Abstract: The present invention relates to a multi-axis stage apparatus capable of significantly improving the precision of wafer bonding, a wafer bonding method using the apparatus, and a wafer bonding apparatus. The apparatus includes a base, an alignment stage configured to align a first wafer held by a first wafer chuck, a first driving device positioned between the base and the alignment stage and configured to vertically move the alignment stage with low precision, and a second driving device also positioned between the base and the alignment stage and configured to vertically move the alignment stage with high precision. The second driving device may include a flexure hinge, at least a portion of which is configured to distribute load. By combining coarse and fine vertical movement control and supporting structures based on flexure mechanics, the apparatus enables precise multi-axis alignment and bonding of wafers.

Abstract: The present disclosure relates to a multi-axis stage apparatus capable of significantly improving the precision of wafer bonding. The apparatus may include a base portion, a first driving device configured to vertically move at least a portion thereof in a third axis direction by a first distance with respect to the base portion, a second driving device formed on the first driving device and configured to vertically move at least a portion thereof in the third axis direction by a second distance, and an alignment stage connected to the second driving device and configured to align a first wafer chuck holding a first wafer such that the first wafer can be vertically moved in the third axis direction by a distance equal to the sum of the first and second distances.