Patents by Inventor Kyoung Bo Han
Kyoung Bo Han has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9373607Abstract: Provided is a light emitting diode package including: a molded portion having a housing; a plurality of light emitting chips housed in the housing; a plurality of main lead portions on which the plurality of light emitting chips is mounted, respectively; at least one sub-lead portion formed spaced from the main lead portions and electrically connected to at least any one of the plurality of main lead portions and the plurality of light emitting chips with wires for electrically connecting the plurality of light emitting chips each other; first space maintaining portions formed such that the plurality of light emitting chips respectively on the plurality of main lead portions are opposite to one another with one of the first space maintaining portions disposed therebetween; and second space maintaining portions formed on both sides of each of the first space maintaining portions.Type: GrantFiled: November 13, 2014Date of Patent: June 21, 2016Assignee: LG Display Co., Ltd.Inventors: Kyoung-Bo Han, Seung-Ho Jang
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Publication number: 20150069428Abstract: Provided is a light emitting diode package including: a molded portion having a housing; a plurality of light emitting chips housed in the housing; a plurality of main lead portions on which the plurality of light emitting chips is mounted, respectively; at least one sub-lead portion formed spaced from the main lead portions and electrically connected to at least any one of the plurality of main lead portions and the plurality of light emitting chips with wires for electrically connecting the plurality of light emitting chips each other; first space maintaining portions formed such that the plurality of light emitting chips respectively on the plurality of main lead portions are opposite to one another with one of the first space maintaining portions disposed therebetween; and second space maintaining portions formed on both sides of each of the first space maintaining portions.Type: ApplicationFiled: November 13, 2014Publication date: March 12, 2015Applicant: LG DISPLAY CO., LTD.Inventors: Kyoung-Bo HAN, Seung-Ho JANG
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Patent number: 8895954Abstract: The present invention relates to a light emitting diode package which can reduce a wire length, and can improve heat and light resistance. The light emitting diode package includes a molded portion having a housing, a plurality of light emitting chips housed in the housing, a plurality of main lead portions having the plurality of light emitting chips mounted thereto respectively, at least one sub-lead portion formed spaced from the main lead portions and electrically connected to at least any one of the plurality of main lead portions and the plurality of light emitting chips with a wire for electrically connecting the plurality of light emitting chips each other.Type: GrantFiled: December 19, 2011Date of Patent: November 25, 2014Assignee: LG Display Co., Ltd.Inventors: Kyoung-Bo Han, Seung-Ho Jang
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Patent number: 8709844Abstract: A light emitting diode (LED) package and a method of manufacturing a LED package is provided. The LED package includes a case having first and second lead frames disposed through the case; an LED chip disposed on the case, the LED chip having first and second electrodes directly connected to the first and second lead frames through a eutectic bond, respectively; and a lens disposed over the case covering the LED chip.Type: GrantFiled: December 20, 2010Date of Patent: April 29, 2014Assignee: LG Display Co., Ltd.Inventors: Sin-Ho Kang, Tae-Hun Kim, Seung-Ho Jang, Kyoung-Bo Han, Jae-yong Choi
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Publication number: 20130043494Abstract: The present invention relates to a light emitting diode package which can reduce a wire length, and can improve heat and light resistance. The light emitting diode package includes a molded portion having a housing, a plurality of light emitting chips housed in the housing, a plurality of main lead portions having the plurality of light emitting chips mounted thereto respectively, at least one sub-lead portion formed spaced from the main lead portions and electrically connected to at least any one of the plurality of main lead portions and the plurality of light emitting chips with a wire for electrically connecting the plurality of light emitting chips each other.Type: ApplicationFiled: December 19, 2011Publication date: February 21, 2013Inventors: Kyoung-Bo HAN, Seung-Ho Jang
