Patents by Inventor Kyoung-Sei Choi
Kyoung-Sei Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9793309Abstract: Provided is an image sensor package that includes a transparent protection cover for protecting a plurality of unit pixels each including a microlens. The image sensor package includes a substrate which has a first surface and a second surface that are opposite to each other, and includes a sensor array region including a plurality of unit pixels formed in the first surface and a pad region including a pad arranged in the vicinity of the sensor array region, a plurality of microlenses formed on the plurality of unit pixels, respectively, at least two transparent material layers covering the plurality of microlenses, and a transparent protection cover attached onto the plurality of microlenses with the at least two transparent material layers interposed therebetween.Type: GrantFiled: January 26, 2015Date of Patent: October 17, 2017Assignees: SAMSUNG ELECTRONICS CO., LTD., FUREX CO., LTD.Inventors: Byoung-rim Seo, Yoon-young Choi, Kyoung-sei Choi, Chang-soo Jin, Seung-kon Mok, Tae-weon Suh, Pyoung-wan Kim
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Patent number: 9730323Abstract: A semiconductor package may include a plurality of first semiconductor package mounted on a first region of a first surface of a first circuit board, a plurality of terminals disposed between the plurality of first semiconductor chips on a second region of the first surface of the first circuit board, and at least one second semiconductor chip mounted on a second circuit board connected to the first circuit board through the plurality of terminals.Type: GrantFiled: September 9, 2014Date of Patent: August 8, 2017Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jin Gyu Kim, Jung Woo Kim, Tae Hun Kim, Kyoung Sei Choi
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Patent number: 9570400Abstract: Provided is semiconductor package, including a semiconductor chip; an upper structure over the semiconductor chip, the upper structure having a first thermal expansion coefficient; and a lower structure under the semiconductor chip, the lower structure having a second thermal expansion coefficient of less than or equal to the first thermal expansion coefficient.Type: GrantFiled: December 17, 2014Date of Patent: February 14, 2017Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Bo-Na Baek, Seok-Won Lee, Eun-Seok Cho, Dong-Han Kim, Kyoung-Sei Choi, Sa-Yoon Kang
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Patent number: 9230876Abstract: A stack type semiconductor package includes: a lower semiconductor package including a lower package substrate, and a lower semiconductor chip which is mounted on the lower package substrate and includes a first surface facing a top surface of the lower package substrate and a second surface opposite to the first surface; an upper semiconductor package including an upper package substrate and an upper semiconductor chip which is mounted on the upper package substrate; an inter-package connection unit which connects the lower package substrate and the upper package substrate; a heat dissipation member which is formed on the second surface of the lower semiconductor chip; and an interconnection unit which is formed on a bottom surface of the upper package substrate, and is adhered to the heat dissipation member to connect the lower semiconductor chip and the upper package substrate.Type: GrantFiled: May 1, 2014Date of Patent: January 5, 2016Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jang-Woo Lee, Jong-Bo Shim, Kyoung-sei Choi
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Publication number: 20150340397Abstract: Provided is an image sensor package that includes a transparent protection cover for protecting a plurality of unit pixels each including a microlens. The image sensor package includes a substrate which has a first surface and a second surface that are opposite to each other, and includes a sensor array region including a plurality of unit pixels formed in the first surface and a pad region including a pad arranged in the vicinity of the sensor array region, a plurality of microlenses formed on the plurality of unit pixels, respectively, at least two transparent material layers covering the plurality of microlenses, and a transparent protection cover attached onto the plurality of microlenses with the at least two transparent material layers interposed therebetween.Type: ApplicationFiled: January 26, 2015Publication date: November 26, 2015Applicant: FUREX CO., LTD.Inventors: Byoung-rim SEO, Yoon-young CHOI, Kyoung-sei CHOI, Chang-soo JIN, Seung-kon MOK, Tae-weon SUH, Pyoung-wan KIM
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Publication number: 20150318226Abstract: Provided is semiconductor package, including a semiconductor chip; an upper structure over the semiconductor chip, the upper structure having a first thermal expansion coefficient; and a lower structure under the semiconductor chip, the lower structure having a second thermal expansion coefficient of less than or equal to the first thermal expansion coefficient.Type: ApplicationFiled: December 17, 2014Publication date: November 5, 2015Inventors: Bo-Na BAEK, Seok-Won LEE, Eun-Seok CHO, Dong-Han KIM, Kyoung-Sei CHOI, Sa-Yoon KANG
