Patents by Inventor Kyoung Yeon Lee
Kyoung Yeon Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250149429Abstract: In one example, an electronic device comprises a substrate defining an opening between interior sidewalls. An electronic component is disposed in the opening. A lid is disposed beneath the substrate and a first side of the electronic component, and the lid is thermally coupled to the electronic component. Component interconnects can be coupled to a second side of the electronic component opposite the first side. An antenna structure is disposed over the electronic component and electronically coupled to electronic component through the component interconnects. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: November 8, 2023Publication date: May 8, 2025Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Kyoung Yeon Lee, Byong Jin Kim, Sang Hyeon Lee
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Patent number: 12278154Abstract: In one example, a semiconductor package comprises a substrate having a top surface and a bottom surface, an electronic device mounted on the top surface of the substrate and coupled to one or more interconnects on the bottom surface of the substrate, a cover over the electronic device, a casing around a periphery of the cover, and an encapsulant between the cover and the casing and the substrate.Type: GrantFiled: April 26, 2023Date of Patent: April 15, 2025Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Se Man Oh, Kyoung Yeon Lee, Sang Hyeon Lee, Min Cheol Shin
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Patent number: 12243834Abstract: A semiconductor device with EMI shield and a fabricating method thereof are provided. In one embodiment, the semiconductor device includes EMI shield on all six surfaces of the semiconductor device without the use of a discrete EMI lid.Type: GrantFiled: April 22, 2024Date of Patent: March 4, 2025Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.Inventors: Doo Soub Shin, Tae Yong Lee, Kyoung Yeon Lee, Sung Gyu Kim
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Publication number: 20250022857Abstract: In one example, an electronic device can include a first redistribution structure. A first electronic component can be disposed on a first side of the first redistribution structure. A first passive component can be on a second side of the first redistribution structure with the first redistribution structure between the first passive component and the first electronic component. A first internal interconnect can be adjacent a lateral side of the first redistribution structure and coupled to the first redistribution structure. A second internal interconnect can be adjacent a lateral side of the first passive component and coupled to the first redistribution structure. An antenna substrate can be disposed over a first side of the first electronic component. A second redistribution structure can be disposed over a second side of the first electronic component. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: July 10, 2023Publication date: January 16, 2025Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Kyoung Yeon Lee, Byong Jin Kim, Ji Yeon Ryu
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Publication number: 20240332781Abstract: A semiconductor device includes a substrate including a conductive transceiver pattern proximate to the substrate top side. An antenna structure includes an antenna dielectric structure coupled to the substrate top side, an antenna conductive structure having an antenna element, and a cavity below the antenna element. The antenna element overlies the conductive transceiver pattern. The cavity includes a cavity ceiling, a cavity base, and a cavity sidewall. Either a bottom surface of the antenna element defines the cavity ceiling and a perimeter portion of the antenna element is fixed to the antenna dielectric structure, or the antenna dielectric structure includes a body portion having a bottom surface that defines the cavity ceiling and the antenna element is vertically spaced apart from the bottom surface of the body portion. A semiconductor component is coupled to the substrate bottom side and the transceiver pattern.Type: ApplicationFiled: June 10, 2024Publication date: October 3, 2024Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Corey REICHMAN, Kyoung Yeon LEE, Se Man OH, Byong Jin KIM
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Publication number: 20240274547Abstract: A semiconductor device with EMI shield and a fabricating method thereof are provided. In one embodiment, the semiconductor device includes EMI shield on all six surfaces of the semiconductor device without the use of a discrete EMI lid.Type: ApplicationFiled: April 22, 2024Publication date: August 15, 2024Inventors: Doo Soub Shin, Tae Yong Lee, Kyoung Yeon Lee, Sung Gyu Kim
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Publication number: 20240274512Abstract: In one example, a semiconductor device comprises a substrate having a top surface and a bottom surface, an electronic device on the bottom surface of the substrate, a leadframe on the bottom surface of the substrate, the leadframe comprising a paddle, wherein the paddle is coupled to the electronic device, and a lead electrically coupled to the electronic device. The semiconductor device further comprises a first protective material contacting the bottom surface of the substrate and a side surface of the electronic device.Type: ApplicationFiled: February 26, 2024Publication date: August 15, 2024Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Hyung Jun Cho, Kyoung Yeon Lee, Tae Yong Lee, Jae Min Bae
