Patents by Inventor Kyoung Yeon Lee
Kyoung Yeon Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240136242Abstract: In one example, an electronic device comprises a base, a substrate over the base and comprising a top side, a bottom side, and a conductive structure, wherein the substrate further comprises a channel opening and an aperture, and wherein the bottom side of the substrate is oriented toward the base, an electronic component over the top side of the substrate and over the aperture, wherein the electronic component is coupled with the conductive structure, and a funnel over the top side of the substrate and comprising a funnel opening. A top side of the electronic component is exposed through the funnel opening. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: October 20, 2022Publication date: April 25, 2024Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Hyeon Gyu Lee, Byong Jin Kim, Kyoung Yeon Lee
-
Patent number: 11967567Abstract: A semiconductor device with EMI shield and a fabricating method thereof are provided. In one embodiment, the semiconductor device includes EMI shield on all six surfaces of the semiconductor device without the use of a discrete EMI lid.Type: GrantFiled: April 24, 2023Date of Patent: April 23, 2024Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.Inventors: Doo Soub Shin, Tae Yong Lee, Kyoung Yeon Lee, Sung Gyu Kim
-
Patent number: 11961551Abstract: A bitline sense amplifier including: an amplifier which is connected between a first sensing bitline and a second sensing bitline, and detects and amplifies a voltage difference between a first bitline and a second bitline in response to a first control signal and a second control signal; and an equalizer which is connected between a first supply line through which the first control signal is supplied and a second supply line through which the second control signal is supplied, and pre-charges the first bitline and the second bitline with a precharge voltage in response to an equalizing control signal, wherein the equalizer includes an equalizing enable transistor in which a source terminal is connected to the first supply line and performs equalizing in response to the equalizing control signal.Type: GrantFiled: January 27, 2022Date of Patent: April 16, 2024Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Soo Bong Chang, Young-Il Lim, Bok-Yeon Won, Seok Jae Lee, Dong Geon Kim, Myeong Sik Ryu, In Seok Baek, Kyoung Min Kim, Sang Wook Park
-
Publication number: 20240109858Abstract: The present invention relates to a compound capable of lowering the flammability of a non-aqueous electrolyte when included in the non-aqueous electrolyte and improving the life properties of a battery by forming an electrode-electrolyte interface which is stable at high temperatures and low in resistance, and relates to a compound represented by Formula I descried herein, a non-aqueous electrolyte solution and a lithium secondary battery both including the compound, n, m, Ak, and X are described herein.Type: ApplicationFiled: March 23, 2022Publication date: April 4, 2024Applicants: LG Chem, Ltd., LG Energy Solution, Ltd.Inventors: Jung Keun Kim, Su Jeong Kim, Mi Sook Lee, Won Kyun Lee, Duk Hun Jang, Jeong Ae Yoon, Kyoung Hoon Kim, Chul Haeng Lee, Mi Yeon Oh, Kil Sun Lee, Jung Min Lee, Esder Kang, Chan Woo Noh, Chul Eun Yeom
-
Publication number: 20240104756Abstract: An apparatus for measuring a depth of a tread groove may include: a camera module capturing a video including an upper end portion of a tire while rotating around an upper end portion of the tire having a plurality of tread grooves, the video including a plurality of frames; a control module obtaining, based on the plurality of frames, a cross-sectional width of the tire in units of pixels by adding widths and depths of each of the plurality of tread grooves in units of pixels, a width of an inner block in units of pixels, and a width of an outer block in units of pixels, the inner and outer blocks are disposed on the tire; and a conversion module converting the depth of the tread groove in units of pixels into the depth in units of pixels.Type: ApplicationFiled: January 6, 2023Publication date: March 28, 2024Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, AJOU UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATIONInventors: Jung Mo KOO, Kyoung Soo WE, Hye Yeon LEE, Gwang Jin KIM, Hyung Il KOO
-
Publication number: 20240096858Abstract: In one example, an electronic device comprises a lower substrate comprising a lower dielectric structure and a lower conductive structure, an electronic component coupled with a bottom side of the lower substrate and coupled with the lower conductive structure, an upper substrate over a top side of the lower substrate and comprising an upper dielectric structure and an upper conductive structure, an internal interconnect between the upper substrate and the lower substrate and coupled with the upper conductive structure and the lower conductive structure, and a first antenna component between the upper substrate and the lower substrate and coupled with the upper conductive structure. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: September 15, 2022Publication date: March 21, 2024Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Kyoung Yeon Lee, Jae Beom Shim, Byong Jin Kim
-
