Abstract: Methods of estimating yields of integrated circuits and methods of optimizing designs for the integrated circuits are provided. In a method of estimating a yield of an integrated circuit, critical paths are extracted from timing paths included in the integrated circuit by performing a static timing analysis for the integrated circuit. The critical paths are grouped into criticality sigma level groups according to criticality sigma levels of the critical paths, and the yield of the integrated circuit is determined based on numbers of the critical paths belonging to the respective criticality sigma level groups.

Abstract: Methods of estimating yields of integrated circuits and methods of optimizing designs for the integrated circuits are provided. In a method of estimating a yield of an integrated circuit, critical paths are extracted from timing paths included in the integrated circuit by performing a static timing analysis for the integrated circuit. The critical paths are grouped into criticality sigma level groups according to criticality sigma levels of the critical paths, and the yield of the integrated circuit is determined based on numbers of the critical paths belonging to the respective criticality sigma level groups.

Abstract: Disclosed herein is a method of manufacturing a printed circuit board, including the steps of providing a substrate including a first metal layer formed thereon, and forming a patterned first insulation layer on the first metal layer. The method further includes patterning the first metal layer to allow the first metal layer to have a pattern corresponding to that of the first insulation layer, thus forming a first circuit layer, and forming a second insulation layer on the substrate such that the second insulation layer surrounds the first circuit layer and the first insulation layer formed on the first circuit layer. The printed circuit board is advantageous in that process time and process cost can be reduced because a first insulation layer is used as an etching resist and is included as a part of a printed circuit board even after etching.

Abstract: Disclosed herein is a printed circuit board, including: a substrate; a first circuit layer formed on the substrate; a first insulation layer formed on the first circuit layer and having a pattern corresponding to that of the first circuit layer; and a second insulation layer formed on the substrate such that the second insulation layer surrounds the first circuit layer and the first insulation layer formed on the first circuit layer. The printed circuit board is advantageous in that process time and process cost can be reduced because a first insulation layer is used as an etching resist and is included as a part of a printed circuit board even after etching.

Abstract: Disclosed herein are a method of manufacturing a substrate for an LED module and a substrate for an LED module manufactured by the same, including: providing a base substrate having metal layers formed on both surfaces thereof; forming circuit patterns on the metal layers; applying a solder resist layer onto the circuit patterns; forming a through hole penetrating through the base substrate; separating the base substrate up and down; and bonding each of the separated base substrates to a parent substrate, thereby preventing light reflectivity of a parent substrate from being degraded due to a resist applying process and a surface treatment process.

Abstract: Disclosed herein is a printed circuit board, including: a substrate; a first circuit layer formed on the substrate; a first insulation layer formed on the first circuit layer and having a pattern corresponding to that of the first circuit layer; and a second insulation layer formed on the substrate such that the second insulation layer surrounds the first circuit layer and the first insulation layer formed on the first circuit layer. The printed circuit board is advantageous in that process time and process cost can be reduced because a first insulation layer is used as an etching resist and is included as a part of a printed circuit board even after etching.

Abstract: Disclosed is a PCB in which copper clads are formed on both sides or any one side of a semicured prepreg having a structure that optical fibers disposed at regular intervals by fixing jigs are embedded in an epoxy resin, and a method of producing the same. Furthermore, the present invention provides a PCB, in which copper clads are formed on both sides or any one side of a semicured prepreg having a structure that a waveguide layer to transmit an optical signal therethrough is embedded in an epoxy resin.