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Patent number: 8373180Abstract: A side-view type light emitting diode package for emitting light, emitted from a light emitting diode chip, toward a side surface is disclosed. The side-view type light emitting diode package comprises a package body having an opening portion for exposing the light emitting diode chip in a light emitting direction; and a light-transmittable resin covering the light emitting diode chip, wherein at least a portion of an inner wall of the opening portion is formed with a step projection for partitioning the opening portion into upper and lower sections, and the lower section of the opening portion below the step projection is filled with the light-transmittable resin. Accordingly, the light-transmittable resin with the convex lens shape may be easily formed, so that the light emission efficiency thereof can be improved.Type: GrantFiled: September 21, 2007Date of Patent: February 12, 2013Assignee: Seoul Semiconductor Co., Ltd.Inventors: Hwa Ja Kim, Nam Young Kim, Myung Hee Lee, Kyoung Bo Han, Tae Kwang Kim, Ji Seop So
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Patent number: 7999280Abstract: Disclosed is a light emitting diode (LED) package employing a lead terminal with a reflecting surface. The package includes first and second lead terminals that are spaced apart from each other. The first lead terminal has a lower portion with an LED chip mounting area, and at least one reflecting surface formed by being bent from the lower portion. Meanwhile, a package body supports the first and second lead terminals and forms a cavity through which the LED chip mounting area and the reflecting surface of the first lead terminal and a part of the second lead terminal are exposed. The first and second lead terminals extend outside of the package body. Accordingly, light emitted from an LED chip can be reflected on the reflecting surface with high reflectivity, so that the optical efficiency of the package can be improved.Type: GrantFiled: July 19, 2007Date of Patent: August 16, 2011Assignee: Seoul Semiconductor Co., Ltd.Inventors: Hwa Ja Kim, Nam Young Kim, Myung Hee Lee, Kyoung Bo Han, Tae Kwang Kim, Ji Seop So
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Publication number: 20110147779Abstract: A light emitting diode (LED) package and a method of manufacturing a LED package is provided. The LED package includes a case having first and second lead frames disposed through the case; an LED chip disposed on the case, the LED chip having first and second electrodes directly connected to the first and second lead frames through a eutectic bond, respectively; and a lens disposed over the case covering the LED chip.Type: ApplicationFiled: December 20, 2010Publication date: June 23, 2011Inventors: Sin-Ho KANG, Tae-Hun KIM, Seung-Ho JANG, Kyoung-Bo HAN, Jae-yong CHOI
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Patent number: 7935982Abstract: In a side view type light emitting diode (LED) package, a lead frame portion and lead frame electrical contact portions are exposed outside a package body to serve as an additional heat dissipation path. The side view type LED package includes an LED chip, a package body having a side surface with an opening for receiving the LED chip, and lead frames for applying a current to the LED chip. The lead frames include inner leads electrically connected to the LED chip within the package body; electrical contact lower legs extending from the inner leads to a lower portion of the package body and exposed outside the package body in the vicinity of a lower surface of the package body perpendicular to the side surface; and a heat dissipation means extending, separately from the electrical contact lower legs, from at least one of the inner leads outside the package body.Type: GrantFiled: August 5, 2010Date of Patent: May 3, 2011Assignee: Seoul Semiconductor Co., Ltd.Inventors: Nam Young Kim, Tae Kwang Kim, Kyoung Bo Han, Myung Hee Lee
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Publication number: 20100301376Abstract: In a side view type light emitting diode (LED) package, a lead frame portion and lead frame electrical contact portions are exposed outside a package body to serve as an additional heat dissipation path. The side view type LED package includes an LED chip, a package body having a side surface with an opening for receiving the LED chip, and lead frames for applying a current to the LED chip. The lead frames include inner leads electrically connected to the LED chip within the package body; electrical contact lower legs extending from the inner leads to a lower portion of the package body and exposed outside the package body in the vicinity of a lower surface of the package body perpendicular to the side surface; and a heat dissipation means extending, separately from the electrical contact lower legs, from at least one of the inner leads outside the package body.Type: ApplicationFiled: August 5, 2010Publication date: December 2, 2010Applicant: SEOUL SEMICONDUCTOR CO., LTD.Inventors: Nam Young KIM, Tae Kwang Kim, Kyoung Bo Han, Myung Hee Lee
