Patents by Inventor Kyoung Rok Lim

Kyoung Rok Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11674196
    Abstract: A steel reinforcing bar contains 0.06 wt % to 0.11 wt % carbon, more than 0 and not more than 0.25 wt % silicon, 0.8 wt % or more and less than 2.0 wt % manganese, more than 0 and not more than 0.01 wt % phosphorus, more than 0 and not more than 0.01 wt % sulfur, 0.01 to 0.03 wt % aluminum, 0.50 to 1.00 wt % nickel, 0.027 to 0.125 wt % molybdenum, more than 0 and not more than 0.25 wt % chromium, more than 0 and not more than 0.28 wt % copper, more than 0 and not more than 0.01 wt % nitrogen, and the remainder being iron and unavoidable impurities. The reinforcing bar has a surface layer and a core. The surface layer has a hardened layer of tempered martensite, and the core has a mixed structure of bainite, ferrite and pearlite.
    Type: Grant
    Filed: January 22, 2018
    Date of Patent: June 13, 2023
    Assignee: Hyundai Steel Company
    Inventors: Jun Ho Chung, Tae Hyung Kim, Ju Sang Lee, Se Jin Kim, Kyoung Rok Lim
  • Publication number: 20200347480
    Abstract: A steel reinforcing bar contains 0.06 wt % to 0.11 wt % carbon, more than 0 and not more than 0.25 wt % silicon, 0.8 wt % or more and less than 2.0 wt % manganese, more than 0 and not more than 0.01 wt % phosphorus, more than 0 and not more than 0.01 wt % sulfur, 0.01 to 0.03 wt % aluminum, 0.50 to 1.00 wt % nickel, 0.027 to 0.125 wt % molybdenum, more than 0 and not more than 0.25 wt % chromium, more than 0 and not more than 0.28 wt % copper, more than 0 and not more than 0.01 wt % nitrogen, and the remainder being iron and unavoidable impurities. The reinforcing bar has a surface layer and a core. The surface layer has a hardened layer of tempered martensite, and the core has a mixed structure of bainite, ferrite and pearlite.
    Type: Application
    Filed: January 22, 2018
    Publication date: November 5, 2020
    Inventors: Jun Ho Chung, Tae Hyung Kim, Ju Sang Lee, Se Jin Kim, Kyoung Rok Lim