Patents by Inventor Kyoung-Hwan Song

Kyoung-Hwan Song has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240124025
    Abstract: The present disclosure relates to a defensive driving vehicles interaction system (D2VIS), and to an autonomous driving predictive defensive driving system through an interaction based on forward vehicle driving and situation judgement information and a method thereof. An autonomous driving predictive defensive driving system through an interaction based on forward vehicle driving and situation judgement information according to the present disclosure includes an inter-vehicle distance recognition unit configured to recognize a distance between a surrounding vehicle and an ego vehicle, a situation recognition unit configured to recognize situation information including surrounding information of the surrounding vehicle, and a driving situation response determination unit configured to share data for determining a defensive driving action by using the situation information.
    Type: Application
    Filed: October 12, 2023
    Publication date: April 18, 2024
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: JinWoo KIM, Ki Tae KIM, MyongWook PARK, Yoo-Seung SONG, KYOUNG HWAN AN, Shin Kyung LEE
  • Patent number: 10663237
    Abstract: The present disclosure relates to a heat transfer tube comprising nanostructures formed on the surface, and a method for manufacturing the same, and by forming nanostructures on a heat transfer tube surface, a superhydrophobic surface may be obtained under a high temperature environment as well. In addition, superhydrophobicity may be enhanced by further forming a hydrophobic coating layer on the nanostructure-formed heat transfer tube surface. By using a method of forming nanostructures by dipping the heat transfer tube surface, complex shapes may be coated, and therefore, a plurality of assembled heat transfer tubes may be coated, and damages occurring during a process of assembling the heat transfer tube after coating may be prevented.
    Type: Grant
    Filed: March 14, 2018
    Date of Patent: May 26, 2020
    Assignees: Doosan Heavy Industries Construction Co., Ltd., UNIVERSITY-INDUSTRY COOPERATION GROUP OF KYUNG HEE UNIVERSITY
    Inventors: Jin Bum Kim, Hyun Sik Kim, Young Suk Nam, Kyoung Hwan Song, Seung Tae Oh, Jae Hwan Shim, Dong Hyun Seo
  • Publication number: 20180266776
    Abstract: The present disclosure relates to a heat transfer tube comprising nanostructures formed on the surface, and a method for manufacturing the same, and by forming nanostructures on a heat transfer tube surface, a superhydrophobic surface may be obtained under a high temperature environment as well. In addition, superhydrophobicity may be enhanced by further forming a hydrophobic coating layer on the nanostructure-formed heat transfer tube surface. By using a method of forming nanostructures by dipping the heat transfer tube surface, complex shapes may be coated, and therefore, a plurality of assembled heat transfer tubes may be coated, and damages occurring during a process of assembling the heat transfer tube after coating may be prevented.
    Type: Application
    Filed: March 14, 2018
    Publication date: September 20, 2018
    Inventors: Jin Bum Kim, Hyun Sik Kim, Young Suk Nam, Kyoung Hwan Song, Seung Tae Oh, Jae Hwan Shim, Dong Hyun Seo
  • Patent number: 7767596
    Abstract: A wafer support pin has a front end contacted with a wafer such that the front end is flat or rounded. Thus, gravitational stress is minimized during annealing the wafer, thereby minimizing slip dislocation. This wafer support pin is suitably used for annealing of a wafer, particularly high temperature rapid thermal annealing of a large-diameter wafer.
    Type: Grant
    Filed: December 26, 2007
    Date of Patent: August 3, 2010
    Assignee: Siltron, Inc.
    Inventors: Kun Kim, Jin-Kyun Hong, Woo-Hyun Seo, Kyoung-Hwan Song
  • Publication number: 20080176415
    Abstract: A wafer support pin has a front end contacted with a wafer such that the front end is flat or rounded. Thus, gravitational stress is minimized during annealing the wafer, thereby minimizing slip dislocation. This wafer support pin is suitably used for annealing of a wafer, particularly high temperature rapid thermal annealing of a large-diameter wafer.
    Type: Application
    Filed: December 26, 2007
    Publication date: July 24, 2008
    Applicant: Siltron Inc.
    Inventors: Kun Kim, Jin-Kyun Hong, Woo-Hyun Seo, Kyoung-Hwan Song