Abstract: Disclosed are a printed circuit board for a semiconductor package and a method of manufacturing the same. Specifically, a printed circuit board for a semiconductor package includes predetermined circuit patterns, having a wire bonding portion and a bump portion for mounting a semiconductor and a soldering portion for connection to external parts, in which the bump portion has a pre-solder formed using a tin or tin alloy electroplating process. According to this invention, the pre-solder, which is formed by reflow using an electroplating process, permits easy increase of the height thereof to thus enhance bondability and underfilling capability, may be formed to a desired thickness by controlling a plating thickness, and furthermore, may be applied to a fine pitch through a masking process.