Abstract: In a double data rate (DDR) counter and counting method used in, for example, an analog-to-digital conversion in, for example, a CMOS image sensor and method, a first stage of the counter generates a least significant bit (LSB) of the value in the counter. The first stage includes a first clock input and is edge-triggered on one of the rising and falling edges of a signal applied at the first clock input. The counter includes at least one second stage for generating another bit of the value in the counter. The second stage includes a second clock input and is edge-triggered on the other of the rising and falling edges of a signal applied at the second clock input.

Abstract: Disclosed is a wireless communication system including an apparatus and a method for feeding back channel information of a User Equipment (UE); a Base Station (BS) for receiving channel information of a UE and for communicating with the UE; and a communication method of the BS which can dynamically switch between Single-User Multiple-Input Multiple-Output (SU-MIMO) and Multiple-User Multiple-Input Multiple-Output (MU-MIMO) access schemes.

Abstract: A counter includes a buffer unit and a ripple counter. The buffer unit generates at least one least significant signal of a count by buffering at least one clock signal until a termination time point. The ripple counter generates at least one most significant signal of the count by sequentially toggling in response to at least one of the least significant signal. The counter performs multiple data rate counting with enhance operation speed and reduced power consumption.

Abstract: The image sensor includes a plurality of column lines, a plurality of active road circuits and a selection circuit. The plurality of column lines are each connected to a corresponding one of a plurality of pixels. The plurality of active road circuits are each connected to a corresponding one of the plurality of column lines. The selection circuit is configured to enable a portion of the plurality of active road circuits based on a plurality of column selection signals.

Abstract: A light emitting display device includes a first electrode formed at a light emitting region of a first substrate; a transparent oxide thin film of about 1 ? to about 200 ? in thickness formed on an entire surface of the first electrode at the light emitting region to substantially cover particle on the entire surface of the first electrode; an organic light emitting layer formed on an entire surface of the oxide thin film to emit a light; and a second electrode formed on an entire surface of the first substrate including the organic light emitting layer.

Abstract: Provided is a three-dimensional aluminum package module including: an aluminum substrate; an aluminum oxide layer formed on the aluminum substrate and having at least one first opening of which sidewalls are perpendicular to an upper surface of the aluminum substrate; a semiconductor device mounted in the first opening using an adhesive; an organic layer covering the aluminum oxide layer and the semiconductor device; and a first interconnection line and a passive device circuit formed on the organic layer and the aluminum oxide layer.

Abstract: A package substrate, a manufacturing method thereof, a base package module, and a multi-layered package module having package substrates laminated on upper and lower portions of a base package module are provided. The base package module includes a base metal substrate, a first metal oxide layer that is formed on the base metal substrate to have a cavity therein, a device that is mounted in the cavity on the base metal substrate and insulated by the first metal oxide layer formed on a sidewall in the cavity, and a conductor that is connected to the device and a wiring pad formed on the first metal oxide layer on the base metal substrate. The package substrate includes a wiring pad, a conductor line, a second metal oxide layer having an opening that exposes a device, and a via that is connected to the wiring pad through a connection pad in the second metal oxide layer.

Abstract: Provided is a three-dimensional aluminum package module including: an aluminum substrate; an aluminum oxide layer formed on the aluminum substrate and having at least one first opening of which sidewalls are perpendicular to an upper surface of the aluminum substrate; a semiconductor device mounted in the first opening using an adhesive; an organic layer covering the aluminum oxide layer and the semiconductor device; and a first interconnection line and a passive device circuit formed on the organic layer and the aluminum oxide layer.

Abstract: A method for manufacturing passive devices and semiconductor packages using a thin metal piece is provided. According to the method, an adhesive layer is formed on a dummy substrate; a thin metal piece is bonded on the adhesive layer; a masking material is attached to the thin metal piece, a dielectric layer is formed; a masking material is attached to form metal pads; a metal pad is formed, and the formed device is attached to a lower substrate using the metal pads; the adhesive layer and the dummy substrate are removed, a masking material is attached on a surface exposed, a region where passive devices are to be formed is patterned, and the thin metal piece is etched at a predetermined depth; and solder bumps for surface mounting are formed.

Abstract: A multi-antenna wireless transmission apparatus for multiple receiving terminals includes a channel characteristic acquiring unit to acquire characteristic parameters of a wireless transmission channel between a transmitting party antenna and a receiving party antenna, a coefficient calculator to use the characteristic parameters of the wireless transmission channel to calculate coefficients configured such that the transmitting party sets a ratio of received power for a transmission signal at the receiving party to intensity of interference and noise of the transmission signal, and a precoder to multiply an input signal by a matrix whose elements are the coefficients calculated by the coefficient calculator and to output an output signal. The output signal is to be transmitted from the transmitting party antenna to the receiving party antenna.

Abstract: In a double data rate (DDR) counter and counting method used in, for example, an analog-to-digital conversion in, for example, a CMOS image sensor and method, a first stage of the counter generates a least significant bit (LSB) of the value in the counter. The counter includes at least one second stage for generating another bit of the value in the counter. An input clock signal is applied to a data input of the first stage and a clock input of the second stage.

