Abstract: A method of manufacturing a package module structure of a high power device using a metal substrate that can improve reliability by minimizing stress due to a thermal expansion coefficient difference between a metal substrate and a semiconductor device includes: preparing a metal substrate; forming an oxide layer by selectively anodizing the metal substrate; forming a mounting groove for mounting a semiconductor device by etching a portion of the oxide layer; installing a shock-absorbing substrate that is made of a material having a thermal expansion coefficient in a range similar to a material of a semiconductor device to expose the entirety or a portion of a bottom portion of the mounting groove; mounting the semiconductor device in the shock-absorbing substrate exposed to the mounting groove; and electrically connecting an electrode terminal of the semiconductor device and an electrode line formed in an upper surface of the oxide layer.

Abstract: The present invention relates to a terminal-integrated package method for a metal base package module that can effectively prevent short-circuit or breakage by not using wire bonding for connection with an external circuit.

Abstract: A method of manufacturing a package module structure of a high power device using a metal substrate that can improve reliability by minimizing stress due to a thermal expansion coefficient difference between a metal substrate and a semiconductor device includes: preparing a metal substrate; forming an oxide layer by selectively anodizing the metal substrate; forming a mounting groove for mounting a semiconductor device by etching a portion of the oxide layer; installing a shock-absorbing substrate that is made of a material having a thermal expansion coefficient in a range similar to a material of a semiconductor device to expose the entirety or a portion of a bottom portion of the mounting groove; mounting the semiconductor device in the shock-absorbing substrate exposed to the mounting groove; and electrically connecting an electrode terminal of the semiconductor device and an electrode line formed in an upper surface of the oxide layer.

Abstract: The present invention relates to an elastic support module and a rack bar supporting device for a vehicle steering apparatus, which includes the elastic support module. By the present invention, it is possible to prevent a noise from being produced due to the increase of a clearance caused when a vehicle loses the driving durability thereof to a certain degree and hence a support yoke of the vehicle is worn, or due to an impact reversely input from a road surface, and hence to provide a pleasant steering feeling for a driver when steering the vehicle.

Abstract: The present invention relates to a rack bar supporting device for a vehicle steering apparatus. According to the present invention, a clearance between the rack bar and a support yoke can be kept always constant when the vehicle steering apparatus is operated, which makes it possible to reduce operational friction and noise, to maintain the supporting force of the support yoke and the rack bar to be constant for a long time, and to improve a steering feeling of a driver.

Abstract: A method of manufacturing a metal base package having a via structure that can provide via forming technology for a cheap 3D package and form a via having a high aspect ratio of various sizes is provided. The method of manufacturing a metal base package having a via structure includes: preparing a metal substrate; forming an oxidation prevention mask pattern in the prepared metal substrate; forming a metal oxide layer by oxidizing a metal substrate portion that is exposed between the oxidation prevention mask patterns in a predetermined depth; removing the oxidation prevention mask pattern; forming a via forming mask pattern on the metal substrate and the metal oxide layer; forming a via in the metal oxide layer by performing chemical etching; removing the via forming mask pattern; and forming a conducting layer with a conductive material at the inside of the formed via.

Abstract: The present disclosure relates to a WDM-PON optical transmitter; and, more particularly, to a system for controlling a driving current of the WDM-PON optical transmitter. The present disclosure provides a driving current control system of an optical transmitter for use in WDM-PON including a plurality of optical transmitters, each transmitter generating and transmitting a transmittance optical signal based on a driving current and an optical multiplexer/demultiplexer for combining the optical signals received from the plurality of the optical transmitters to output a combined optical signal through a single common terminal, wherein the driving current is controlled based on the combined optical signal outputted from the common terminal.

Abstract: A metal-based photonic device package module that is capable of greatly improving heat releasing efficiency and implementing a thin package is provided. The metal-based photonic device package module includes a metal substrate that is formed the shape of a plate, a metal oxide layer that is formed on the metal substrate to have a mounting cavity, a photonic device that is mounted in the mounting cavity of the metal oxide layer, and a reflecting plane that is formed at an inner surface of the mounting cavity of the metal oxide layer.

Abstract: The present disclosure relates to a WDM-PON (wavelength division multiplexed-passive optical network) optical transmitter; and, more particularly, to a system for controlling driving current of the WDM-PON optical transmitter. The present disclosure provides a driving current control method of the optical transmitter for in use in the WDM-PON, including: setting an attenuation value of a variable optical attenuator to X; detecting an optical power Px received by a monitoring photo diode of the optical transmitter; setting an attenuation value of the variable optical attenuator to Y; detecting an optical power Py received by the monitoring photo diode of the optical transmitter; calculating an optical power Pout of an optical signal outputted from a common terminal of a 1×N optical multiplexer/demultiplexer based on the detected optical power Px and Py; and controlling a driving current based on the calculated optical power Pout.

Abstract: In a method of forming a pattern, a mold layer having an opening is formed on a substrate. A conductive layer is formed on the mold layer having the opening, the conductive layer having a substantially uniform thickness. A buffer layer pattern is formed in the opening having the conductive layer, the buffer layer pattern having a cross-linked structure of water-soluble copolymers including a repeating unit of N-vinyl-2-pyrrolidone and a repeating unit of acrylate. An upper portion of the conductive layer exposed over the buffer layer pattern is etched. Accordingly, a conductive pattern for a semiconductor device is formed on the substrate. The method of forming a pattern may simplify manufacturing processes for a capacitor and a semiconductor device, and may improve their efficiencies.

