Abstract: A method for continuously mass-manufacturing graphene using thermal plasma, the method for continuously mass-manufacturing graphene includes the steps of: (a) injecting an inert gas into a plasma device to generate plasma; (b) injecting expandable graphite and graphite intercalation compounds (GIC) into the plasma device in constant amounts; and (c) allowing the expandable graphite and GIC to be expanded by thermal plasma treatment so that graphene is exfoliated.

Abstract: A method for continuously mass-manufacturing graphene using thermal plasma, the method for continuously mass-manufacturing graphene includes the steps of: (a) injecting an inert gas into a plasma device to generate plasma; (b) injecting expandable graphite and graphite intercalation compounds (GIC) into the plasma device in constant amounts; and (c) allowing the expandable graphite and GIC to be expanded by thermal plasma treatment so that graphene is exfoliated.

Abstract: A wafer sensing apparatus for sensing whether a wafer is inserted in a wafer cassette. The wafer sensing apparatus includes a light emitting device for emitting light of a predetermined wavelength toward the inside of a wafer cassette, a light sensing device, positioned opposite to the light emitting device, for sensing the emitted light, and an optical filter device for passing light corresponding only to the predetermined wavelength of light emitted from the light emitting device. The light sensing device is not affected by interference light from outside sources that can cause a faulty wafer sensing function, since the interfering light is reflected or absorbed by the optical filter device. Equipment malfunctions caused by faulty sensing from the light sensing device are prevented, thereby improving the equipment operating efficiency.