Abstract: The present invention relates to a method of packaging a field emission display. The method of packaging a field emission display, comprising the steps of: forming an opening on a selected area of a lower substrate on which field emission elements are formed and forming a silicon layer on a lower surface of said lower substrate; combining a upper substrate, on which a transparent electrode and luminescent material are formed, and said lower substrate by a lateral wall; placing a cap on said opening after performing a vacuum process through said opening; performing a thermal treatment process so that said cap is combined with said silicon layer by silicide created by the reaction of said cap and said silicon layer, thereby sealing said opening; and completely sealing said opening by adhesives.