Abstract: The present disclosure relates to a container for retort food and, more specifically, to a container for retort food including: a container body in which food may be input and stored; and an inner cap covering the container body. The inner cap covering the container body has a predetermined depth, and thus, effective sterilization may be performed during a retort processing process, overflow of the food in the container body may be prevented, and there is an advantage in satisfying regulations regarding a packing space ratio.

Abstract: A data receiving device may include a dummy stage block. The dummy stage block may include m dummy stages, wherein m is a natural number greater than or equal to two. Each of the m dummy stages may be configured to remove inter-symbol interference (ISI) from a dummy input signal using dummy coefficient information to generate a dummy output signal free of the ISI. Each of the m dummy stages may be further configured to output the dummy output signal. A normal stage block may include n normal stages, wherein n is a natural number greater than or equal to two. Each of the n normal stages may be configured to remove ISI from an input signal using coefficient information to generate an output signal free of the ISI and may be further configured to output the output signal.

Abstract: Provided is a control method of an access point controller (APC), the method including: (a) if occurrence of a predetermined security vulnerability checking event on particular terminal equipment is sensed, controlling the plurality of APs so that port scanning is capable of being performed on the particular terminal equipment; and (b) determining that security vulnerability has occurred in the particular terminal equipment in at least one of a case where the predetermined port is opened, a case where the predetermined port is closed, and a case where the number of opened ports exceeds a predetermined number, as a result of performing port scanning on the particular terminal equipment.

Abstract: An operating method of a semiconductor memory device includes precharging a channel region of a program-inhibited cell of first memory cells coupled to a first word line, selected from a first one of word line groups between a drain select line and a source select line, to a first level based on first data; performing a first program operation for storing the first data in the first memory cells; precharging the channel region of a program-inhibited cell of second memory cells coupled to a second word line, selected from a second one of the word line groups, to a second level based on second data to be stored in the second memory cells; and performing a second program operation for storing the second data in the second memory cells.

Abstract: An operating method of a semiconductor memory device includes precharging a channel region of a program-inhibited cell of first memory cells coupled to a first word line, selected from a first one of word line groups between a drain select line and a source select line, to a first level based on first data; performing a first program operation for storing the first data in the first memory cells; precharging the channel region of a program-inhibited cell of second memory cells coupled to a second word line, selected from a second one of the word line groups, to a second level based on second data to be stored in the second memory cells; and performing a second program operation for storing the second data in the second memory cells.

Abstract: A flash memory device includes a substrate; a cell stack having a semiconductor layer for providing junction areas and channel areas and an interlayer isolation layer for insulating the semiconductor layer, wherein the semiconductor layer and the interlayer isolation layer are repeatedly stacked; an array of gate columns, the gate columns penetrating through the cell stack, perpendicular to the substrate; and a trap layered stack introduced into an interface between the gate columns and the cell stack to store charge.

Abstract: A flash memory device includes a substrate; a cell stack having a semiconductor layer for providing junction areas and channel areas and an interlayer isolation layer for insulating the semiconductor layer, wherein the semiconductor layer and the interlayer isolation layer are repeatedly stacked; an array of gate columns, the gate columns penetrating through the cell stack, perpendicular to the substrate; and a trap layered stack introduced into an interface between the gate columns and the cell stack to store charge.

Abstract: A flash memory device includes a substrate; a cell stack having a semiconductor layer for providing junction areas and channel areas and an interlayer isolation layer for insulating the semiconductor layer, wherein the semiconductor layer and the interlayer isolation layer are repeatedly stacked; an array of gate columns, the gate columns penetrating through the cell stack, perpendicular to the substrate; and a trap layered stack introduced into an interface between the gate columns and the cell stack to store charge.

Abstract: A nonvolatile memory device and a method of fabricating the same is provided to prevent charges stored in a charge trap layer from moving to neighboring memory cells. The method of fabricating a nonvolatile memory device, includes forming a first dielectric layer on a semiconductor substrate in which active regions are defined by isolation layers, forming a charge trap layer on the first dielectric layer, removing the first dielectric layer and the charge trap layer over the isolation layers, forming a second dielectric layer on the isolation layers including the charge trap layer, and forming a conductive layer on the second dielectric layer.

Abstract: A nonvolatile memory device and a method of fabricating the same is provided to prevent charges stored in a charge trap layer from moving to neighboring memory cells. The method of fabricating a nonvolatile memory device, includes forming a first dielectric layer on a semiconductor substrate in which active regions are defined by isolation layers, forming a charge trap layer on the first dielectric layer, removing the first dielectric layer and the charge trap layer over the isolation layers, forming a second dielectric layer on the isolation layers including the charge trap layer, and forming a conductive layer on the second dielectric layer.

