Patents by Inventor Kyu-Chang Shim

Kyu-Chang Shim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • RESIN COMPOSITION FOR NON-CONDUCTIVE FILM WITH EXCELLENT HIGH TEMPERATURE PROPERTIES FOR 3D TSV PACKAGES
    Publication number: 20240209166
    Abstract: The disclosure relates to compositions for forming films and the use of said films in three-dimension through-silicon-via (3D TSV) packages. In certain aspects, the disclosure relates to compositions comprising one or more resins, one or more imidazoles with latent thermal activity, one or more inorganic fillers, and one or more additives, to B-stage films prepared from the disclosed compositions, and to cured films obtained after cure of the disclosed compositions.
    Type: Application
    Filed: January 18, 2024
    Publication date: June 27, 2024
    Inventors: Jie Bai, Qizhuo Zhuo, James Sungwook Jang, Kyu Chang Shim
  • RESIN COMPOSITION FOR NON-CONDUCTIVE FILM WITH EXCELLENT HIGH TEMPERATURE PROPERTIES FOR 3D TSV PACKAGES
    Publication number: 20240174854
    Abstract: The disclosure relates to compositions for forming films and the use of said films in three-dimension through-silicon-via (3D TSV) packages. In certain aspects, the disclosure relates to compositions comprising one or more resins, one or more imidazoles with latent thermal activity, one or more inorganic fillers, and one or more additives, to B-stage films prepared from the disclosed compositions, and to cured films obtained after cure of the disclosed compositions.
    Type: Application
    Filed: January 20, 2024
    Publication date: May 30, 2024
    Inventors: Jie Bai, James Sungwook Jang, Kyu Chang Shim, Qizhuo Zhuo
  • TIRE CURING MOULD FORMED WITH INTERNAL HOLES
    Publication number: 20070148270
    Abstract: Disclosed is a tire curing mould with internal holes including a plurality of segment moulds disposed in a circumferential direction of a tire and assembled to each other, and a plurality of holes formed through the segment moulds, characterized in that each of the segment moulds 100 has a through hole 110 formed in a circumferential direction of the segment mould 100, whereby it is possible to provide a high quality tire which is lightweight and easy to maintain, and has excellent durability and high heat transfer efficiency.
    Type: Application
    Filed: March 8, 2007
    Publication date: June 28, 2007
    Applicant: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
    Inventors: Woon-Jae Jung, Kyu-Chang Shim, Jae-Hoon Lee