Abstract: In a double data rate (DDR) counter and counting method used in, for example, an analog-to-digital conversion in, for example, a CMOS image sensor and method, a first stage of the counter generates a least significant bit (LSB) of the value in the counter. The first stage includes a first clock input and is edge-triggered on one of the rising and falling edges of a signal applied at the first clock input. The counter includes at least one second stage for generating another bit of the value in the counter. The second stage includes a second clock input and is edge-triggered on the other of the rising and falling edges of a signal applied at the second clock input.

Abstract: A method for manufacturing passive devices and semiconductor packages using a thin metal piece is provided. According to the method, an adhesive layer is formed on a dummy substrate; a thin metal piece is bonded on the adhesive layer; a masking material is attached to the thin metal piece, a dielectric layer is formed; a masking material is attached to form metal pads; a metal pad is formed, and the formed device is attached to a lower substrate using the metal pads; the adhesive layer and the dummy substrate are removed, a masking material is attached on a surface exposed, a region where passive devices are to be formed is patterned, and the thin metal piece is etched at a predetermined depth; and solder bumps for surface mounting are formed.

Abstract: A metal-based photonic device package module that is capable of greatly improving heat releasing efficiency and implementing a thin package is provided. The metal-based photonic device package module includes a metal substrate that is formed the shape of a plate, a metal oxide layer that is formed on the metal substrate to have a mounting cavity, a photonic device that is mounted in the mounting cavity of the metal oxide layer, and a reflecting plane that is formed at an inner surface of the mounting cavity of the metal oxide layer.

Abstract: A method for manufacturing passive devices and semiconductor packages using a thin metal piece is provided. According to the method, an adhesive layer is formed on a dummy substrate; a thin metal piece is bonded on the adhesive layer; a masking material is attached to the thin metal piece, a region where vias are to be formed is patterned, the thin metal piece is etched at a predetermined depth; the masking material is removed, the etched portion is filled with polymer to form a flat polymer layer, a masking material is attached on the polymer layer, a region that is to be attached to an IPD or an IC chip is patterned, a metal pad is formed, and the formed devices are attached to a lower substrate using the metal pad; the adhesive layer and the dummy substrate are removed, a masking material is attached on a surface exposed, a region where passive devices are to be formed is patterned, and the thin metal piece is etched at a predetermined depth; and solder bumps for surface mounting are formed.

Abstract: Disclosed are an electronic device case provided with a touch sensor unit having an improved adherence structure and a method for manufacturing the same. The electronic device case includes a cover, and a touch sensor unit arranged on a front surface of the cover.

Abstract: The present disclosure relates to a WDM-PON optical transmitter; and, more particularly, to a system for controlling a driving current of the WDM-PON optical transmitter. The present disclosure provides a driving current control system of an optical transmitter for use in WDM-PON including a plurality of optical transmitters, each transmitter generating and transmitting a transmittance optical signal based on a driving current and an optical multiplexer/demultiplexer for combining the optical signals received from the plurality of the optical transmitters to output a combined optical signal through a single common terminal, wherein the driving current is controlled based on the combined optical signal outputted from the common terminal.

Abstract: The invention is related to an injection light generator for use in a wavelength division multiplexed-passive optical network, which generates A-band injection light having a spectrum range separated into N wavelength ranges (N is a natural number equal to or greater than 2) to be used for a transmission of a downstream optical signal and B-band injection light having a spectrum range separated into N wavelength ranges to be used for a transmission of an upstream optical signal.

Abstract: The present disclosure relates to a WDM-PON (wavelength division multiplexed-passive optical network) optical transmitter; and, more particularly, to a system for controlling driving current of the WDM-PON optical transmitter. The present disclosure provides a driving current control method of the optical transmitter for in use in the WDM-PON, including: setting an attenuation value of a variable optical attenuator to X; detecting an optical power Px received by a monitoring photo diode of the optical transmitter; setting an attenuation value of the variable optical attenuator to Y; detecting an optical power Py received by the monitoring photo diode of the optical transmitter; calculating an optical power Pout of an optical signal outputted from a common terminal of a 1×N optical multiplexer/demultiplexer based on the detected optical power Px and Py; and controlling a driving current based on the calculated optical power Pout.

Abstract: Disclosed herein is a method of constructing an environmental map using sonar sensors. The method includes the steps of checking whether conflict cells have occurred using input sonar sensor data; if conflict cells have occurred, selecting incorrect data and eliminating the conflict cells using sound pressure comparison until the conflict cells do not occur any longer; and once the elimination has completed, preparing a grid map using a Maximum Approximated Likelihood (MAL) approach. Inconsistency in data occurs when multiple pieces of sensor data overlap each other, the conflict cells are cells that experience inconsistency over an entire arc region, and candidates for the incorrect sonar sensor data are obtained when the conflict cells occur.