Patents by Inventor Kyoung-Il Heo

Kyoung-Il Heo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7327154
    Abstract: A test apparatus for testing a multi-chip package comprising a multiplicity of semiconductor chips, which includes a test driver having one drive channel and at least one input/output channel. A test board is mounted with the multi-chip package. Drive pins of the semiconductor chips are parallel connected to the drive channel, and input/output pins of the semiconductor chips are parallel connected to the input/output channel.
    Type: Grant
    Filed: July 27, 2005
    Date of Patent: February 5, 2008
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Young-Gu Shin, Kyoung-Il Heo, Hyoung-Young Lee, Hyuk Kwon, Ki-Bong Ju, Jeong-Ho Bang, Hyun-Seop Shim
  • Publication number: 20050258858
    Abstract: A test apparatus for testing a multi-chip package comprising a multiplicity of semiconductor chips, which includes a test driver having one drive channel and at least one input/output channel. A test board is mounted with the multi-chip package. Drive pins of the semiconductor chips are parallel connected to the drive channel, and input/output pins of the semiconductor chips are parallel connected to the input/output channel.
    Type: Application
    Filed: July 27, 2005
    Publication date: November 24, 2005
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Young-Gu Shin, Kyoung-Il Heo, Hyoung-Young Lee, Hyuk Kwon, Ki-Bong Ju, Jeong-Ho Bang, Hyun-Seop Shim
  • Patent number: 6943577
    Abstract: A test apparatus for testing a multi-chip package comprising a multiplicity of semiconductor chips, which includes a test driver having one drive channel and at least one input/output channel. A test board is mounted with the multi-chip package. Drive pins of the semiconductor chips are parallel connected to the drive channel, and input/output pins of the semiconductor chips are parallel connected to the input/output channel.
    Type: Grant
    Filed: October 1, 2003
    Date of Patent: September 13, 2005
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Young-Gu Shin, Kyoung-Il Heo, Hyoung-Young Lee, Hyuk Kwon, Ki-Bong Ju, Jeong-Ho Bang, Hyun-Seop Shim
  • Publication number: 20040119491
    Abstract: A test apparatus for testing a multi-chip package comprising a multiplicity of semiconductor chips, which includes a test driver having one drive channel and at least one input/output channel. A test board is mounted with the multi-chip package. Drive pins of the semiconductor chips are parallel connected to the drive channel, and input/output pins of the semiconductor chips are parallel connected to the input/output channel.
    Type: Application
    Filed: October 1, 2003
    Publication date: June 24, 2004
    Inventors: Young-Gu Shin, Kyoung-Il Heo, Hyoung-Young Lee, Hyuk Kwon, Ki-Bong Ju, Jeong-Ho Bang, Hyun-Seop Shim
  • Publication number: 20040044938
    Abstract: Disclosed is a semiconductor test system which includes a plurality of test stations, a plurality of test pattern generators corresponding to the test stations and a plurality of comparators corresponding to the test stations. Semiconductor devices under test are mounted on each of the plurality of test stations. Each of the test pattern generators generates test patterns and expected data in response to a test command from a host. Each of the comparators compares data from semiconductor devices on a corresponding test station with the expected data. In particular, semiconductor devices on at least one of the test stations may be of different type from those on each of remaining test stations. The semiconductor test system is capable of testing semiconductor devices on the test stations in parallel at the same. This test scheme allows for decrease in the time and cost that are needed to test different types of semiconductor devices.
    Type: Application
    Filed: March 31, 2003
    Publication date: March 4, 2004
    Applicant: Samsung Electronics Co., Ltd.
    Inventor: Kyoung-Il Heo