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Patent number: 12046798Abstract: In one example, a semiconductor device, includes a substrate having a substrate top side, a substrate bottom side, a substrate dielectric structure, and a substrate conductive structure. The substrate conductive structure includes a transceiver pattern proximate to a substrate top side. An antenna structure includes an antenna dielectric structure coupled to the substrate top side, an antenna conductive structure having an antenna element, and a cavity below the antenna element. The antenna element overlies the transceiver pattern. The cavity includes a cavity ceiling, a cavity base, and a cavity sidewall between the cavity ceiling and the cavity base.Type: GrantFiled: July 14, 2021Date of Patent: July 23, 2024Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Corey Reichman, Kyoung Yeon Lee, Se Man Oh, Byong Jin Kim
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Publication number: 20240234232Abstract: In one example, an electronic device comprises a base, a substrate over the base and comprising a top side, a bottom side, and a conductive structure, wherein the substrate further comprises a channel opening and an aperture, and wherein the bottom side of the substrate is oriented toward the base, an electronic component over the top side of the substrate and over the aperture, wherein the electronic component is coupled with the conductive structure, and a funnel over the top side of the substrate and comprising a funnel opening. A top side of the electronic component is exposed through the funnel opening. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: October 21, 2022Publication date: July 11, 2024Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Hyeon Gyu Lee, Byong Jin Kim, Kyoung Yeon Lee
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Publication number: 20240194572Abstract: A semiconductor package structure includes a substrate comprising a land structure. The land structure includes a first land section having a first height in a cross-sectional view and a second land section having a second height in the cross-sectional view that is different than the first height. A mold encapsulant is disposed adjacent a lateral portion of the first land section and is disposed below a bottom portion of the second land section. A semiconductor die is attached to the substrate, and includes a first major surface, a second major surface opposing the first major surface, and an outer perimeter. The semiconductor die further includes a bonding structure disposed adjacent the first major surface, which is coupled to the second land section such that the first land section is disposed outside the perimeter of the semiconductor die A mold member encapsulates at least portions of the semiconductor die.Type: ApplicationFiled: February 17, 2024Publication date: June 13, 2024Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Kyoung Yeon LEE, Byong Jin KIM, Jae Min BAE, Hyung Il JEON, Gi Jeong KIM, Ji Young CHUNG
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Publication number: 20240178206Abstract: In one example, an electronic device includes a first substrate and a second substrate. The first substrate includes a substrate first side, a substrate second side, and a first conductive structure. An inner electronic component is coupled to the first conductive structure proximate to the substrate second side. An outer electronic component is coupled to the first conductive structure proximate to the substrate first side. The outer electronic component includes a body and a groove in the body configured to couple with an external interconnect. Inner interconnects couple the first substrate to the second substrate. The first substrate, the second substrate, the inner electronic component, and the outer electronic component are in a stacked configuration. The inner electronic component is interposed between the first substrate and the second substrate. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: November 27, 2022Publication date: May 30, 2024Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Sang Hyeon LEE, Kyoung Yeon LEE, Jae Beom SHIM, Yi Seul HAN, Ji Yeon RYU, Woo Jun KIM
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Publication number: 20240136242Abstract: In one example, an electronic device comprises a base, a substrate over the base and comprising a top side, a bottom side, and a conductive structure, wherein the substrate further comprises a channel opening and an aperture, and wherein the bottom side of the substrate is oriented toward the base, an electronic component over the top side of the substrate and over the aperture, wherein the electronic component is coupled with the conductive structure, and a funnel over the top side of the substrate and comprising a funnel opening. A top side of the electronic component is exposed through the funnel opening. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: October 20, 2022Publication date: April 25, 2024Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Hyeon Gyu Lee, Byong Jin Kim, Kyoung Yeon Lee
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Patent number: 11967567Abstract: A semiconductor device with EMI shield and a fabricating method thereof are provided. In one embodiment, the semiconductor device includes EMI shield on all six surfaces of the semiconductor device without the use of a discrete EMI lid.Type: GrantFiled: April 24, 2023Date of Patent: April 23, 2024Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.Inventors: Doo Soub Shin, Tae Yong Lee, Kyoung Yeon Lee, Sung Gyu Kim
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Publication number: 20240096858Abstract: In one example, an electronic device comprises a lower substrate comprising a lower dielectric structure and a lower conductive structure, an electronic component coupled with a bottom side of the lower substrate and coupled with the lower conductive structure, an upper substrate over a top side of the lower substrate and comprising an upper dielectric structure and an upper conductive structure, an internal interconnect between the upper substrate and the lower substrate and coupled with the upper conductive structure and the lower conductive structure, and a first antenna component between the upper substrate and the lower substrate and coupled with the upper conductive structure. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: September 15, 2022Publication date: March 21, 2024Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Kyoung Yeon Lee, Jae Beom Shim, Byong Jin Kim
