Abstract: An embodiment sulfur dioxide-based inorganic electrolyte is provided in which the sulfur dioxide-based inorganic electrolyte is represented by a chemical formula M·(A1·Cl(4-x)Fx)z·ySO2. In this formula, M is a first element selected from the group consisting of Li, Na, K, Ca, and Mg, A1 is a second element selected from the group consisting of Al, Fe, Ga, and Cu, x satisfies a first equation 0?x?4, y satisfies a second equation 0?y?6, and z satisfies a third equation 1?z?2.

Abstract: A photoresist supplying system includes a pump that includes a first tube phragm that stores a photoresist and a filter that filters the photoresist, a second tube phragm that stores the photoresist and is disposed outside the pump, where the second tube phragm transfers the photoresist to the first tube phragm, a storage unit that stores the photoresist, where the storage unit provides the photoresist to the second tube phragm, and a tube phragm drive unit that is connected to the first tube phragm. The tube phragm drive unit adjusts an interior volume of the first tube phragm and applies a pressure to a flexible outer wall of the first tube phragm to transfer the photoresist from the first tube phragm to a nozzle installed in the chamber. At least a part of the photoresist stored in the first tube phragm is transferred to the second tube phragm.

Abstract: A manufacturing apparatus for a semiconductor device, the manufacturing apparatus including a spin chuck configured to fix and rotate a wafer; a nozzle configured to spray a chemical toward the wafer; a lateral displacement sensor configured to measure a displacement variation to a lateral surface of the wafer while the spin chuck is rotating; and a controller configured to control a position of the nozzle by using the displacement variation while the spin chuck is rotating.

Abstract: A photoresist supplying system includes a pump that includes a first tube phragm that stores a photoresist and a filter that filters the photoresist, a second tube phragm that stores the photoresist and is disposed outside the pump, where the second tube phragm transfers the photoresist to the first tube phragm, a storage unit that stores the photoresist, where the storage unit provides the photoresist to the second tube phragm, and a tube phragm drive unit that is connected to the first tube phragm. The tube phragm drive unit adjusts an interior volume of the first tube phragm and applies a pressure to a flexible outer wall of the first tube phragm to transfer the photoresist from the first tube phragm to a nozzle installed in the chamber. At least a part of the photoresist stored in the first tube phragm is transferred to the second tube phragm.

Abstract: An equipment diagnosis system and method, which use abnormal data and normal data of equipment and accurately and effectively perform diagnosis on the equipment, are provided. The equipment diagnosis system includes a data acquisition unit to acquire time series data of equipment, a preprocessing unit convert the time series data into frequency data including a temporal component through a Fourier transform, a deep learning unit to perform deep learning through a convolution neural network (CNN) by using the frequency data, and a diagnosis unit to determine a state of the equipment to be a normal state or a breakdown state based on the deep learning.

Abstract: A method for determining a position of a fault of equipment includes receiving a plurality of sound source signals from a plurality of sound source inputting apparatuses, determining an abnormal operation of the equipment by analyzing at least one sound source signal among the sound source signals, and extracting abnormal sound source signals from the sound source signals. The abnormal sound source signals are indicative of abnormal operation of the equipment. The method further includes determining a position of the abnormal operation based on a time difference between the abnormal sound source signals.

Abstract: A manufacturing apparatus for a semiconductor device, the manufacturing apparatus including a spin chuck configured to fix and rotate a wafer; a nozzle configured to spray a chemical toward the wafer; a lateral displacement sensor configured to measure a displacement variation to a lateral surface of the wafer while the spin chuck is being rotated; and a controller configured to control a position of the nozzle by using the displacement variation while the spin chuck is being rotated.

Abstract: A method of cleaning semiconductor equipment includes monitoring a state of a fluid in a pipeline of the semiconductor equipment, constructing a database by using data collected through the monitoring, diagnosing a state of the pipeline based on the data collected through the monitoring and stored in the database, and cleaning the pipeline by using an ultrasound wave when the state of the pipeline is diagnosed as being abnormal. The pipeline is cleaned by using at least two ultrasound wave generators.

Abstract: An EtherCAT control device and a factory automation system having the same are provided. The EtherCAT control device includes a master including a dummy EtherCAT slave controller (ESC) and a first slave configured to communicate data with the master according to an EtherCAT protocol, such that the master synchronizes a timing with the first slave according to a precision time protocol (PTP) method using the dummy ESC.