Abstract: A flash memory device includes a substrate, a cell stack having a semiconductor layer, in which junction areas for setting areas therebetween to channel areas are formed in a shape of a stripe, and an interlayer isolation layer for insulating the semiconductor layer, wherein the semiconductor layer and the interlayer isolation layer are repeatedly stacked. The flash memory device further includes an array of gate columns penetrating through the cell stack, perpendicular to the substrate and cutting through the junction areas to dispose the junction areas at both sides thereof, and a trap layered stack introduced into an interface between the gate column and the cell stack to store charge.

Abstract: A flash memory device includes a substrate; a cell stack having a semiconductor layer for providing junction areas and channel areas and an interlayer isolation layer for insulating the semiconductor layer, wherein the semiconductor layer and the interlayer isolation layer are repeatedly stacked; an array of gate columns, the gate columns penetrating through the cell stack, perpendicular to the substrate; and a trap layered stack introduced into an interface between the gate columns and the cell stack to store charge.

Abstract: A flash memory device includes a substrate, a cell stack having a semiconductor layer, in which junction areas for setting areas therebetween to channel areas are formed in a shape of a stripe, and an interlayer isolation layer for insulating the semiconductor layer, wherein the semiconductor layer and the interlayer isolation layer are repeatedly stacked. The flash memory device further includes an array of gate columns penetrating through the cell stack, perpendicular to the substrate and cutting through the junction areas to dispose the junction areas at both sides thereof, and a trap layered stack introduced into an interface between the gate column and the cell stack to store charge.

Abstract: There is provided a method of manufacturing a semiconductor memory device. According to the method, a tunnel insulating layer and a charge trap layer are formed in a cell region of a semiconductor substrate defining the cell region and a peripheral region. A gate insulation layer and a first conductive layer are formed over the semiconductor substrate of the peripheral region. A blocking insulating layer is formed on the charge trap layer of the cell region and the first conductive layer of the peripheral region. A second conductive layer is formed over the entire surface including the blocking insulating layer, thereby forming a capacitor having a stack structure of the first conductive layer, the blocking insulating layer, and the second conductive layer.

Abstract: A method of fabricating a non-volatile memory device, wherein a gate insulating layer, a first conductive layer, a tunneling layer, a trap nitride layer, a blocking oxide layer, and a capping layer are sequentially formed over a semiconductor substrate of a peripheral region. A contact region of the capping layer is etched. A spacer is formed on sidewalls of the capping layer. A contact region of the blocking oxide layer is etched by using the spacer as a mask. The spacer is removed while etching a contact region of the trap nitride layer. A contact region of the tunneling layer is etched.

Abstract: A flash memory device includes a substrate, a cell stack having a semiconductor layer, in which junction areas for setting areas therebetween to channel areas are formed in a shape of a stripe, and an interlayer isolation layer for insulating the semiconductor layer, wherein the semiconductor layer and the interlayer isolation layer are repeatedly stacked. The flash memory device further includes an array of gate columns penetrating through the cell stack, perpendicular to the substrate and cutting through the junction areas to dispose the junction areas at both sides thereof, and a trap layered stack introduced into an interface between the gate column and the cell stack to store charge.

Abstract: A method of programming a charge trap type non-volatile memory device includes applying a program pulse to a selected memory cell, applying a detrap pulse to the selected memory cell, and applying a program verify pulse to the memory cell. The charge trap type non-volatile memory device includes a memory cell array including a charge trap memory cell, and a high voltage generator for supplying a detrap pulse to the charge trap memory cell.

Abstract: A nonvolatile memory device and a method of fabricating the same is provided to prevent charges stored in a charge trap layer from moving to neighboring memory cells. The method of fabricating a nonvolatile memory device, includes forming a first dielectric layer on a semiconductor substrate in which active regions are defined by isolation layers, forming a charge trap layer on the first dielectric layer, removing the first dielectric layer and the charge trap layer over the isolation layers, forming a second dielectric layer on the isolation layers including the charge trap layer, and forming a conductive layer on the second dielectric layer.

Abstract: A method of programming a charge trap type non-volatile memory device includes applying a program pulse to a selected memory cell, applying a detrap pulse to the selected memory cell, and applying a program verify pulse to the memory cell. The charge trap type non-volatile memory device includes a memory cell array including a charge trap memory cell, and a high voltage generator for supplying a detrap pulse to the charge trap memory cell.

Abstract: A method and apparatus for detecting a signal to determine on-track/off-track and/or a track cross direction, using a detection signal corresponding to a reflected main light beam and detection signals respectively corresponding to reflected first and second sub light beams, and an optical recording and/or reproducing apparatus using the same are provided. When detection signals respectively corresponding to one side portions, in a direction corresponding to a radial direction of the optical information storage medium, of the respective main light beam and first and second sub light beams are referred to as a first main signal, a first sub signal, and a second sub signal, respectively, the method and apparatus include obtaining a first operational signal, which is used to determine on-track/off-track and/or a track cross direction, by performing a subtraction on the combination of the first and second sub signals, and the first main signal.