Patents by Inventor Kyu Bin PARK

Kyu Bin PARK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Tin alloy electroplating solution for solder bumps including perfluoroalkyl surfactant
    Patent number: 9871010
    Abstract: Disclosed is a tin-based electroplating solution for forming solder bumps of a flip chip package. The tin-based electroplating solution includes tin methanesulfonate, silver methanesulfonate, methanesulfonic acid, a fluorinated surfactant, an aromatic polyoxyalkylene ether, and water. Also disclosed is a method for forming solder bumps by using the electroplating solution. The method includes (1) electroplating a silicon wafer having a protective layer through which an electrode pad is exposed and an under bump metallurgy (UBM) layer with a copper or copper/nickel plating solution to form copper or copper/nickel pillars on the under bump metallurgy layer and (2) electroplating the pillars with the tin-based electroplating solution to form solder bumps.
    Type: Grant
    Filed: July 27, 2015
    Date of Patent: January 16, 2018
    Assignee: APCT CO., LTD
    Inventors: Jung Woo Ko, Jeong Hun Oh, Kyu Bin Park, Hyun Kook Park, Heung Su Jung
  • TIN ALLOY ELECTROPLATING SOLUTION FOR SOLDER BUMPS INCLUDING PERFLUOROALKYL SURFACTANT
    Publication number: 20160035685
    Abstract: Disclosed is a tin-based electroplating solution for forming solder bumps of a flip chip package. The tin-based electroplating solution includes tin methanesulfonate, silver methanesulfonate, methanesulfonic acid, a fluorinated surfactant, an aromatic polyoxyalkylene ether, and water. Also disclosed is a method for forming solder bumps by using the electroplating solution. The method includes (1) electroplating a silicon wafer having a protective layer through which an electrode pad is exposed and an under bump metallurgy (UBM) layer with a copper or copper/nickel plating solution to form copper or copper/nickel pillars on the under bump metallurgy layer and (2) electroplating the pillars with the tin-based electroplating solution to form solder bumps.
    Type: Application
    Filed: July 27, 2015
    Publication date: February 4, 2016
    Inventors: Jung Woo KO, Jeong Hun OH, Kyu Bin PARK, Hyun Kook PARK, Heung Su JUNG