Patent number: 11915998Abstract: In one example, a semiconductor device comprises a substrate having a top surface and a bottom surface, an electronic device on the bottom surface of the substrate, a leadframe on the bottom surface of the substrate, the leadframe comprising a paddle, wherein the paddle is coupled to the electronic device, and a lead electrically coupled to the electronic device. The semiconductor device further comprises a first protective material contacting the bottom surface of the substrate and a side surface of the electronic device.Type: GrantFiled: August 12, 2022Date of Patent: February 27, 2024Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Hyung Jun Cho, Kyoung Yeon Lee, Tae Yong Lee, Jae Min Bae
-
Patent number: 11908779Abstract: A semiconductor package structure includes a substrate comprising a land structure. The land structure includes a first land section having a first height in a cross-sectional view and a second land section having a second height in the cross-sectional view that is different than the first height. A mold encapsulant is disposed adjacent a lateral portion of the first land section and is disposed below a bottom portion of the second land section. A semiconductor die is attached to the substrate, and includes a first major surface, a second major surface opposing the first major surface, and an outer perimeter. The semiconductor die further includes a bonding structure disposed adjacent the first major surface, which is coupled to the second land section such that the first land section is disposed outside the perimeter of the semiconductor die A mold member encapsulates at least portions of the semiconductor die.Type: GrantFiled: April 19, 2021Date of Patent: February 20, 2024Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Kyoung Yeon Lee, Byong Jin Kim, Jae Min Bae, Hyung Il Jeon, Gi Jeong Kim, Ji Young Chung
-
Publication number: 20240047852Abstract: A semiconductor device can comprise a substrate dielectric structure and a substrate conductive structure that traverses the substrate dielectric structure and comprises first and second substrate terminals; an electronic component with a component terminal coupled to the first substrate terminal; and a first antenna element with a first element terminal coupled to the second substrate terminal, a first element head side adjacent a first antenna pattern, a first element base side opposite the first element side, and a first element sidewall. The first element terminal can be exposed from the first element dielectric structure at the first element base side or at the first element sidewall. The first antenna pattern can be coupled to the substrate through the first element terminal. The substrate conductive structure can couple the first antenna element to the electronic component. Other examples and methods are also disclosed.Type: ApplicationFiled: August 29, 2023Publication date: February 8, 2024Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Kyoung Yeon Lee, Tae Yong Lee, Doo Soub Shin, Seon A Lee, Woo Bin Jung, Ji Yeon Ryu, Jin Young Khim
-
Publication number: 20230411303Abstract: A semiconductor device with EMI shield and a fabricating method thereof are provided. In one embodiment, the semiconductor device includes EMI shield on all six surfaces of the semiconductor device without the use of a discrete EMI lid.Type: ApplicationFiled: April 24, 2023Publication date: December 21, 2023Inventors: Doo Soub Shin, Tae Yong Lee, Kyoung Yeon Lee, Sung Gyu Kim
-
Patent number: 11742565Abstract: A semiconductor device can comprise a substrate dielectric structure and a substrate conductive structure that traverses the substrate dielectric structure and comprises first and second substrate terminals; an electronic component with a component terminal coupled to the first substrate terminal; and a first antenna element with a first element terminal coupled to the second substrate terminal, a first element head side adjacent a first antenna pattern, a first element base side opposite the first element side, and a first element sidewall. The first element terminal can be exposed from the first element dielectric structure at the first element base side or at the first element sidewall. The first antenna pattern can be coupled to the substrate through the first element terminal. The substrate conductive structure can couple the first antenna element to the electronic component. Other examples and methods are also disclosed.Type: GrantFiled: August 18, 2021Date of Patent: August 29, 2023Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Kyoung Yeon Lee, Tae Yong Lee, Doo Soub Shin, Seon A Lee, Woo Bin Jung, Ji Yeon Ryu, Jin Young Khim
-
Publication number: 20230260863Abstract: In one example, a semiconductor package comprises a substrate having a top surface and a bottom surface, an electronic device mounted on the top surface of the substrate and coupled to one or more interconnects on the bottom surface of the substrate, a cover over the electronic device, a casing around a periphery of the cover, and an encapsulant between the cover and the casing and the substrate.Type: ApplicationFiled: April 26, 2023Publication date: August 17, 2023Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Se Man Oh, Kyoung Yeon Lee, Sang Hyeon Lee, Min Cheol Shin
-
Patent number: 11664289Abstract: In one example, a semiconductor package comprises a substrate having a top surface and a bottom surface, an electronic device mounted on the top surface of the substrate and coupled to one or more interconnects on the bottom surface of the substrate, a cover over the electronic device, a casing around a periphery of the cover, and an encapsulant between the cover and the casing and the substrate.Type: GrantFiled: October 27, 2020Date of Patent: May 30, 2023Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Se Man Oh, Kyoung Yeon Lee, Sang Hyeon Lee, Min Cheol Shin
