Patents by Inventor Kyoung Soon Cho

Kyoung Soon Cho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package
    Patent number: 11600608
    Abstract: A semiconductor package includes a first semiconductor chip on a substrate, a second semiconductor chip on the substrate and spaced apart from the first semiconductor device, a mold layer on the substrate and covering sides of the first and second semiconductor chips, and an image sensor unit on the first and second semiconductor chips and the mold layer. The image sensor unit is electrically connected to the first semiconductor chip.
    Type: Grant
    Filed: March 17, 2021
    Date of Patent: March 7, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jichul Kim, Chajea Jo, Sang-Uk Han, Kyoung Soon Cho, Jae Choon Kim, Woohyun Park
  • SEMICONDUCTOR PACKAGE
    Publication number: 20210202462
    Abstract: A semiconductor package includes a first semiconductor chip on a substrate, a second semiconductor chip on the substrate and spaced apart from the first semiconductor device, a mold layer on the substrate and covering sides of the first and second semiconductor chips, and an image sensor unit on the first and second semiconductor chips and the mold layer. The image sensor unit is electrically connected to the first semiconductor chip.
    Type: Application
    Filed: March 17, 2021
    Publication date: July 1, 2021
    Inventors: JICHUL KIM, CHAJEA JO, SANG-UK HAN, KYOUNG SOON CHO, JAE CHOON KIM, WOOHYUN PARK
  • Semiconductor package
    Patent number: 10985152
    Abstract: A semiconductor package includes a first semiconductor chip on a substrate, a second semiconductor chip on the substrate and spaced apart from the first semiconductor device, a mold layer on the substrate and covering sides of the first and second semiconductor chips, and an image sensor unit on the first and second semiconductor chips and the mold layer. The image sensor unit is electrically connected to the first semiconductor chip.
    Type: Grant
    Filed: July 3, 2019
    Date of Patent: April 20, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jichul Kim, Chajea Jo, Sang-Uk Han, Kyoung Soon Cho, Jae Choon Kim, Woohyun Park
  • Semiconductor package
    Patent number: 10510737
    Abstract: A semiconductor package includes a first semiconductor chip on a substrate, a second semiconductor chip on the substrate and spaced apart from the first semiconductor device, a mold layer on the substrate and covering sides of the first and second semiconductor chips, and an image sensor unit on the first and second semiconductor chips and the mold layer. The image sensor unit is electrically connected to the first semiconductor chip.
    Type: Grant
    Filed: October 18, 2017
    Date of Patent: December 17, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jichul Kim, Chajea Jo, Sang-Uk Han, Kyoung Soon Cho, Jae Choon Kim, Woohyun Park
  • SEMICONDUCTOR PACKAGE
    Publication number: 20190348407
    Abstract: A semiconductor package includes a first semiconductor chip on a substrate, a second semiconductor chip on the substrate and spaced apart from the first semiconductor device, a mold layer on the substrate and covering sides of the first and second semiconductor chips, and an image sensor unit on the first and second semiconductor chips and the mold layer. The image sensor unit is electrically connected to the first semiconductor chip.
    Type: Application
    Filed: July 3, 2019
    Publication date: November 14, 2019
    Inventors: JICHUL KIM, CHAJEA JO, SANG-UK HAN, KYOUNG SOON CHO, JAE CHOON KIM, WOOHYUN PARK
  • SEMICONDUCTOR PACKAGE
    Publication number: 20180301443
    Abstract: A semiconductor package includes a first semiconductor chip on a substrate, a second semiconductor chip on the substrate and spaced apart from the first semiconductor device, a mold layer on the substrate and covering sides of the first and second semiconductor chips, and an image sensor unit on the first and second semiconductor chips and the mold layer. The image sensor unit is electrically connected to the first semiconductor chip.
    Type: Application
    Filed: October 18, 2017
    Publication date: October 18, 2018
    Inventors: JICHUL KIM, CHAJEA JO, SANG-UK HAN, KYOUNG SOON CHO, JAE CHOON KIM, WOOHYUN PARK
  • Holder-ring for earphone plug
    Patent number: 6480612
    Abstract: A holder-ring for an earphone plug is provided. The holder-ring has a main cylindrical body. A flange is integrally formed at the upper end and extends outward and downward therefrom. The flange is spaced from the outer surface of the main cylindrical body by a predetermined distance so that a space opened at its lower end is provided therebetween. The flange has at its upper end a plurality of small through holes.
    Type: Grant
    Filed: June 8, 2001
    Date of Patent: November 12, 2002
    Assignee: Koryo Industrial Co., Ltd.
    Inventor: Kyoung Soon Cho
  • Holder-ring for earphone plug
    Publication number: 20010050997
    Abstract: A holder-ring for an earphone plug is provided. The holder-ring has a main cylindrical body. A flange is integrally formed at the upper end and extends outward and downward therefrom. The flange is spaced from the outer surface of the main cylindrical body by a predetermined distance so that a space opened at its lower end is provided therebetween. The flange has at its upper end a plurality of small through holes.
    Type: Application
    Filed: June 8, 2001
    Publication date: December 13, 2001
    Inventor: Kyoung Soon Cho