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Patent number: 7804105Abstract: In a side view type light emitting diode (LED) package, a lead frame portion and lead frame electrical contact portions are exposed outside a package body to serve as an additional heat dissipation path. The side view type LED package includes an LED chip, a package body having a side surface with an opening for receiving the LED chip, and lead frames for applying a current to the LED chip. The lead frames include inner leads electrically connected to the LED chip within the package body; electrical contact lower legs extending from the inner leads to a lower portion of the package body and exposed outside the package body in the vicinity of a lower surface of the package body perpendicular to the side surface; and a heat dissipation means extending, separately from the electrical contact lower legs, from at least one of the inner leads outside the package body.Type: GrantFiled: June 27, 2007Date of Patent: September 28, 2010Assignee: Seoul Semiconductor Co., Ltd.Inventors: Nam Young Kim, Tae Kwang Kim, Kyoung Bo Han, Myung Hee Lee
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Publication number: 20100096653Abstract: A side-view type light emitting diode package for emitting light, emitted from a light emitting diode chip, toward a side surface is disclosed. The side-view type light emitting diode package comprises a package body having an opening portion for exposing the light emitting diode chip in a light emitting direction; and a light-transmittable resin covering the light emitting diode chip, wherein at least a portion of an inner wall of the opening portion is formed with a step projection for partitioning the opening portion into upper and lower sections, and the lower section of the opening portion below the step projection is filled with the light-transmittable resin. Accordingly, the light-transmittable resin with the convex lens shape may be easily formed, so that the light emission efficiency thereof can be improved.Type: ApplicationFiled: September 21, 2007Publication date: April 22, 2010Applicant: Seoul Semiconductor Co. Ltd.Inventors: Hwa Ja Kim, Nam Young Kim, Myung Hee Lee, Kyoung Bo Han, Tae Kwang Kim, Ji Seop So
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Publication number: 20090179219Abstract: In a side view type light emitting diode (LED) package, a lead frame portion and lead frame electrical contact portions are exposed outside a package body to serve as an additional heat dissipation path. The side view type LED package includes an LED chip, a package body having a side surface with an opening for receiving the LED chip, and lead frames for applying a current to the LED chip. The lead frames include inner leads electrically connected to the LED chip within the package body; electrical contact lower legs extending from the inner leads to a lower portion of the package body and exposed outside the package body in the vicinity of a lower surface of the package body perpendicular to the side surface; and a heat dissipation means extending, separately from the electrical contact lower legs, from at least one of the inner leads outside the package body.Type: ApplicationFiled: June 27, 2007Publication date: July 16, 2009Applicant: Seoul Semiconductor Co., Ltd.Inventors: Nam Young Kim, Tae Kwang Kim, Kyoung Bo Han, Myung Hee Lee
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Publication number: 20080048201Abstract: Disclosed is a light emitting diode (LED) package employing a lead terminal with a reflecting surface. The package includes first and second lead terminals that are spaced apart from each other. The first lead terminal has a lower portion with an LED chip mounting area, and at least one reflecting surface formed by being bent from the lower portion. Meanwhile, a package body supports the first and second lead terminals and forms a cavity through which the LED chip mounting area and the reflecting surface of the first lead terminal and a part of the second lead terminal are exposed. The first and second lead terminals extend outside of the package body. Accordingly, light emitted from an LED chip can be reflected on the reflecting surface with high reflectivity, so that the optical efficiency of the package can be improved.Type: ApplicationFiled: July 19, 2007Publication date: February 28, 2008Applicant: SEOUL SEMICONDUCTOR CO., LTD.Inventors: Hwa Ja KIM, Nam Young KIM, Myung Hee LEE, Kyoung Bo HAN, Tae Kwang KIM, Ji Seop SO
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Patent number: D529451Type: GrantFiled: August 23, 2005Date of Patent: October 3, 2006Assignee: Seoul Semiconductor Co. Ltd.Inventors: Nam Young Kim, Kyoung Bo Han, Myoung Hee Lee
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Patent number: D529452Type: GrantFiled: August 23, 2005Date of Patent: October 3, 2006Assignee: Seoul Semiconductor Co. Ltd.Inventors: Nam Young Kim, Kyoung Bo Han, Myung Hee Lee
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Patent number: D557223Type: GrantFiled: July 28, 2006Date of Patent: December 11, 2007Assignee: Seoul Seimiconductor Co., Ltd.Inventors: Nam Young Kim, Kyoung Bo Han, Myung Hee Lee
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Patent number: D566054Type: GrantFiled: July 28, 2006Date of Patent: April 8, 2008Assignee: Seoul Semiconductor Co., Ltd.Inventors: Nam Young Kim, Kyoung Bo Han, Myung Hee Lee