrodes 12 and 22 being located on the base materials, a step (c1) of removing or thinning the organic films, and after the step (c1), a step (d1) of bonding the electrodes for connection using an adhesive to each other with an adhesive 30 mainly containing a thermosetting resin to establish electrical connection.Type: ApplicationFiled: May 18, 2010Publication date: March 22, 2012Inventors: Masamichi Yamamoto, Kyouichirou Nakatsugi, Takashi Yamaguchi, Shigeki Kawakami, Michihiro Kimura
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Publication number: 20110250395Abstract: There is provided a connecting structure with high reliability produced at low cost through the production process simplified by connecting connection electrodes, each including an organic film as an oxidation preventing film, to each other using a conductive adhesive. An electrode-connecting structure in which a first connection electrode 2 and a second connection electrode 10 are connected to each other with a conductive adhesive layer 9 therebetween includes organic films 6 and 11 formed on at least the first connection electrode and conductive particles 8 contained so that major axes of the particles are oriented in a thickness direction of the conductive adhesive layer and the average length of the major axes is larger than the total thickness of at least the organic films and the conductive adhesive layer, wherein the conductive particles pierce the organic films and contact the first connection electrode and the second connection electrode.Type: ApplicationFiled: June 4, 2010Publication date: October 13, 2011Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Masamichi Yamamoto, Kyouichirou Nakatsugi, Yasuhiro Okuda
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Publication number: 20110147048Abstract: There is provided an electrode structure to be electrically connected to a connection conductor by being bonded thereto with an anisotropic conductive adhesive mainly composed of a thermosetting resin, the electrode structure including an electrode for connection using an adhesive, the electrode being arranged on a base material, and an organic film serving as an oxidation preventing film configured to cover a surface of the electrode for connection using an adhesive, in which the organic film has a higher decomposition temperature than the maximum temperature of heat treatment to be performed. A wiring body and a connecting structure using an adhesive are also provided.Type: ApplicationFiled: April 13, 2010Publication date: June 23, 2011Inventors: Masamichi Yamamoto, Kyouichirou Nakatsugi, Takashi Yamaguchi, Shigeki Kawakami, Michihiro Kimura
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Publication number: 20100230141Abstract: The invention offers a board-connecting structure that can provide electrodes with a fine pitch and that can combine the insulating property and the connection reliability. The structure of connecting printed wiring boards 10 and 20 electrically connects a plurality of first electrodes 12 and 13 provided to be adjacent to each other on a first board 11 with a plurality of second electrodes 22 and 23 provided to be adjacent to each other on a second board 21 through an adhesive 30 that contains conductive particles 31 and that has anisotropic conductivity. By heating and pressing the adhesive placed between the mutually facing first electrode 12 and second electrode 22 and between the mutually facing first electrode 13 and second electrode 23, an adhesive layer 30a is formed between the first board 11 and the second board 21 and in the adhesive layer 30a, a cavity portion 33 is formed between the first electrodes 12 and 13 and between the second electrodes 22 and 23.Type: ApplicationFiled: March 12, 2010Publication date: September 16, 2010Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Masamichi Yamamoto, Kyouichirou Nakatsugi, Ayao Kariya, Katsuhiro Satou, Yasuhiro Okuda
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Publication number: 20100220963Abstract: An object is to obtain a module in which an optical fiber can be inserted after a ferrule has been mounted on a circuit board. There is provided an optical module (100) in which at least a ferrule (33) and an electric component (57) are mounted on a circuit board (35) on which external electrodes (63) have been mounted; a fiber through-hole is formed in the ferrule (33) in a position in which the optoelectric conversion device (31) is mounted on one end surface and that corresponds to an active layer of an optoelectric conversion device (31); and the optoelectric conversion device (31) of the ferrule (33) is electrically connected to the electric component (57). In the ferrule (33), an opening in the one end face of the fiber through-hole that faces the optoelectric conversion device (31) is blocked by a transparent substance (61), and a portion that excludes the fiber through-hole at the other end surface is are monolithically covered with a molding resin (55).Type: ApplicationFiled: March 19, 2009Publication date: September 2, 2010Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Mitsuaki Tamura, Wataru Sakurai, Hideki Matsubara, Hideaki Toshioka, Kyouichirou Nakatsugi, Masahiro Adachi, Yasuhiro Okuda
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Publication number: 20080063792Abstract: A novel board for printed wiring comprising a fine conductor wiring having a clear and favorable boundary line and fabricated by an ordinal printing method such as screen printing, a printed wiring board using the same, and methods for manufacturing them. A board for printed wiring and a method for manufacturing the same are characterized in that the surface of a board is subjected to one of the surface treatments: (a) roughening, (2) plasma treatment, (3) roughening and then plasma treatment, and (4) roughening and then forming of a metal film coating by sputtering. A printed wiring board and a method for manufacturing the same is characterize in that a conductor wiring is fabricated by printing using a conductive paste containing metal particles the average particle diameter of which is 4 ?m or less and the maximum particle diameter of which is 15 ?m or less.Type: ApplicationFiled: October 25, 2007Publication date: March 13, 2008Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Noriki Hayashi, Yoshio Oka, Masahiko Kanda, Narito Yagi, Kenji Miyazaki, Kyouichirou Nakatsugi
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Publication number: 20050236182Abstract: A novel board for printed wiring comprising a fine conductor wiring having a clear and favorable boundary line and fabricated by an ordinal printing method such as screen printing, a printed wiring board using the same, and methods for manufacturing them. A board for printed wiring and a method for manufacturing the same are characterized in that the surface of a board is subjected to one of the surface treatments: (a) roughening, (2) plasma treatment, (3) roughening and then plasma treatment, and (4) roughening and then forming of a metal film coating by sputtering. A printed wiring board and a method for manufacturing the same is characterize in that a conductor wiring is fabricated by printing using a conductive paste containing metal particles the average particle diameter of which is 4 ?m or less and the maximum particle diameter of which is 15 ?m or less.Type: ApplicationFiled: June 2, 2003Publication date: October 27, 2005Inventors: Noriki Hayashi, Yoshio Oka, Masahiko Kanda, Narito Yagi, Kenji Miyazaki, Kyouichirou Nakatsugi