Abstract: There is provided a method of manufacturing a back-surface electrode type solar cell. The method may include: forming a conductive metal thin film on a crystalline silicon wafer; forming plate-resistant partition walls on a top surface of the conductive metal thin film; forming a metal layer in a space between the plate-resistant partition walls and then removing the plate-resistant partition walls; and removing the conductive metal thin film that is exposed by removing the plate-resistant partition walls so as to expose the crystalline silicon wafer.

Abstract: The present invention provides a method of forming a conductive electrode structure including: applying a conductive paste on a substrate; forming a conductive pattern having an outwardly convex shape by heat-treating the conductive paste; and forming a solder layer to conformally cover the conductive pattern.

Abstract: Disclosed herein is a conductive electrode pattern used as an electrode of a solar cell. The conductive electrode pattern includes a lower metal layer and an upper metal layer vertically disposed on a substrate, wherein any one of the lower metal layer and the upper metal layer includes silver (Ag) and the other one of the lower metal layer and the upper metal layer includes a metal of transition metals, different from that of the lower metal layer.

Abstract: Disclosed herein is a conductive electrode pattern used as an electrode of a solar cell. The conductive electrode pattern includes a lower metal layer and an upper metal layer vertically disposed on a substrate, wherein any one of the lower metal layer and the upper metal layer includes silver (Ag) and the other one of the lower metal layer and the upper metal layer includes a metal of transition metals, different from that of the lower metal layer.

Abstract: Provided are a circuit board and an apparatus for processing a defect in a circuit board. The circuit board includes at least one non-defective cell including a non-defective circuit pattern, at least one defective cell including a defective circuit pattern, and a short line printed on the circuit pattern of the at least one defective cell.

Abstract: There is provided a method of manufacturing a back-surface electrode type solar cell. The method may include: forming a conductive metal thin film on a crystalline silicon wafer; forming plate-resistant partition walls on a top surface of the conductive metal thin film; forming a metal layer in a space between the plate-resistant partition walls and then removing the plate-resistant partition walls; and removing the conductive metal thin film that is exposed by removing the plate-resistant partition walls so as to expose the crystalline silicon wafer.

Abstract: An ink recovery device is disclosed. The ink recovery device, configured to retrieve ink being sprayed out from an inkjet printer, in accordance with an embodiment of the present invention includes: a recovery unit, which retrieves the ink; a storage, which is connected to the recovery unit and stores the retrieved ink; and a vibrating unit, which vibrates the stored ink. The ink recovery device in accordance with an embodiment of the present invention can effectively retrieve ink being sprayed out for the maintenance of an inkjet head and immediately reuse the retrieved ink while maintaining the properties of the ink.

Abstract: There is provided a thin film type solar cell including: a crystalline silicon wafer subject to surface texturing and forming an n-type semiconductor layer; a pn junction formed of a non-crystalline p-type silicon layer deposited on one surface of the crystalline silicon wafer and a non-crystalline n-type silicon layer deposited on the other surface thereof; a transparent surface electrode formed outward of the pn junction; a water repellent light transmitting layer formed on the pn junction, the surface electrode, or both the pn junction and the surface electrode and allowing for an increase in light transmittance; and a pattern electrode formed on the surface electrode or the water repellent light transmitting layer.

Abstract: Disclosed is a method of aligning an inkjet head. The method of aligning an inkjet head having a plurality of nozzles can include recognizing a position (x1, y1) of a first nozzle by using a nozzle measuring camera; recognizing a position (x2, y2) of a second nozzle by moving the nozzle measuring camera horizontally; calculating a tilting angle ? between the first nozzle and the second nozzle; and rotating the inkjet head according to the tilting angle. With the present invention, it is possible to easily and precisely the inkjet head having a plurality of nozzles by using the inkjet head and optical devices.

Abstract: An ink recovery device is disclosed. The ink recovery device, configured to retrieve ink being sprayed out from an inkjet printer, in accordance with an embodiment of the present invention includes: a recovery unit, which retrieves the ink; a storage, which is connected to the recovery unit and stores the retrieved ink; and a vibrating unit, which vibrates the stored ink. The ink recovery device in accordance with an embodiment of the present invention can effectively retrieve ink being sprayed out for the maintenance of an inkjet head and immediately reuse the retrieved ink while maintaining the properties of the ink.

Abstract: A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The method of manufacturing the printed circuit board in accordance with an embodiment of the present invention can include: forming an opaque conductive pattern on one side of a transparent insulation layer; forming a photosensitive insulation layer on the transparent insulation layer such that the conductive pattern is covered; hardening the photosensitive insulation layer excluding an area covering the conductive pattern by irradiating light on the other side of the transparent insulation layer; and forming an opening on the photosensitive insulation layer by removing the area of the photosensitive insulation layer covering the conductive pattern such that the conductive pattern is exposed.

Abstract: Disclosed are a printed circuit board and a manufacturing method thereof. The printed circuit board, having an electronic component mounted thereon, in accordance with an embodiment of the present invention includes: a substrate having a circuit pattern and a pad formed on one side thereof; a solder resist layer formed on one side of the substrate so as to expose the pad; and a dam formed on the solder resist layer by an inkjet printing method and disposed at a position corresponding to where the electronic component is mounted so as to control a flow of an underfill solution injected between the substrate and the electronic component.

Abstract: A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The method of manufacturing the printed circuit board can include adhering a film to an insulation base, in which the film is configured to flatten a surface of the insulation base, thermosetting the film, and forming a circuit pattern on the film by way of ink-jetting. In accordance with the present invention, a surface of the insulation base can be flattened and the surface roughness thereof can be made uniform, so that the diffusivity of the circuit pattern can be controlled while printing a minute circuit pattern and an adhesive strength between the insulation base and the circuit pattern can be increased.