Abstract: A sub-mount, an LD bar and a light guide duct are mounted on an LD package main body of a semiconductor laser, and an outgoing section of the LD bar is inserted into the light guide duct. A gold metallized insulating plate is fused on one side of the LD package main body, and the LD bar and the gold metallizing are wire-bonded. The light guide duct transmits the excitation light directly up to a laser medium, and a reflector surrounds the periphery of the laser medium. Upon flowing of a current from the LD package main body to the cathode electrode, the LD excitation light is emitted and the laser medium is excited, to thereby make laser oscillation possible. With the above structure, there is provided an LD excitation solid-state laser device which is easy in assembling, low in the costs, high in efficiency and high in reliability.