Patents by Inventor Kyoung Chul Bae

Kyoung Chul Bae has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE ENCAPSULATED USING THE SAME
    Publication number: 20220145066
    Abstract: An epoxy resin composition for encapsulation of semiconductor devices and a semiconductor device encapsulated using the epoxy resin composition, the epoxy resin composition including an epoxy resin; a curing agent; an inorganic filler; and a curing catalyst, the epoxy resin including an epoxy resin represented by Formula 1:
    Type: Application
    Filed: September 20, 2021
    Publication date: May 12, 2022
    Inventors: Yong Yeop PARK, Dong Hwan LEE, Kyoung Chul BAE, Min Joon SEO, Chul Ho LEE
  • Epoxy resin composition for sealing semiconductor device, and semiconductor device sealed by using same
    Patent number: 10636712
    Abstract: An epoxy resin composition for sealing a semiconductor device, of the present invention, contains an inorganic filler, and the inorganic filler contains a nanomaterial containing silicon (Si) and aluminium (Al).
    Type: Grant
    Filed: July 16, 2015
    Date of Patent: April 28, 2020
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Kyoung Chul Bae, Dong Hwan Lee
  • EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE SEALED BY USING SAME
    Publication number: 20180053703
    Abstract: An epoxy resin composition for sealing a semiconductor device, of the present invention, contains an inorganic filler, and the inorganic filler contains a nanomaterial containing silicon (Si) and aluminium (Al).
    Type: Application
    Filed: July 16, 2015
    Publication date: February 22, 2018
    Inventors: Kyoung Chul BAE, Dong Hwan LEE
  • EPOXY RESIN COMPOSITION FOR ENCAPSULATING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE ENCAPSULATED USING THE SAME
    Publication number: 20140179832
    Abstract: The present invention provides an epoxy resin composition for encapsulating a semiconductor device, comprising: an epoxy resin, a curing agent, a curing accelerator, a coupling agent, and an inorganic filler, wherein the coupling agent comprises an alkylsilane compound represented by Formula 1: wherein R1, R2 and R3 are each independently a C1 to C4 alkyl group, R is a C6 to C31 alkyl group, and n ranges from about 1 to 5 on average.
    Type: Application
    Filed: November 5, 2013
    Publication date: June 26, 2014
    Inventor: Kyoung Chul BAE
  • EPOXY RESIN COMPOSITION FOR ENCAPSULATING A SEMICONDUCTOR DEVICE, METHOD OF ENCAPSULATING A SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
    Publication number: 20120168968
    Abstract: An epoxy resin composition for encapsulating a semiconductor device, a method of encapsulating a semiconductor device, and a semiconductor device, the composition including an epoxy resin; a curing agent; a curing accelerator; an inorganic filler; and a flame retardant; wherein the flame retardant includes boehmite, and is present in an amount of about 0.1 to 20% by weight (wt %), based on a total weight of the epoxy resin composition.
    Type: Application
    Filed: December 27, 2011
    Publication date: July 5, 2012
    Inventors: Young Kyun Lee, Eun Jung Lee, Kyoung Chul Bae
  • Epoxy resin composition and semiconductor package including the same
    Publication number: 20080131702
    Abstract: An epoxy resin composition includes an epoxy resin, a curing agent, a coupling agent, and an inorganic filler. The coupling agent may include a hydrocarbon-substituted siloxane resin having at least one terminal hydroxy group.
    Type: Application
    Filed: November 26, 2007
    Publication date: June 5, 2008
    Inventors: Kyoung Chul Bae, Jin A. Kim, Yoon Kok Park