Abstract: This specification relates to a packaging substrate and a manufacturing method for the packaging substrate. The packaging substrate according to this specification includes a core layer comprising a glass core having a first surface and a second surface facing each other, as well as a cavity portion penetrating through the glass core. An element module is arranged in the cavity portion, which includes a cavity element and a distribution layer formed on upper side of the cavity element. The cavity distribution layer includes a redistribution circuit layer and a cavity heat dissipation pattern, where the redistribution circuit layer includes i) a cavity bump layer; or ii) vias and circuit layers. The cavity heat dissipation pattern facilitates the movement of heat generated by the cavity element.

Abstract: Embodiments described herein relate to sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. The device includes a plurality of sub-pixels, each sub-pixel of the plurality of sub-pixels defined by adjacent pixel-defining layer (PDL) structures with inorganic overhang structures disposed on the PDL structures, each sub-pixel having an anode, organic light-emitting diode (OLED) material disposed on the anode, and a cathode disposed on the OLED material. The device is made by a process including the steps of: depositing the OLED material and the cathode by evaporation deposition, and depositing an encapsulation layer disposed over the cathode.

Abstract: An electronic device includes: a display layer in which an active area and a peripheral area adjacent to the active area are defined, the display layer including a common electrode, a sensor layer disposed on the display layer and including a plurality of sensing electrodes and an antenna pattern, and a cover layer spaced apart from the sensor layer with the display layer therebetween, the cover layer having a conductivity. The peripheral area includes a first area and a second area spaced apart from the active area with the first area therebetween, and the common electrode is disposed in the active area and the first area and is spaced apart from the second area. When viewed in a plan view, a portion of the antenna pattern does not overlap the common electrode and overlaps the cover layer.

Abstract: An embodiments may be related to a display device. A display device may include display layer and an antenna. The display layer may comprise a first display area including an exposed area and a cover area, a folding display area adjacent to the first display area, and a second display area adjacent to the folding area. The antenna disposed on the exposed area of the first display area, wherein the second display area covers the cover area of the first display area and exposes the exposed area of the first display area, when the folding display area is folded.

Abstract: This specification relates to a packaging substrate and a manufacturing method for the packaging substrate. The packaging substrate according to this specification includes a core layer comprising a glass core having a first surface and a second surface facing each other, as well as a cavity portion penetrating through the glass core. An element module is disposed of the cavity portion. The element module comprises one or more cavity elements and a cavity distribution layer that are modularized into a capsule layer, wherein the cavity distribution layer is disposed above the cavity element, and the cavity distribution layer comprises a redistribution distribution circuit layer. A manufacturing method of a packaging substrate comprises preparing operation of a glass core with a cavity portion and an element module; and arranging operation of the element module in the cavity portion.

Abstract: The present invention relates to a 2,7-substituted pyrrolo[2,1-f][1,2,4]triazine compound having a protein kinase inhibitory activity, a pharmaceutically acceptable salt thereof, and a pharmaceutical composition for the prevention, alleviation, or treatment of diseases induced by abnormal cell growth containing the compounds as active ingredients, and the novel cyclic 2,7-substituted pyrrolo[2,1-f][1,2,4]triazine compounds of the present invention exhibit excellent inhibitory effects on various protein kinases involved in growth factor signaling pathways. Therefore, they are useful as preventives, alleviators, or therapeutics for diseases characterized by abnormal cell growth induced by these protein kinases.

Abstract: Embodiments described herein relate to sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. The sub-pixel circuit includes a plurality of contact overhangs. The plurality of contact overhangs are disposed between adjacent sub-pixels of a sub-pixel circuit to be formed. The contact overhangs are formed over a metal grid exposed through a PDL structure. A cathode is deposited via evaporation deposition to be in contact with the contact overhang. The metal grid is perpendicular to a plurality of metal layers disposed on the substrate.

Abstract: Provided is a process of manufacturing light olefins, which is a fluidized bed catalytic naphtha cracking process having improved economic feasibility and decreased greenhouse gas emissions. The process of manufacturing light olefins according to the present invention has a decreased hot spot occurring when supplying an additional fuel oil and decreased tendency of catalyst deactivation by water, thereby improving economic feasibility of the process and reducing greenhouse gas emissions to allow construction of an environmentally friendly process.

Abstract: The present invention relates to a circuit breaker operating current/fault current measuring device using a single Rogowski coil has an advantage of reducing an installation space and a manufacturing cost by simultaneously measuring an operating current and a fault current with the single Rogowski coil and has an advantage of improving reliability by simultaneously satisfying accuracy required for measurement of the operating current and the fault current. The circuit breaker operating current/fault current measuring device using a single Rogowski coil according to the present invention is configured with a Rogowski coil installed to wrap around a current-carrying conductor, a protection circuit outputting a fault voltage based on a voltage generated from a tap installed on a portion of the Rogowski coil, and a measurement circuit outputting an operating voltage based on a voltage generated in the entire coil of the Rogowski coil.

Abstract: The present invention relates to a catalyst for converting diesel and kerosene, which are increasingly likely to be not utilized, into basic chemical raw materials, and a method for producing the catalyst, and the catalyst is a catalyst containing a porous zeolite having pores; and phosphorus (P) supported in internal pores of the zeolite and on a surface of the zeolite, wherein the amount of Lewis acid sites in the phosphorus-supported zeolite is 20 to 100 ?mol/g, and the catalyst is used for producing a basic chemical raw material through catalytic cracking of a hydrocarbon feed having a boiling point of 150° C. or higher and 550° C. or lower.

