Abstract: A semiconductor device connected by an anisotropic conductive film, the anisotropic conductive film having a differential scanning calorimeter onset temperature of 60° C. to 85° C., and a elastic modulus change of 30% or less, as calculated by Equation 1, below, Elastic modulus change(%)={(M1?M0)/M0}×100??[Equation 1] wherein M0 is an initial elastic modulus in kgf/cm2 of the anisotropic conductive film as measured at 25° C., and M1 is a elastic modulus in kgf/cm2 of the anisotropic conductive film as measured at 25° C. after the film is left at 25° C. for 170 hours.

Abstract: A semiconductor device connected by an anisotropic conductive film, the anisotropic conductive film including a polyurethane resin; at least one other resin selected from the group of an ethylene-vinyl acetate copolymer resin, an acrylonitrile resin, and a styrene resin; isobornyl acrylate; and conductive particles.

Abstract: A semiconductor device connected by an anisotropic conductive film. The anisotropic conductive film includes a composition for an anisotropic conductive film including a first epoxy resin having an exothermic peak temperature of about 80° C. to about 110° C. and a second epoxy resin having an exothermic peak temperature of 120° C. to 200° C., as measured by differential scanning calorimetry (DSC). The first epoxy resin and the second epoxy resin are present in combined amount of about 30 wt % to about 50 wt % based on a total weight of the composition in terms of solid content. The second epoxy resin is present in an amount of about 60 to about 90 parts by weight based on 100 parts by weight of the first and second epoxy resins.

Abstract: A semiconductor device connected using an anisotropic conductive adhesive composition, the anisotropic conductive adhesive composition including a thermosetting polymerization initiator; and tetrahydrofurfuryl (meth)acrylate or furfuryl (meth)acrylate, wherein the tetrahydrofurfuryl (meth)acrylate or furfuryl (meth)acrylate is present in the composition in an amount of 1 wt % to 25 wt %, based on the total weight of the composition in terms of solid content.

Abstract: A semiconductor device is bonded by an anisotropic conductive film composition. The anisotropic conductive film composition includes an ethylene-vinyl acetate copolymer, a polyurethane resin, and organic fine particles. The anisotropic conductive film composition has a melt viscosity of about 2,000 to about 8,000 Pa·s at 80° C.

Abstract: A semiconductor device connected by an anisotropic conductive film, the anisotropic conductive film having a differential scanning calorimeter onset temperature of 60° C. to 85° C., and a elastic modulus change of 30% or less, as calculated by Equation 1, below, Elastic modulus change(%)={(M1?M0)/M0}×100??[Equation 1] wherein M0 is an initial elastic modulus in kgf/cm2 of the anisotropic conductive film as measured at 25° C., and M1 is a elastic modulus in kgf/cm2 of the anisotropic conductive film as measured at 25° C. after the film is left at 25° C. for 170 hours.

Abstract: A semiconductor device connected by an anisotropic conductive film, the film having a storage modulus of 100 MPa to 300 MPa at 40° C. after curing of the film, and a peak point of 80° C. to 90° C. in a DSC (Differential Scanning calorimeter) profile of the film.

Abstract: A semiconductor device connected by an anisotropic conductive film. The anisotropic conductive film includes a composition for an anisotropic conductive film including a first epoxy resin having an exothermic peak temperature of about 80° C. to about 110° C. and a second epoxy resin having an exothermic peak temperature of 120° C. to 200° C., as measured by differential scanning calorimetry (DSC). The first epoxy resin and the second epoxy resin are present in combined amount of about 30 wt % to about 50 wt % based on a total weight of the composition in terms of solid content. The second epoxy resin is present in an amount of about 60 to about 90 parts by weight based on 100 parts by weight of the first and second epoxy resins.

Abstract: A semiconductor device connected by an anisotropic conductive film, the film having a storage modulus of 100 MPa to 300 MPa at 40° C. after curing of the film, and a peak point of 80° C. to 90° C. in a DSC (Differential Scanning calorimeter) profile of the film.

Abstract: An electrical connection material between conductors includes about 40 wt % to about 80 wt % of a urethane-modified acrylate resin, based on a total weight of the electrical connection material, the electrical connection material exhibiting, after curing, a tensile elongation of about 100% to about 500% and a yield point strain of about 10% to about 50% in a stress-strain curve.

Abstract: A semiconductor device connected by an anisotropic conductive film, the anisotropic conductive film including a polyurethane resin; at least one other resin selected from the group of an ethylene-vinyl acetate copolymer resin, an acrylonitrile resin, and a styrene resin; isobornyl acrylate; and conductive particles.

Abstract: A semiconductor device connected using an anisotropic conductive adhesive composition, the anisotropic conductive adhesive composition including a thermosetting polymerization initiator; and tetrahydrofurfuryl (meth)acrylate or furfuryl (meth)acrylate, wherein the tetrahydrofurfuryl (meth)acrylate or furfuryl (meth)acrylate is present in the composition in an amount of 1 wt % to 25 wt %, based on the total weight of the composition in terms of solid content.

Abstract: A semiconductor device is bonded by an anisotropic conductive film composition. The anisotropic conductive film composition includes an ethylene-vinyl acetate copolymer, a polyurethane resin, and organic fine particles. The anisotropic conductive film composition has a melt viscosity of about 2,000 to about 8,000 Pa·s at 80° C.

Abstract: An anisotropic conductive adhesive composition includes an acrylic rubber binder having a weight average molecular weight of about 100,000 to about 1,000,000, a first component including at least one of a mono(meth)acrylate compound and a di(meth)acrylate compound, a second component including at least one of a tri(meth)acrylate compound and a compound having more than three (meth)acrylate groups, an organic peroxisde, and conductive particles. The second component is present in an amount of about 1 to about 10% by weight, based on the total weight of the acrylic rubber, the first component, the second component, the organic peroxide, and the conductive particles.

Abstract: An electrical connection material between conductors includes about 40 wt % to about 80 wt % of a urethane-modified acrylate resin, based on a total weight of the electrical connection material, the electrical connection material exhibiting, after curing, a tensile elongation of about 100% to about 500% and a yield point strain of about 10% to about 50% in a stress-strain curve.

Abstract: An adhesive film composition for electric and electronic devices and an adhesive film produced using the same, the composition including a binder, the binder including an ester linkage-containing resin, a carbodiimide group-containing compound, a (meth)acrylate group-containing compound; and an organic peroxide.

Abstract: An anisotropic conductive adhesive composition includes an acrylic rubber binder having a weight average molecular weight of about 100,000 to about 1,000,000, a first component including at least one of a mono(meth)acrylate compound and a di(meth)acrylate compound, a second component including at least one of a tri(meth)acrylate compound and a compound having more than three (meth)acrylate groups, an organic peroxisde, and conductive particles. The second component is present in an amount of about 1 to about 10% by weight, based on the total weight of the acrylic rubber, the first component, the second component, the organic peroxide, and the conductive particles.