Abstract: A capacitor component includes a capacitor component includes a body including a dielectric layer and first and second internal electrodes disposed to oppose each other with the dielectric layer interposed therebetween, and first and second external electrodes disposed on the body and electrically connected to the first and second internal electrodes. The body may include a capacitance forming portion including the first and second internal electrodes, cover portions disposed on upper and lower surfaces of the capacitance forming portion, and margin portions disposed on side surfaces of the capacitance forming portion, in which the margin portions have a hardness ranging from 8.5 GPa to 14 GPa.

Abstract: A multilayer ceramic electronic component includes a body including an internal electrode alternately arranged with a dielectric layer; and an external electrode disposed on the body and connected to the internal electrode. The internal electrode includes a plurality of nickel (Ni) grains, and a composite layer including tin (Sn) and nickel (Ni) is disposed at a grain boundary of the nickel (Ni) grains.

Abstract: A method of manufacturing a capacitor component includes preparing a laminate structure in which a plurality of ceramic sheets, each having an internal electrode pattern formed thereon, are layered, attaching an auxiliary member to an upper surface and a lower surface of the laminate structure, and disposing the laminate structure having the auxiliary member attached thereto on a lower mold on which jigs for blocking a length direction portion and a width direction portion of the laminate structure are disposed and compressing the laminate structure. The ceramic sheet has a thickness of 0.6 ?m or less, and the auxiliary member has higher elasticity than elasticity of the lower mold.

Abstract: A capacitor component includes a capacitor component includes a body including a dielectric layer and first and second internal electrodes disposed to oppose each other with the dielectric layer interposed therebetween, and first and second external electrodes disposed on the body and electrically connected to the first and second internal electrodes. The body may include a capacitance forming portion including the first and second internal electrodes, cover portions disposed on upper and lower surfaces of the capacitance forming portion, and margin portions disposed on side surfaces of the capacitance forming portion, in which the margin portions have a hardness ranging from 8.5 GPa to 14 GPa.

Abstract: A capacitor component includes a body including dielectric layers and first and second internal electrodes disposed to face each other while having the dielectric layer interposed therebetween; and first and second external electrodes disposed on an external surface of the body and electrically connected to the first and second internal electrodes, respectively. The body includes a capacitance forming portion including the first and second internal electrodes disposed to face each other while having the dielectric layer interposed therebetween and in which capacitance is formed, and cover portions formed on upper and lower surfaces of the capacitance forming portion, and hardness of the cover portions is 9.5 GPa or more and 14 GPa or less.

Abstract: A multilayer ceramic capacitor includes: a ceramic body including a dielectric layer, a first internal electrode and a second internal electrode arranged to face each other with the dielectric layer interposed therebetween; and a first external electrode disposed on an exterior surface of the ceramic body and a second external electrode disposed on the exterior surface of the ceramic body, wherein the ceramic body includes an active portion, forming capacity, cover portions disposed on upper and lower portions of the active portion, and margin portions disposed on a side surface of the active portion, and wherein the dielectric layer, the cover portions, and the margin portions of the active portion include magnesium (Mg) having content of more than 0 mole, and less than or equal to 1.0 mole, relative to titanium (Ti) included in the dielectric layer, the cover portions and the margin portions of the active portion.

Abstract: A method of manufacturing a multilayer ceramic electronic component includes preparing a ceramic green sheet, forming an internal electrode pattern by applying a paste for an internal electrode including a conductive powder to the ceramic green sheet, forming a ceramic laminate structure by layering the ceramic green sheet on which the internal electrode pattern is formed, forming a body including a dielectric layer and an internal electrode by sintering the ceramic laminate structure, and forming an external electrode by forming an electrode layer on the body, and forming a conductive resin layer on the electrode layer, and the conductive powder includes a conductive metal and tin (Sn), and a content of tin (Sn) is 1.5 wt % or higher, based on a weight of the conductive metal.

Abstract: A capacitor component includes a capacitor component includes a body including a dielectric layer and first and second internal electrodes disposed to oppose each other with the dielectric layer interposed therebetween, and first and second external electrodes disposed on the body and electrically connected to the first and second internal electrodes. The body may include a capacitance forming portion including the first and second internal electrodes, cover portions disposed on upper and lower surfaces of the capacitance forming portion, and margin portions disposed on side surfaces of the capacitance forming portion, in which the margin portions have a hardness ranging from 8.5 GPa to 14 GPa.

Abstract: A multilayer ceramic capacitor includes: a ceramic body including a dielectric layer, a first internal electrode and a second internal electrode arranged to face each other with the dielectric layer interposed therebetween; and a first external electrode disposed on an exterior surface of the ceramic body and a second external electrode disposed on the exterior surface of the ceramic body, wherein the ceramic body includes an active portion, forming capacity, cover portions disposed on upper and lower portions of the active portion, and margin portions disposed on a side surface of the active portion, and wherein the dielectric layer, the cover portions, and the margin portions of the active portion include magnesium (Mg) having content of more than 0 mole, and less than or equal to 1.0 mole, relative to titanium (Ti) included in the dielectric layer, the cover portions and the margin portions of the active portion.

Abstract: A multilayer ceramic capacitor includes a ceramic body including dielectric layers and first and second internal electrodes disposed to face each other with each of the dielectric layers interposed therebetween, and first and second external electrodes disposed on external surfaces of the ceramic body and electrically connected to the first and second internal electrodes, respectively. The ceramic body includes an active portion in which capacitance is formed and cover portions disposed above and below the active portion. Each of the cover portions includes a first region adjacent to an external side surface of the ceramic body and a second region adjacent to an outermost internal electrode and disposed between the first region and the active region. A density of a dielectric material included in the second region is higher than a density of a dielectric material included in the first region.