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Publication number: 20150245487Abstract: A semiconductor package may include a plurality of first semiconductor package mounted on a first region of a first surface of a first circuit board, a plurality of terminals disposed between the plurality of first semiconductor chips on a second region of the first surface of the first circuit board, and at least one second semiconductor chip mounted on a second circuit board connected to the first circuit board through the plurality of terminals.Type: ApplicationFiled: September 9, 2014Publication date: August 27, 2015Inventors: Jin Gyu KIM, Jung Woo KIM, Tae Hun KIM, Kyoung Sei CHOI
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Publication number: 20140374902Abstract: A stack type semiconductor package includes: a lower semiconductor package including a lower package substrate, and a lower semiconductor chip which is mounted on the lower package substrate and includes a first surface facing a top surface of the lower package substrate and a second surface opposite to the first surface; an upper semiconductor package including an upper package substrate and an upper semiconductor chip which is mounted on the upper package substrate; an inter-package connection unit which connects the lower package substrate and the upper package substrate; a heat dissipation member which is formed on the second surface of the lower semiconductor chip; and an interconnection unit which is formed on a bottom surface of the upper package substrate, and is adhered to the heat dissipation member to connect the lower semiconductor chip and the upper package substrate.Type: ApplicationFiled: May 1, 2014Publication date: December 25, 2014Inventors: Jang-Woo LEE, Jong-Bo SHIM, Kyoung-sei CHOI
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Patent number: 8796158Abstract: A method for forming a circuit pattern forming region in an insulating substrate may include preparing a metallic pattern, coating a polymer solution on a casting vessel, precuring the polymer solution, and forming an imprinted circuit pattern forming region in the precured polymer solution using the metallic pattern.Type: GrantFiled: January 9, 2012Date of Patent: August 5, 2014Assignee: Samsung Electronics Co., Ltd.Inventor: Kyoung-sei Choi
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Publication number: 20140059852Abstract: A multi-layer printed circuit board (PCB) and a method for fabricating the same are provided. The multi-layer printed circuit board may include a first film and a first insulation layer. The first film may include a first via therein and the first film may further include a first conductive pattern on an upper surface thereof and the first conductive layer may be electrically connected to the first via. The first insulation layer may be on the upper surface of the first film and the first insulation layer may include a second via therein and a second conductive pattern on an upper surface thereof and the second conductive pattern may be electrically connected to the second via. The second via may be electrically connected to the first conductive pattern.Type: ApplicationFiled: November 4, 2013Publication date: March 6, 2014Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Soo-Jeoung PARK, Chul-Woo KIM, Kyoung-Sei CHOI, Kwang-Jin BAE
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Patent number: 8648478Abstract: A heat sink includes a first adhesive layer, and a heat dissipation layer disposed on the first adhesive layer, and has ventilation ports that extend therethrough including through the first adhesive layer and the heat dissipation layer. The heat sink forms an outermost part of a semiconductor package. Thus, when the heat sink is bonded via its adhesive layer to underlying structure during a manufacturing process, the ventilation ports allow air to pass therethrough. As a result, air is not trapped in the form of bubbles between the heat sink and the underlying structure.Type: GrantFiled: June 13, 2011Date of Patent: February 11, 2014Assignee: Samsung Electronics Co., Ltd.Inventors: Jae-Wook Yoo, Kyoung-Sei Choi, Eun-Seok Cho, Mi-Na Choi, Hee-Jung Hwang, Se-Ran Bae
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Patent number: 8629547Abstract: A structure of a semiconductor chip package is provided. The semiconductor chip package includes: a substrate; a semiconductor chip mounted on a first surface of the substrate; a plurality of electrode pads on a second surface, different from the first surface, of the substrate; and an electrostatic discharge protection pad overlapping a portion of a first electrode pad and a portion of a second electrode pad among the plurality of electrode pads.Type: GrantFiled: July 13, 2011Date of Patent: January 14, 2014Assignee: Samsung Electronics Co., Ltd.Inventors: Kyong-Soon Cho, Chang-Su Kim, Kwan-Jai Lee, Kyoung-Sei Choi, Jae-Hyok Ko, Keung-Beum Kim
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Patent number: 8575746Abstract: A Chip on Flexible Printed Circuit (COF) type semiconductor package may include a flexible film, a semiconductor IC chip on the flexible film, and a heating pad on the flexible film.Type: GrantFiled: July 20, 2007Date of Patent: November 5, 2013Assignee: Samsung Electronics Co., Ltd.Inventors: Si-Hoon Lee, Sa-Yoon Kang, Kyoung-Sei Choi