-
Patent number: 11637073Abstract: A semiconductor device with EMI shield and a fabricating method thereof are provided. In one embodiment, the semiconductor device includes EMI shield on all six surfaces of the semiconductor device without the use of a discrete EMI lid.Type: GrantFiled: July 26, 2021Date of Patent: April 25, 2023Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.Inventors: Doo Soub Shin, Tae Yong Lee, Kyoung Yeon Lee, Sung Gyu Kim
-
Publication number: 20230031119Abstract: In one example, a semiconductor device comprises a substrate having a top surface and a bottom surface, an electronic device on the bottom surface of the substrate, a leadframe on the bottom surface of the substrate, the leadframe comprising a paddle, wherein the paddle is coupled to the electronic device, and a lead electrically coupled to the electronic device. The semiconductor device further comprises a first protective material contacting the bottom surface of the substrate and a side surface of the electronic device.Type: ApplicationFiled: August 12, 2022Publication date: February 2, 2023Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Hyung Jun Cho, Kyoung Yeon Lee, Tae Yong Lee, Jae Min Bae
-
Publication number: 20230012815Abstract: In one example, a semiconductor device, includes a substrate having a substrate top side, a substrate bottom side, a substrate dielectric structure, and a substrate conductive structure. The substrate conductive structure includes a transceiver pattern proximate to a substrate top side. An antenna structure includes an antenna dielectric structure coupled to the substrate top side, an antenna conductive structure having an antenna element, and a cavity below the antenna element. The antenna element overlies the transceiver pattern. The cavity includes a cavity ceiling, a cavity base, and a cavity sidewall between the cavity ceiling and the cavity base.Type: ApplicationFiled: July 14, 2021Publication date: January 19, 2023Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Corey REICHMAN, Kyoung Yeon LEE, Se Man OH, Byong Jin KIM
-
Patent number: 11521918Abstract: In one example, a semiconductor device comprises a substrate and an electronic device on a top side of the substrate, a lead frame on the top side of the substrate over the electronic device, wherein the lead frame comprises a connection bar and a lead, a component mounted to the connection bar and the lead on a top side of the lead frame, and an encapsulant on the top side of the substrate, wherein the encapsulant contacts a side of the electronic device and a side of the component. Other examples and related methods are also disclosed herein.Type: GrantFiled: July 8, 2019Date of Patent: December 6, 2022Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Hyung Jun Cho, Kyoung Yeon Lee, Tae Yong Lee, Jae Min Bae
-
Patent number: 11417589Abstract: In one example, a semiconductor device comprises a substrate having a top surface and a bottom surface, an electronic device on the bottom surface of the substrate, a leadframe on the bottom surface of the substrate, the leadframe comprising a paddle, wherein the paddle is coupled to the electronic device, and a lead electrically coupled to the electronic device. The semiconductor device further comprises a first protective material contacting the bottom surface of the substrate and a side surface of the electronic device.Type: GrantFiled: November 17, 2020Date of Patent: August 16, 2022Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Hyung Jun Cho, Kyoung Yeon Lee, Tae Yong Lee, Jae Min Bae
-
Publication number: 20210376451Abstract: A semiconductor device can comprise a substrate dielectric structure and a substrate conductive structure that traverses the substrate dielectric structure and comprises first and second substrate terminals; an electronic component with a component terminal coupled to the first substrate terminal; and a first antenna element with a first element terminal coupled to the second substrate terminal, a first element head side adjacent a first antenna pattern, a first element base side opposite the first element side, and a first element sidewall. The first element terminal can be exposed from the first element dielectric structure at the first element base side or at the first element sidewall. The first antenna pattern can be coupled to the substrate through the first element terminal. The substrate conductive structure can couple the first antenna element to the electronic component. Other examples and methods are also disclosed.Type: ApplicationFiled: August 18, 2021Publication date: December 2, 2021Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Kyoung Yeon Lee, Tae Yong Lee, Doo Soub Shin, Seon A Lee, Woo Bin Jung, Ji Yeon Ryu, Jin Young Khim
-
Publication number: 20210351137Abstract: A semiconductor device with EMI shield and a fabricating method thereof are provided. In one embodiment, the semiconductor device includes EMI shield on all six surfaces of the semiconductor device without the use of a discrete EMI lid.Type: ApplicationFiled: July 26, 2021Publication date: November 11, 2021Inventors: Doo Soub Shin, Tae Yong Lee, Kyoung Yeon Lee, Sung Gyu Kim