Abstract: Provided is an integrated circuit. The integrated circuit includes: a first standard cell comprising a P-type Fin Field Effect Transistor (FinFET) region and an N-type FinFET region; and a filler cell adjacent to the first standard cell in a first direction and including a first region and a second region arranged in a second direction perpendicular to the first direction, wherein the first region includes a plurality of first insulating structures spaced apart from each other in the first direction, and the second region includes a second insulating structure having a width greater than that of at least one of the plurality of first insulating structures in the first direction, and one of the first region and the second region is arranged adjacent to the P-type FinFET region in the first direction and the other is arranged adjacent to the N-type FinFET region in the first direction.

Abstract: A semiconductor device is provided. A semiconductor device includes a filler cell including first and second insulating structures, the first and second insulating structures extending in a first direction, the filler cell being defined by first cell boundaries; and a neighboring cell including a third insulating structure, the third insulating structure extending in the first direction, the neighboring cell being adjacent to the filler cell in the first direction and defined by second cell boundaries, wherein the first and second insulating structures are spaced apart from one another in a second direction, is the second direction being perpendicular to the first direction.

Abstract: Provided is an integrated circuit. The integrated circuit includes: a first standard cell comprising a P-type Fin Field Effect Transistor (FinFET) region and an N-type FinFET region; and a filler cell adjacent to the first standard cell in a first direction and including a first region and a second region arranged in a second direction perpendicular to the first direction, wherein the first region includes a plurality of first insulating structures spaced apart from each other in the first direction, and the second region includes a second insulating structure having a width greater than that of at least one of the plurality of first insulating structures in the first direction, and one of the first region and the second region is arranged adjacent to the P-type FinFET region in the first direction and the other is arranged adjacent to the N-type FinFET region in the first direction.

Abstract: A semiconductor device is provided. A semiconductor device includes a filler cell including first and second insulating structures, the first and second insulating structures extending in a first direction, the filler cell being defined by first cell boundaries; and a neighboring cell including a third insulating structure, the third insulating structure extending in the first direction, the neighboring cell being adjacent to the filler cell in the first direction and defined by second cell boundaries, wherein the first and second insulating structures are spaced apart from one another in a second direction, is the second direction being perpendicular to the first direction.

Abstract: A semiconductor device may include a logic circuit and one or more power gating transistor switches. The logic circuit may be connected between a power voltage and a ground voltage, and may perform one or more logic operations. The one or more power gating transistor switches may include a plurality of power gating transistors and poly resistors, and may switch application of the power voltage to the logic circuit according to an active mode, a sleep mode, or active and sleep modes of the logic circuit. The one or more power gating transistor switches may use the poly resistors to sequentially apply the power voltage to the logic circuit, to sequentially block the application of the power voltage to the logic circuit, or to sequentially apply the power voltage to the logic circuit and to sequentially block the application of the power voltage to the logic circuit.

Abstract: A semiconductor device may include a logic circuit and one or more power gating transistor switches. The logic circuit may be connected between a power voltage and a ground voltage, and may perform one or more logic operations. The one or more power gating transistor switches may include a plurality of power gating transistors and poly resistors, and may switch application of the power voltage to the logic circuit according to an active mode, a sleep mode, or active and sleep modes of the logic circuit. The one or more power gating transistor switches may use the poly resistors to sequentially apply the power voltage to the logic circuit, to sequentially block the application of the power voltage to the logic circuit, or to sequentially apply the power voltage to the logic circuit and to sequentially block the application of the power voltage to the logic circuit.