Abstract: A wafer perforating device includes a chuck stage configured to receive a wafer, a housing spaced apart in a vertical direction on the chuck stage, wherein at least one of the housing and the chuck stage moves in a first horizontal direction, and the housing and the chuck stage intersect each other on the first direction, a displacement sensor fixed within the housing and configured to measure a displacement with a surface of the wafer at a perforating point spaced apart periodically in the first direction of the wafer and a laser module fixed within the housing and configured to irradiate a laser into a perforating depth determined according to the displacement at the perforating point. The displacement sensor determines whether an upper particle and a lower particle are present at the perforating point by considering a step height of the displacement, and ignores the displacement of the perforating point with the presence of an upper particle.

Abstract: A wafer cutting apparatus includes a stage to support a wafer, a cutter, and a sensor. The cutter irradiates the wafer with a beam in a first direction to cut the wafer. The sensor is spaced apart from the cutter in a second direction different from the first direction, and measures a spaced distance between the wafer and the cutter. The sensor measures the spaced distance between the wafer and the cutter along a second cutting line parallel to a first cutting line while the cutter cuts the wafer along the first cutting line on the wafer.

Abstract: An equipment diagnosis system and method, which use abnormal data and normal data of equipment and accurately and effectively perform diagnosis on the equipment, are provided. The equipment diagnosis system includes a data acquisition unit to acquire time series data of equipment, a preprocessing unit convert the time series data into frequency data including a temporal component through a Fourier transform, a deep learning unit to perform deep learning through a convolution neural network (CNN) by using the frequency data, and a diagnosis unit to determine a state of the equipment to be a normal state or a breakdown state based on the deep learning.

Abstract: A method for determining a position of a fault of equipment includes receiving a plurality of sound source signals from a plurality of sound source inputting apparatuses, determining an abnormal operation of the equipment by analyzing at least one sound source signal among the sound source signals, and extracting abnormal sound source signals from the sound source signals. The abnormal sound source signals are indicative of abnormal operation of the equipment. The method further includes determining a position of the abnormal operation based on a time difference between the abnormal sound source signals.

Abstract: An EtherCAT control device and a factory automation system having the same are provided. The EtherCAT control device includes a master including a dummy EtherCAT slave controller (ESC) and a first slave configured to communicate data with the master according to an EtherCAT protocol, such that the master synchronizes a timing with the first slave according to a precision time protocol (PTP) method using the dummy ESC.

Abstract: An EtherCAT control device and a factory automation system having the same are provided. The EtherCAT control device includes a master including a dummy EtherCAT slave controller (ESC) and a first slave configured to communicate data with the master according to an EtherCAT protocol, such that the master synchronizes a timing with the first slave according to a precision time protocol (PTP) method using the dummy ESC.

Abstract: A method of processing measurement information in which a determined parameter value is determined at each of a plurality of measurement times including determining a predicted parameter value at each of the measurement times, determining an error range at each of the measurement times based on the predicted parameter value, obtaining a measured parameter value at each of the measurement times, and determining the determined parameter value based on the predicted parameter value, the measured parameter value, and the error range.

Abstract: A wafer perforating device includes a chuck stage configured to receive a wafer, a housing spaced apart in a vertical direction on the chuck stage, wherein at least one of the housing and the chuck stage moves in a first horizontal direction, and the housing and the chuck stage intersect each other on the first direction, a displacement sensor fixed within the housing and configured to measure a displacement with a surface of the wafer at a perforating point spaced apart periodically in the first direction of the wafer and a laser module fixed within the housing and configured to irradiate a laser into a perforating depth determined according to the displacement at the perforating point. The displacement sensor determines whether an upper particle and a lower particle are present at the perforating point by considering a step height of the displacement, and ignores the displacement of the perforating point with the presence of an upper particle.

Abstract: A wafer cutting apparatus includes a stage to support a wafer, a cutter, and a sensor. The cutter irradiates the wafer with a beam in a first direction to cut the wafer. The sensor is spaced apart from the cutter in a second direction different from the first direction, and measures a spaced distance between the wafer and the cutter. The sensor measures the spaced distance between the wafer and the cutter along a second cutting line parallel to a first cutting line while the cutter cuts the wafer along the first cutting line on the wafer.

Abstract: A method of processing measurement information in which a determined parameter value is determined at each of a plurality of measurement times including determining a predicted parameter value at each of the measurement times, determining an error range at each of the measurement times based on the predicted parameter value, obtaining a measured parameter value at each of the measurement times, and determining the determined parameter value based on the predicted parameter value, the measured parameter value, and the error range.

Abstract: An EtherCAT control device and a factory automation system having the same are provided. The EtherCAT control device includes a master including a dummy EtherCAT slave controller (ESC) and a first slave configured to communicate data with the master according to an EtherCAT protocol, such that the master synchronizes a timing with the first slave according to a precision time protocol (PTP) method using the dummy ESC.