Patents by Inventor KyoungWook Paik

KyoungWook Paik has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11732162
    Abstract: Disclosed are an anisotropic conductive adhesives for thermo-compression bonding containing solder conductive particles and flux additives and a method of connecting electronic parts using the same. The anisotropic conductive adhesives for thermo-compression bonding may include a flux activator, solder particles and polymer resin.
    Type: Grant
    Filed: November 18, 2020
    Date of Patent: August 22, 2023
    Assignee: Korea Advanced Institute of Science and Technology
    Inventors: KyoungWook Paik, Jae Hyeong Park
  • Patent number: 11161988
    Abstract: Disclosed herein are an anisotropic conductive film including a polymer layer that restricts a movement of conductive particles and a method of manufacturing the same. An anisotropic conductive film (ACF) including a plurality of conductive particles according to an embodiment includes a polymer layer in which the plurality of conductive particles is dispersed and disposed and which restricts a movement of the plurality of conductive particles by capturing the conductive particles and an adhesive layer configured on the upper and lower parts of the polymer layer to assign adhesiveness.
    Type: Grant
    Filed: March 13, 2018
    Date of Patent: November 2, 2021
    Assignee: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: KyoungWook Paik, DalJin Yoon, SangHoon Lee
  • Publication number: 20210261829
    Abstract: Disclosed are an anisotropic conductive adhesives for thermo-compression bonding containing solder conductive particles and flux aciditives and a method of connecting electronic parts using the same. The anisotropic conductive adhesives for thereto-compression bonding may include a flux activator, solder particles and polymer resin.
    Type: Application
    Filed: November 18, 2020
    Publication date: August 26, 2021
    Inventors: KyoungWook PAIK, Jae Hyeong PARK
  • Patent number: 11021616
    Abstract: Disclosed are a self-exposure method for a surface of conductive particles anchored in a polymer layer, a method of fabricating an anisotropic conductive film using the self-exposure method, and the anisotropic conductive film. A self-exposure method for a surface of conductive particles within a polymer layer may include controlling surface energy of multiple conductive particles so that a difference between surface energy of polymer to be used to fabricate the polymer layer and surface energy of the multiple conductive particles to be included in the polymer layer is a preset difference or more, forming a polymer solution by dissolving the polymer into a solvent in which the conductive particles having controlled surface energy have been mixed, and generating the polymer layer from which at least part of a surface of the multiple conductive particles has been externally exposed due to a difference in the surface energy by drying the polymer solution.
    Type: Grant
    Filed: August 7, 2018
    Date of Patent: June 1, 2021
    Assignee: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: KyoungWook Paik, Dal Jin Yoon
  • Publication number: 20200239651
    Abstract: Disclosed are a method of uniformly dispersing nickel-plated conductive particles of a single layer within a polymer film by applying a magnetic field to the polymer film and a method of fabricating an anisotropic conductive film using the same. The method of fabricating a film may include forming a liquefied polymer layer by roll-to-roll coating a polymer solution in which a plurality of conductive particles has been mixed, dispersing the plurality of conductive particles included in the liquefied polymer layer by applying a magnetic field to the liquefied polymer layer, and fabricating a solid polymer layer limiting a movement of the plurality of dispersed conductive particles by drying the liquefied polymer layer in which the plurality of conductive particles has been dispersed.
    Type: Application
    Filed: May 24, 2019
    Publication date: July 30, 2020
    Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: KyoungWook PAIK, Dal-Jin YOON, Junho BYEON
  • Publication number: 20190225819
    Abstract: Disclosed are a self-exposure method for a surface of conductive particles anchored in a polymer layer, a method of fabricating an anisotropic conductive film using the self-exposure method, and the anisotropic conductive film. A self-exposure method for a surface of conductive particles within a polymer layer may include controlling surface energy of multiple conductive particles so that a difference between surface energy of polymer to be used to fabricate the polymer layer and surface energy of the multiple conductive particles to be included in the polymer layer is a preset difference or more, forming a polymer solution by dissolving the polymer into a solvent in which the conductive particles having controlled surface energy have been mixed, and generating the polymer layer from which at least part of a surface of the multiple conductive particles has been externally exposed due to a difference in the surface energy by drying the polymer solution.
    Type: Application
    Filed: August 7, 2018
    Publication date: July 25, 2019
    Inventors: KyoungWook PAIK, Dal Jin YOON
  • Publication number: 20180298206
    Abstract: Disclosed herein are an anisotropic conductive film including a polymer layer that restricts a movement of conductive particles and a method of manufacturing the same. An anisotropic conductive film (ACF) including a plurality of conductive particles according to an embodiment includes a polymer layer in which the plurality of conductive particles is dispersed and disposed and which restricts a movement of the plurality of conductive particles by capturing the conductive particles and an adhesive layer configured on the upper and lower parts of the polymer layer to assign adhesiveness.
    Type: Application
    Filed: March 13, 2018
    Publication date: October 18, 2018
    Inventors: KyoungWook Paik, DalJin Yoon, SangHoon Lee