Patents by Inventor Kyoung Chui Bae

Kyoung Chui Bae has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated using the same
    Patent number: 11639438
    Abstract: An epoxy resin composition for encapsulation of semiconductor devices and a semiconductor device encapsulated using the epoxy resin composition, the epoxy resin composition including an epoxy resin; a curing agent; an inorganic filler; and a curing catalyst, the epoxy resin including an epoxy resin represented by Formula 1:
    Type: Grant
    Filed: September 20, 2021
    Date of Patent: May 2, 2023
    Assignee: SAMSUNG SDI CO., LTD.
    Inventors: Yong Yeop Park, Dong Hwan Lee, Kyoung Chui Bae, Min Joon Seo, Chui Ho Lee