Abstract: A display device includes: a base layer; a circuit layer on the base layer; and an element layer on the circuit layer and including a light emitting element and a hybrid element, wherein the hybrid element includes: a hybrid anode electrode; a light receiving stack on the hybrid anode electrode; a light emitting stack on the light receiving stack; and a hybrid cathode electrode on the light emitting stack, wherein the light emitting element is configured to be turned on to emit a first color light in a light emitting mode and a light receiving mode, wherein the hybrid element is configured to be turned on to output a second color light in the light emitting mode, and wherein the hybrid element is configured to be turned on to receive the first color light in the light receiving mode.

Abstract: The polycarbonate copolymer of the present invention comprises: a unit derived from at least one type of primary dihydroxyl compound; and a unit derived from at least two types of secondary dihydroxyl compounds, wherein the polycarbonate copolymer has a pencil hardness of H or greater, when a specimen is measured according to the pencil hardness test (ISO 15184), and a glass transition temperature (Tg) of about 90° C. to about 160° C., measured according to ISO 11357. The polycarbonate copolymer has excellent heat resistance, scratch resistance, moldability, light resistance, weather resistance, transparency, mechanical strength, and the like.

Abstract: An embodiment relates to a packaging substrate and a manufacturing method of the same. The packaging substrate according to an embodiment includes a glass core including a first surface and a second surface facing each other; and an upper layer stacked on the first surface or a lower layer stacked on the second surface, and the corners of the packaging substrate may be treated as curved surfaces or chamfered. Through this, it is possible to protect the glass core from external impact and minimize damage and damage to the glass core.

Abstract: A polybutylene adipate terephthalate resin composition, and a method for preparing the same. The polybutylene adipate terephthalate resin composition includes a polybutylene adipate terephthalate resin, a chain extender, and a gel reducer. The polybutylene adipate terephthalate resin composition suppresses gel formation during the preparation process, and exhibits excellent mechanical properties and external appearance.

Abstract: Sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. In one example, a device includes a substrate, pixel-defining layer (PDL) structures disposed over the substrate and defining sub-pixels of the device, and a plurality of overhang structures. The first sub-pixel includes a first anode, OLED material, a first cathode, and a first encapsulation layer having a gap defined by a first portion of the first encapsulation layer disposed over the first cathode, a second portion of the first encapsulation layer disposed over a sidewall of the body structure, and a third portion of the first encapsulation layer under an underside surface of the top extension of the top structure, the first portion of the first encapsulation layer contacting the third portion of the first encapsulation layer.

Abstract: The present disclosure relates to a manufacturing method for a packaging substrate and a packaging substrate utilizing the method. The packaging substrate according to the present disclosure includes; a core layer including a glass substrate having first and second surfaces facing each other and a cavity portion; an insulating layer formed on the first surface; and a light transmitting portion formed on an upper surface of the insulating layer, wherein a light receiving portion is disposed in the cavity portion, the insulating layer includes a via penetrating in a thickness direction, and a portion of a lower surface of the light transmitting portion may abut on the via. Though it, the packaging substrate may be compactly manufactured by reducing the space for the configuration of electrically connecting the conventional photoelectric elements, and the effect of improving the sensing efficiency and performance of the photoelectric sensor relative to the space may occur.

Abstract: Embodiments relate to packaging substrates and methods of manufacturing the same. A substrate with embedded elements according to the embodiments comprises a glass substrate comprising a first surface and a second surface facing each other; and an upper layer stacked on the first surface, or a lower layer stacked on the second surface; wherein the glass substrate may have an edge region that protrudes from the upper layer or the lower layer. A manufacturing method of a packaging substrate, comprises a forming operation of an upper layer on a first surface of a glass substrate comprising the first surface and a second surface facing each other; a removing operation of the upper layer by a predetermined width along a predetermined cutting line; a forming operation of a filamentation along the cutting line on the glass substrate from which the upper layer has been removed; and a cutting operation of the glass substrate using the filamentation.

Abstract: A display device includes a substrate comprising a plurality of pixel areas and a non-pixel area surrounding each of the plurality of pixel areas. The non-pixel area includes a plurality of first areas and a second area surrounding the plurality of first areas. A functional layer is disposed on the substrate and includes a plurality of first holes defined through the functional layer and overlapping the plurality of first areas. An element layer is disposed on the functional layer. A pixel definition layer is disposed on the element layer and overlaps the non-pixel area. The pixel definition layer includes pixel openings defined therethrough. The pixel openings overlap the plurality of pixel areas. A plurality of light emitting elements is disposed on the element layer and is disposed in the pixel openings.

Abstract: Disclosed is an apparatus for processing a substrate, the apparatus including: a chamber having a processing space for processing a substrate; a support unit disposed in the processing space and for supporting the substrate; a liquid discharge unit for supplying a treatment solution to the substrate and processing the substrate when processing the substrate; and a liquid supply unit for supplying a treatment solution to the liquid discharge unit, in which the liquid supply unit includes: a tank for storing the treatment solution; a liquid supply line for supplying the treatment solution in the tank to the liquid discharge unit; a vent line connected to the tank to discharge water-containing gas in the tank; a heater for heating the treatment solution in the tank or the treatment solution circulating from the tank; and a condensate discharge line connected to the vent line and for discharging condensate generated from the water-containing gas.

Abstract: The present disclosure relates to a method of manufacturing a packaging substrate and a packaging substrate manufactured thereby. The method of manufacturing a packaging substrate according to the present disclosure includes: generating a glass structure that is a core via, a cavity portion, or both on a glass core including a first surface and a second surface facing each other; forming an insulating layer on the first surface or second surface using an insulating film; and forming an upper layer including an upper distribution layer and an upper surface connection layer on the insulating layer. The forming of the insulating layer May include a primary curing operation of laminating a first insulating film on the first surface and primarily curing the first insulating film, and a secondary curing operation of laminating a second insulating film on the primarily cured first insulating film and secondarily curing the second insulating film.