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Patent number: 8513781Abstract: Provided is an electromagnetic interference (EMI) removing device for active reduction of electromagnetic interference and a semiconductor package including the same. The EMI removing device may include a film substrate having an antenna pattern configured to generate a second electromagnetic wave, which may have substantially the same frequency band, modulation mode, and directivity as a first electromagnetic wave generated by a first semiconductor chip and a phase opposite to a phase of the first electromagnetic wave.Type: GrantFiled: April 11, 2011Date of Patent: August 20, 2013Assignee: Samsung Electronics Co., Ltd.Inventors: Jae-Wook Yoo, Kyoung-Sei Choi, Yun-Seok Choi
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Patent number: 8266796Abstract: Provided is a wiring substrate, a semiconductor device package including the wiring substrate, and methods of fabricating the same. The semiconductor device package may include a wiring substrate which may include a base film. The base film may include a mounting region and a non-mounting region. The wiring substrate may further include first wiring patterns on the non-mounting region and extending into the mounting region, second wiring patterns on the first wiring patterns of the non-mounting region, and an insulating layer on the non-mounting region, and a semiconductor device which may include bonding pads. At least one of side surfaces of the second wiring patterns adjacent to the mounting region may be electrically connected to at least one of the bonding pads of the semiconductor device.Type: GrantFiled: May 21, 2008Date of Patent: September 18, 2012Assignee: Samsung Electronics Co., Ltd.Inventors: Ji-Yong Park, Kyoung-Sei Choi
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Patent number: 8250750Abstract: A method for manufacturing a tape wiring board in accordance with the present invention may employ an imprinting process in forming a wiring pattern, thereby reducing the number of processes for manufacturing a tape wiring board and allowing the manufacturing process to proceed in a single production line. Therefore, the manufacturing time and cost may be reduced. A profile of the wiring pattern may be determined by the shape of an impression pattern of a mold. This may establish the top width of inner and outer leads and incorporate tine pad pitch. Although ILB and OLB process may use an NCP, connection reliability may be established due to the soft and elastic wiring pattern.Type: GrantFiled: February 2, 2011Date of Patent: August 28, 2012Assignee: Samsung Electronics Co., Ltd.Inventors: Kyoung-Sei Choi, Sa-Yoon Kang, Yong-Hwan Kwon, Chung-Sun Lee
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Patent number: 8222089Abstract: Disclosed is a chip-on-film (COF) type semiconductor package and a device using the same. The COF type semiconductor package may include an insulation substrate including a top surface and bottom surface, a semiconductor device on the top surface of the insulation substrate, a heat dissipating component on the bottom surface of the insulation substrate, and at least one space between the bottom surface of the insulation substrate and a top surface of the heat dissipating component.Type: GrantFiled: February 23, 2011Date of Patent: July 17, 2012Assignee: Samsung Electronics Co., Ltd.Inventors: Kyoung-sei Choi, Byung-seo Kim, Young-jae Joo, Ye-chung Chung, Kyong-soon Cho, Sang-heui Lee, Si-hoon Lee, Sa-yoon Kang, Dae-woo Son, Sang-gui Jo, Jeong-kyu Ha, Young-sang Cho
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Publication number: 20120102734Abstract: A method for forming a circuit pattern forming region in an insulating substrate may include preparing a metallic pattern, coating a polymer solution on a casting vessel, precuring the polymer solution, and forming an imprinted circuit pattern forming region in the precured polymer solution using the metallic pattern.Type: ApplicationFiled: January 9, 2012Publication date: May 3, 2012Inventor: Kyoung-sei Choi
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Publication number: 20120074540Abstract: A structure of a semiconductor chip package is provided. The semiconductor chip package includes: a substrate; a semiconductor chip mounted on a first surface of the substrate; a plurality of electrode pads on a second surface, different from the first surface, of the substrate; and an electrostatic discharge protection pad overlapping a portion of a first electrode pad and a portion of a second electrode pad among the plurality of electrode pads.Type: ApplicationFiled: July 13, 2011Publication date: March 29, 2012Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Kyong-Soon CHO, Chang-Su KIM, Kwan-Jai LEE, Kyoung-Sei CHOI, Jae-Hyok KO, Keung-Beum Kim
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Patent number: 8110918Abstract: A flexible substrate used in a semiconductor package, a method of manufacturing the same, and a semiconductor package including the flexible substrate. A circuit pattern forming region is formed in an insulating substrate with a dented shape and a circuit pattern formed of a metallic material is formed in the circuit pattern forming region.Type: GrantFiled: June 10, 2004Date of Patent: February 7, 2012Assignee: Samsung Electronics Co., Ltd.Inventor: Kyoung-sei Choi