Patents by Inventor Kyu Bong KIM

Kyu Bong KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device connected by anisotropic conductive film
    Patent number: 9666552
    Abstract: A semiconductor device connected by an anisotropic conductive film, the anisotropic conductive film including a polyurethane resin; at least one other resin selected from the group of an ethylene-vinyl acetate copolymer resin, an acrylonitrile resin, and a styrene resin; isobornyl acrylate; and conductive particles.
    Type: Grant
    Filed: November 5, 2013
    Date of Patent: May 30, 2017
    Assignee: CHEIL INDUSTRIES, INC.
    Inventors: Young Ju Shin, Kyu Bong Kim, Hyun Joo Seo, Kyoung Hun Shin, Woo Jun Lim
  • Semiconductor device connected by anisotropic conductive adhesive film
    Patent number: 9437346
    Abstract: A semiconductor device connected using an anisotropic conductive adhesive composition, the anisotropic conductive adhesive composition including a thermosetting polymerization initiator; and tetrahydrofurfuryl (meth)acrylate or furfuryl (meth)acrylate, wherein the tetrahydrofurfuryl (meth)acrylate or furfuryl (meth)acrylate is present in the composition in an amount of 1 wt % to 25 wt %, based on the total weight of the composition in terms of solid content.
    Type: Grant
    Filed: October 9, 2013
    Date of Patent: September 6, 2016
    Assignee: CHEIL INDUSTRIES, INC.
    Inventors: Kyoung Hun Shin, Do Hyun Park, Hyun Joo Seo, Young Ju Shin, Kyu Bong Kim, Woo Jun Lim
  • Semiconductor device connected by anisotropic conductive film
    Patent number: 9252117
    Abstract: A semiconductor device connected by an anisotropic conductive film, the film having a storage modulus of 100 MPa to 300 MPa at 40° C. after curing of the film, and a peak point of 80° C. to 90° C. in a DSC (Differential Scanning calorimeter) profile of the film.
    Type: Grant
    Filed: November 6, 2013
    Date of Patent: February 2, 2016
    Assignee: CHEIL INDUSTRIES, INC.
    Inventors: Kyoung Hun Shin, Kyu Bong Kim, Hyun Joo Seo, Young Ju Shin, Woo Jun Lim
  • Semiconductor device bonded by anisotropic conductive film
    Patent number: 9142525
    Abstract: A semiconductor device including a first connecting member including a first electrode; a second connecting member including a second electrode; and an anisotropic conductive film between the first connecting member and the second connecting member, the anisotropic conductive film bonding the first electrode to the second electrode, wherein the anisotropic conductive film exhibits linear indentations in an inter-terminal space of the second connecting member after pre-compression and primary compression of the anisotropic conductive film onto the first and second connecting members.
    Type: Grant
    Filed: November 20, 2013
    Date of Patent: September 22, 2015
    Assignee: CHEIL INDUSTRIES, INC.
    Inventors: Do Hyun Park, Kyu Bong Kim, Woo Jun Lim
  • SEMICONDUCTOR DEVICE CONNECTED BY ANISOTROPIC CONDUCTIVE FILM
    Publication number: 20140159229
    Abstract: A semiconductor device connected by an anisotropic conductive film, the film having a storage modulus of 100 MPa to 300 MPa at 40° C. after curing of the film, and a peak point of 80° C. to 90° C. in a DSC (Differential Scanning calorimeter) profile of the film.
    Type: Application
    Filed: November 6, 2013
    Publication date: June 12, 2014
    Inventors: Kyoung Hun SHIN, Kyu Bong KIM, Hyun Joo SEO, Young Ju SHIN, Woo Jun LIM
  • SEMICONDUCTOR DEVICE BONDED BY ANISOTROPIC CONDUCTIVE FILM
    Publication number: 20140138828
    Abstract: A semiconductor device including a first connecting member including a first electrode; a second connecting member including a second electrode; and an anisotropic conductive film between the first connecting member and the second connecting member, the anisotropic conductive film bonding the first electrode to the second electrode, wherein the anisotropic conductive film exhibits linear indentations in an inter-terminal space of the second connecting member after pre-compression and primary compression of the anisotropic conductive film onto the first and second connecting members.
    Type: Application
    Filed: November 20, 2013
    Publication date: May 22, 2014
    Inventors: Do Hyun PARK, Kyu Bong KIM, Woo Jun LIM
  • SEMICONDUCTOR DEVICE CONNECTED BY ANISOTROPIC CONDUCTIVE FILM
    Publication number: 20140124931
    Abstract: A semiconductor device connected by an anisotropic conductive film, the anisotropic conductive film including a polyurethane resin; at least one other resin selected from the group of an ethylene-vinyl acetate copolymer resin, an acrylonitrile resin, and a styrene resin; isobornyl acrylate; and conductive particles.
    Type: Application
    Filed: November 5, 2013
    Publication date: May 8, 2014
    Inventors: Young Ju SHIN, Kyu Bong KIM, Hyun Joo SEO, Kyoung Hun SHIN, Woo Jun LIM
  • SEMICONDUCTOR DEVICE CONNECTED BY ANISOTROPIC CONDUCTIVE ADHESIVE FILM
    Publication number: 20140097548
    Abstract: A semiconductor device connected using an anisotropic conductive adhesive composition, the anisotropic conductive adhesive composition including a thermosetting polymerization initiator; and tetrahydrofurfuryl (meth)acrylate or furfuryl (meth)acrylate, wherein the tetrahydrofurfuryl (meth)acrylate or furfuryl (meth)acrylate is present in the composition in an amount of 1 wt % to 25 wt %, based on the total weight of the composition in terms of solid content.
    Type: Application
    Filed: October 9, 2013
    Publication date: April 10, 2014
    Inventors: Kyoung Hun SHIN, Do Hyun PARK, Hyun Joo SEO, Young Ju SHIN, Kyu Bong KIM, Woo Jun LIM