Abstract: A capacitor component in which in a cross section (a L-T cross section) of a body in length and thickness directions, a distance between internal electrodes in a central portion of the body is closer than a distance between the internal electrodes in ends of the internal electrodes, and in a cross section (a W-T cross section) of the body in width and thickness directions, a distance between the internal electrodes in a central portion of the body is farther than a distance between the internal electrodes in ends of the internal electrodes may be provided.

Abstract: A capacitor component includes a body including a dielectric layer and first and second internal electrodes, alternately disposed in a first direction, and first and second external electrodes, respectively disposed on opposite end surfaces of the body in a second direction, perpendicular to the first direction in the body. An amorphous second phase is disposed at an interface between the first and second internal electrodes and the dielectric layer, and ls/le is between 0.02 and 0.07, where ls is a total length of the amorphous second phase disposed in a boundary line between the first or second internal electrode and the dielectric layer in the second direction and le is a length of the first or second internal electrode in the second direction.

Abstract: A capacitor component includes a capacitor component includes a body including a dielectric layer and first and second internal electrodes disposed to oppose each other with the dielectric layer interposed therebetween, and first and second external electrodes disposed on the body and electrically connected to the first and second internal electrodes. The body may include a capacitance forming portion including the first and second internal electrodes, cover portions disposed on upper and lower surfaces of the capacitance forming portion, and margin portions disposed on side surfaces of the capacitance forming portion, in which the margin portions have a hardness ranging from 8.5 GPa to 14 GPa.

Abstract: A capacitor component includes a capacitor component includes a body including a dielectric layer and first and second internal electrodes disposed to oppose each other with the dielectric layer interposed therebetween, and first and second external electrodes disposed on the body and electrically connected to the first and second internal electrodes. The body may include a capacitance forming portion including the first and second internal electrodes, cover portions disposed on upper and lower surfaces of the capacitance forming portion, and margin portions disposed on side surfaces of the capacitance forming portion, in which the margin portions have a hardness ranging from 8.5 GPa to 14 GPa.

Abstract: A multilayer ceramic capacitor includes a ceramic body including dielectric layers and first and second internal electrodes disposed to face each other with each of the dielectric layers interposed therebetween, and first and second external electrodes disposed on external surfaces of the ceramic body and electrically connected to the first and second internal electrodes, respectively. The ceramic body includes an active portion in which capacitance is formed and cover portions disposed above and below the active portion. Each of the cover portions includes a first region adjacent to an external side surface of the ceramic body and a second region adjacent to an outermost internal electrode and disposed between the first region and the active region. A density of a dielectric material included in the second region is higher than a density of a dielectric material included in the first region.

Abstract: A method of manufacturing a multilayer ceramic electronic component includes preparing a ceramic green sheet, forming an internal electrode pattern by coating a paste for an internal electrode including a conductive powder including one or more of tungsten (W), molybdenum (Mo), chromium (Cr), and cobalt (Co), the sum of which is 1 to 20 wt %, and including tin (Sn), on the ceramic green sheet, forming a ceramic multilayer structure by stacking ceramic green sheets on which the internal electrode pattern is formed, and forming a body including a dielectric layer and an internal electrode by sintering the ceramic multilayer structure.

Abstract: A method of manufacturing a multilayer ceramic electronic component includes preparing a ceramic green sheet, forming an internal electrode pattern by coating a paste for an internal electrode including conductive powder including tin (Sn) on the ceramic green sheet, forming a ceramic multilayer structure by stacking ceramic green sheets on which the internal electrode pattern is formed, and forming a body including a dielectric layer and an internal electrode by sintering the ceramic multilayer structure. A content of tin (Sn) based on the conductive powder is greater than or equal to about 1.5 wt %.

Abstract: A multilayer ceramic electronic component includes a body including an internal electrode alternately arranged with a dielectric layer; and an external electrode disposed on the body and connected to the internal electrode. The internal electrode includes a plurality of nickel (Ni) grains, and a composite layer including tin (Sn) and nickel (Ni) is disposed at a grain boundary of the nickel (Ni) grains.

Abstract: A method of manufacturing a multilayer ceramic electronic component includes preparing a ceramic green sheet, forming an internal electrode pattern by coating a paste for an internal electrode including nickel (Ni) powder including a coating layer having a surface including copper (Cu) on the ceramic green sheet, forming a ceramic multilayer structure by stacking the ceramic green sheet with the internal electrode pattern formed thereon, and forming a body including a dielectric layer and an internal electrode by sintering the ceramic multilayer structure. The content of Cu is equal to or greater than 0.2 wt %, based on a total weight of the Ni powder.

Abstract: A multilayer ceramic capacitor includes a ceramic body with first and second internal electrodes facing each other and dielectric layers interposed therebetween. First and second external electrodes are on external surfaces of the ceramic body and electrically connected to the first and second internal electrodes, respectively. A dielectric layer includes dielectric grains including, respectively, first regions in which dysprosium (Dy) is not present and second regions surrounding the first regions. Where a shortest distance between boundaries of the first regions (in which dysprosium (Dy) is not present) of two of the dielectric grains is “L,” the concentration of dysprosium (Dy) in a region within ±0.2 L from a halfway point between the boundaries is lower than that of dysprosium (Dy) in the second regions.