Abstract: A semiconductor package has a substrate, a first component disposed over the substrate, an encapsulant deposited over the first component, and a second component disposed over the substrate outside the encapsulant. A metal mask is disposed over the second component. A shielding layer is formed over the semiconductor package. The metal mask after forming the shielding layer. The shielding layer is optionally formed on a contact pad of the substrate while a conic area above the contact pad that extends 40 degrees from vertical remains free of the encapsulant and metal mask while forming the shielding layer. Surfaces of the metal mask and encapsulant oriented toward the contact pad can be sloped. The metal mask can be disposed and removed using a pick-and-place machine.

Abstract: Disclosed herein is a solvent composition for one-step permanent wave and hair straightener, comprising: amino acid or a derivative thereof; protein or a derivative thereof; a reducing agent; an alkaline agent; an amino acid-based surfactant; organic acid; alcohol; and urea. The solvent composition does not damage hair nor irritate the scalp, does not emit an odor, and can greatly improve the efficiency of curling and straightening hair and the ability to maintain the curled and straightened hair.