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Patent number: 11915998Abstract: In one example, a semiconductor device comprises a substrate having a top surface and a bottom surface, an electronic device on the bottom surface of the substrate, a leadframe on the bottom surface of the substrate, the leadframe comprising a paddle, wherein the paddle is coupled to the electronic device, and a lead electrically coupled to the electronic device. The semiconductor device further comprises a first protective material contacting the bottom surface of the substrate and a side surface of the electronic device.Type: GrantFiled: August 12, 2022Date of Patent: February 27, 2024Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Hyung Jun Cho, Kyoung Yeon Lee, Tae Yong Lee, Jae Min Bae
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Patent number: 11908779Abstract: A semiconductor package structure includes a substrate comprising a land structure. The land structure includes a first land section having a first height in a cross-sectional view and a second land section having a second height in the cross-sectional view that is different than the first height. A mold encapsulant is disposed adjacent a lateral portion of the first land section and is disposed below a bottom portion of the second land section. A semiconductor die is attached to the substrate, and includes a first major surface, a second major surface opposing the first major surface, and an outer perimeter. The semiconductor die further includes a bonding structure disposed adjacent the first major surface, which is coupled to the second land section such that the first land section is disposed outside the perimeter of the semiconductor die A mold member encapsulates at least portions of the semiconductor die.Type: GrantFiled: April 19, 2021Date of Patent: February 20, 2024Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Kyoung Yeon Lee, Byong Jin Kim, Jae Min Bae, Hyung Il Jeon, Gi Jeong Kim, Ji Young Chung
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Publication number: 20240047852Abstract: A semiconductor device can comprise a substrate dielectric structure and a substrate conductive structure that traverses the substrate dielectric structure and comprises first and second substrate terminals; an electronic component with a component terminal coupled to the first substrate terminal; and a first antenna element with a first element terminal coupled to the second substrate terminal, a first element head side adjacent a first antenna pattern, a first element base side opposite the first element side, and a first element sidewall. The first element terminal can be exposed from the first element dielectric structure at the first element base side or at the first element sidewall. The first antenna pattern can be coupled to the substrate through the first element terminal. The substrate conductive structure can couple the first antenna element to the electronic component. Other examples and methods are also disclosed.Type: ApplicationFiled: August 29, 2023Publication date: February 8, 2024Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Kyoung Yeon Lee, Tae Yong Lee, Doo Soub Shin, Seon A Lee, Woo Bin Jung, Ji Yeon Ryu, Jin Young Khim
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Publication number: 20230411303Abstract: A semiconductor device with EMI shield and a fabricating method thereof are provided. In one embodiment, the semiconductor device includes EMI shield on all six surfaces of the semiconductor device without the use of a discrete EMI lid.Type: ApplicationFiled: April 24, 2023Publication date: December 21, 2023Inventors: Doo Soub Shin, Tae Yong Lee, Kyoung Yeon Lee, Sung Gyu Kim
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Patent number: 11742565Abstract: A semiconductor device can comprise a substrate dielectric structure and a substrate conductive structure that traverses the substrate dielectric structure and comprises first and second substrate terminals; an electronic component with a component terminal coupled to the first substrate terminal; and a first antenna element with a first element terminal coupled to the second substrate terminal, a first element head side adjacent a first antenna pattern, a first element base side opposite the first element side, and a first element sidewall. The first element terminal can be exposed from the first element dielectric structure at the first element base side or at the first element sidewall. The first antenna pattern can be coupled to the substrate through the first element terminal. The substrate conductive structure can couple the first antenna element to the electronic component. Other examples and methods are also disclosed.Type: GrantFiled: August 18, 2021Date of Patent: August 29, 2023Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Kyoung Yeon Lee, Tae Yong Lee, Doo Soub Shin, Seon A Lee, Woo Bin Jung, Ji Yeon Ryu, Jin Young Khim
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Publication number: 20230260863Abstract: In one example, a semiconductor package comprises a substrate having a top surface and a bottom surface, an electronic device mounted on the top surface of the substrate and coupled to one or more interconnects on the bottom surface of the substrate, a cover over the electronic device, a casing around a periphery of the cover, and an encapsulant between the cover and the casing and the substrate.Type: ApplicationFiled: April 26, 2023Publication date: August 17, 2023Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Se Man Oh, Kyoung Yeon Lee, Sang Hyeon Lee, Min Cheol Shin