Abstract: A display device is disclosed that includes pixels, a memory, and a degradation compensator. The pixels include light emitting elements. The memory is operable to store degradation information including degradation degrees of the light emitting elements. The degradation compensator is operable to receive the degradation information and generate output grayscales by changing each of input grayscales of the pixels in proportion to each of the degradation degrees. The degradation compensator includes a degradation information changer for changing the degradation information by decreasing a degradation degree having a variation greater than a threshold value among variations of the degradation degrees.

Abstract: The present invention relates to a composition for detecting microbial contamination comprising a preparation for detecting nucleases, and a use thereof. A probe for measuring nucleic acid double-stranded nucleases, according to the present invention, may detect the comprehensive nucleic acid degradation capability of nucleases, whereby it is possible to quickly and precisely detect and quantify live microorganisms in a sample in a simple manner. Moreover, since the probe of the present invention is characterized in that signals of fluorescence consistently increase; is capable of measuring live microorganisms; and consists of a double-stranded nucleic acid, the probe is excellent for storage in a kit or a cartridge. As such, it is expected that the probe of the present invention may be used to easily and simply measure and compare the degree of contamination of microorganisms in an environment.

Abstract: The present invention relates to a probe for detecting bacteria using a peptidoglycan-binding protein, and a method for preparing the same. Also, the present invention relates to a method for detecting bacteria using the probe. The probe for detecting bacteria according to the present invention can specifically detect bacteria. That is, the probe according to the present invention can clearly distinguish between yeast and bacteria and can detect both Gram-negative and Gram-positive bacteria, and thus is expected to be usable in various fields as a universal probe for detecting bacteria. Further, use of the probe allows bacteria to be detected by identifying only fluorescence development without an additional enzymatic treatment, thereby enabling a simple and quick bacterial detection. In particular, the probe is expected to be effectively usable in the food industry where quick bacterial detection is required.

Abstract: The present invention relates to a composition for detecting microbial contamination comprising a preparation for detecting nucleases, and a use thereof. A probe for measuring nucleic acid double-stranded nucleases, according to the present invention, may detect the comprehensive nucleic acid degradation capability of nucleases, whereby it is possible to quickly and precisely detect and quantify live microorganisms in a sample in a simple manner. Moreover, since the probe of the present invention is characterized in that signals of fluorescence consistently increase; is capable of measuring live microorganisms; and consists of a double-stranded nucleic acid, the probe is excellent for storage in a kit or a cartridge. As such, it is expected that the probe of the present invention may be used to easily and simply measure and compare the degree of contamination of microorganisms in an environment.

Abstract: The present invention relates to a probe for detecting bacteria using a peptidoglycan-binding protein, and a method for preparing the same. Also, the present invention relates to a method for detecting bacteria using the probe. The probe for detecting bacteria according to the present invention can specifically detect bacteria. That is, the probe according to the present invention can clearly distinguish between yeast and bacteria and can detect both Gram-negative and Gram-positive bacteria, and thus is expected to be usable in various fields as a universal probe for detecting bacteria. Further, use of the probe allows bacteria to be detected by identifying only fluorescence development without an additional enzymatic treatment, thereby enabling a simple and quick bacterial detection. In particular, the probe is expected to be effectively usable in the food industry where quick bacterial detection is required.

Abstract: A stacked semiconductor package includes first and second semiconductor chips including semiconductor chip bodies which have circuit units, first through-electrodes which pass through the semiconductor chip bodies at first positions, and second through-electrodes which pass through the semiconductor chip bodies at second positions and provide a chip enable signal to the circuit units. A spacer including a spacer body may be interposed between the first semiconductor chip and the second semiconductor chip, with an inverter chip embedded in the spacer body. Wiring patterns formed on the spacer body may connect the first through-electrodes of the first semiconductor chip with the second through-electrodes of the second semiconductor chip, the first through-electrodes of the first semiconductor chip with input terminals of the inverter chip, and output terminals of the inverter chip with the second through-electrodes of the first semiconductor chip.

Abstract: A stacked semiconductor package includes first and second semiconductor chips including semiconductor chip bodies which have circuit units, first through-electrodes which pass through the semiconductor chip bodies at first positions, and second through-electrodes which pass through the semiconductor chip bodies at second positions and provide a chip enable signal to the circuit units. A spacer including a spacer body may be interposed between the first semiconductor chip and the second semiconductor chip, with an inverter chip embedded in the spacer body. Wiring patterns formed on the spacer body may connect the first through-electrodes of the first semiconductor chip with the second through-electrodes of the second semiconductor chip, the first through-electrodes of the first semiconductor chip with input terminals of the inverter chip, and output terminals of the inverter chip with the second through-electrodes of the first semiconductor chip.

Abstract: A semiconductor device having no voids and a semiconductor package using the same is described. The semiconductor device includes a semiconductor chip having a circuit section which is formed in a first area and a peripheral section which is formed in a second area defined around the first area, and an insulation layer covering the first and second areas and having at least one void removing part which extends from the first area to the second area to prevent a void from being formed.

Abstract: A semiconductor device having no voids and a semiconductor package using the same is described. The semiconductor device includes a semiconductor chip having a circuit section which is formed in a first area and a peripheral section which is formed in a second area defined around the first area, and an insulation layer covering the first and second areas and having at least one void removing part which extends from the first area to the second area to prevent a void from being formed.

Abstract: A semiconductor device having no voids and a semiconductor package using the same is described. The semiconductor device includes a semiconductor chip having a circuit section which is formed in a first area and a peripheral section which is formed in a second area defined around the first area, and an insulation layer covering the first and second areas and having at least one void removing part which extends from the first area to the second area to prevent a void from being formed.

Abstract: A semiconductor device having no voids and a semiconductor package using the same is described. The semiconductor device includes a semiconductor chip having a circuit section which is formed in a first area and a peripheral section which is formed in a second area defined around the first area, and an insulation layer covering the first and second areas and having at least one void removing part which extends from the first area to the second area to prevent a void from being formed.

Abstract: A semiconductor device having no voids and a semiconductor package using the same is described. The semiconductor device includes a semiconductor chip having a circuit section which is formed in a first area and a peripheral section which is formed in a second area defined around the first area, and an insulation layer covering the first and second areas and having at least one void removing part which extends from the first area to the second area to prevent a void from being formed.

Abstract: A semiconductor device having no voids and a semiconductor package using the same is described. The semiconductor device includes a semiconductor chip having a circuit section which is formed in a first area and a peripheral section which is formed in a second area defined around the first area, and an insulation layer covering the first and second areas and having at least one void removing part which extends from the first area to the second area to prevent a void from being formed.