Abstract: Provided is a three-dimensional aluminum package module including: an aluminum substrate; an aluminum oxide layer formed on the aluminum substrate and having at least one first opening of which sidewalls are perpendicular to an upper surface of the aluminum substrate; a semiconductor device mounted in the first opening using an adhesive; an organic layer covering the aluminum oxide layer and the semiconductor device; and a first interconnection line and a passive device circuit formed on the organic layer and the aluminum oxide layer.

Abstract: Provided is a three-dimensional aluminum package module including: an aluminum substrate; an aluminum oxide layer formed on the aluminum substrate and having at least one first opening of which sidewalls are perpendicular to an upper surface of the aluminum substrate; a semiconductor device mounted in the first opening using an adhesive; an organic layer covering the aluminum oxide layer and the semiconductor device; and a first interconnection line and a passive device circuit formed on the organic layer and the aluminum oxide layer.

Abstract: A package substrate, a manufacturing method thereof, a base package module, and a multi-layered package module having package substrates laminated on upper and lower portions of a base package module are provided. The base package module includes a base metal substrate, a first metal oxide layer that is formed on the base metal substrate to have a cavity therein, a device that is mounted in the cavity on the base metal substrate and insulated by the first metal oxide layer formed on a sidewall in the cavity, and a conductor that is connected to the device and a wiring pad formed on the first metal oxide layer on the base metal substrate. The package substrate includes a wiring pad, a conductor line, a second metal oxide layer having an opening that exposes a device, and a via that is connected to the wiring pad through a connection pad in the second metal oxide layer.

Abstract: Provided is a three-dimensional aluminum package module including: an aluminum substrate; an aluminum oxide layer formed on the aluminum substrate and having at least one first opening of which sidewalls are perpendicular to an upper surface of the aluminum substrate; a semiconductor device mounted in the first opening using an adhesive; an organic layer covering the aluminum oxide layer and the semiconductor device; and a first interconnection line and a passive device circuit formed on the organic layer and the aluminum oxide layer.

Abstract: A method for manufacturing passive devices and semiconductor packages using a thin metal piece is provided. According to the method, an adhesive layer is formed on a dummy substrate; a thin metal piece is bonded on the adhesive layer; a masking material is attached to the thin metal piece, a dielectric layer is formed; a masking material is attached to form metal pads; a metal pad is formed, and the formed device is attached to a lower substrate using the metal pads; the adhesive layer and the dummy substrate are removed, a masking material is attached on a surface exposed, a region where passive devices are to be formed is patterned, and the thin metal piece is etched at a predetermined depth; and solder bumps for surface mounting are formed.

Abstract: A method for manufacturing passive devices and semiconductor packages using a thin metal piece is provided. According to the method, an adhesive layer is formed on a dummy substrate; a thin metal piece is bonded on the adhesive layer; a masking material is attached to the thin metal piece, a dielectric layer is formed; a masking material is attached to form metal pads; a metal pad is formed, and the formed device is attached to a lower substrate using the metal pads; the adhesive layer and the dummy substrate are removed, a masking material is attached on a surface exposed, a region where passive devices are to be formed is patterned, and the thin metal piece is etched at a predetermined depth; and solder bumps for surface mounting are formed.

Abstract: A metal-based photonic device package module that is capable of greatly improving heat releasing efficiency and implementing a thin package is provided. The metal-based photonic device package module includes a metal substrate that is formed the shape of a plate, a metal oxide layer that is formed on the metal substrate to have a mounting cavity, a photonic device that is mounted in the mounting cavity of the metal oxide layer, and a reflecting plane that is formed at an inner surface of the mounting cavity of the metal oxide layer.

Abstract: A method for manufacturing passive devices and semiconductor packages using a thin metal piece is provided. According to the method, an adhesive layer is formed on a dummy substrate; a thin metal piece is bonded on the adhesive layer; a masking material is attached to the thin metal piece, a region where vias are to be formed is patterned, the thin metal piece is etched at a predetermined depth; the masking material is removed, the etched portion is filled with polymer to form a flat polymer layer, a masking material is attached on the polymer layer, a region that is to be attached to an IPD or an IC chip is patterned, a metal pad is formed, and the formed devices are attached to a lower substrate using the metal pad; the adhesive layer and the dummy substrate are removed, a masking material is attached on a surface exposed, a region where passive devices are to be formed is patterned, and the thin metal piece is etched at a predetermined depth; and solder bumps for surface mounting are formed.

Abstract: The invention is related to an injection light generator for use in a wavelength division multiplexed-passive optical network, which generates A-band injection light having a spectrum range separated into N wavelength ranges (N is a natural number equal to or greater than 2) to be used for a transmission of a downstream optical signal and B-band injection light having a spectrum range separated into N wavelength ranges to be used for a transmission of an upstream optical signal.

Abstract: The present disclosure relates to a WDM-PON optical transmitter; and, more particularly, to a system for controlling a driving current of the WDM-PON optical transmitter. The present disclosure provides a driving current control system of an optical transmitter for use in WDM-PON including a plurality of optical transmitters, each transmitter generating and transmitting a transmittance optical signal based on a driving current and an optical multiplexer/demultiplexer for combining the optical signals received from the plurality of the optical transmitters to output a combined optical signal through a single common terminal, wherein the driving current is controlled based on the combined optical signal outputted from the common terminal.