Patents by Inventor Kyu-Dong Choi
Kyu-Dong Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11945744Abstract: Disclosed are a method and apparatus for reusing wastewater. The method for reusing wastewater disclosed herein includes: generating a mixed wastewater by mixing multiple types of wastewater (S20); performing a first purification by passing the mixed wastewater through a flocculation-sedimentation unit (S40); performing a second purification by passing an effluent of the flocculation-sedimentation unit through a membrane bioreactor (MBR) (S60); performing a third purification by passing an effluent of the MBR through a reverse-osmosis membrane unit (S80); and reusing an effluent of the reverse-osmosis membrane unit as cooling water or industrial water (S100).Type: GrantFiled: April 14, 2023Date of Patent: April 2, 2024Assignees: SAMSUNG ENGINEERING CO., LTD., SAMSUNG ELECTRONICS CO., LTDInventors: Seok Hwan Hong, Dae Soo Park, Seung Joon Chung, Yong Xun Jin, Jae Hyung Park, Jae Hoon Choi, Jae Dong Hwang, Jong Keun Yi, Su Hyoung Cho, Kyu Won Hwang, June Yurl Hur, Je Hun Kim, Ji Won Chun
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Patent number: 10419847Abstract: The present invention discloses a microspeaker enclosure with porous materials, including a microspeaker, an enclosure with the microspeaker therein, the enclosure defining a resonance space and having an upper casing and a lower casing, porous materials filled in the resonance space of the enclosure, and an anti-noise structure which prevents at least one of a collision between the porous materials, a collision between the porous materials and the enclosure, a collision between the porous materials and the microspeaker, and introduction of the porous materials into the microspeaker.Type: GrantFiled: June 6, 2017Date of Patent: September 17, 2019Assignee: EM-TECH. Co., Ltd.Inventors: Kyu Dong Choi, Jong Heon Ha, Hyeon Taek Oh
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Patent number: 10419848Abstract: The present invention discloses a microspeaker enclosure with porous materials, including a microspeaker, an enclosure with the microspeaker therein, the enclosure defining a resonance space and having an upper casing and a lower casing, a sound absorber arranged in the resonance space and defining a space, and porous materials filled in the space defined by the sound absorber.Type: GrantFiled: June 8, 2017Date of Patent: September 17, 2019Assignee: EM-TECH. Co., Ltd.Inventors: Kyu Dong Choi, Seul Ki Nam, Heung Woo Jeong
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Patent number: 9900703Abstract: The present invention relates to a suspension structure for a high power micro speaker and, more particularly, to a shape of a suspension which ensures a lightweight of the suspension as well as high reliability and a conductive pattern which applies electric signals. The present invention provides a suspension for a high power micro speaker that includes an outer peripheral portion, a central portion and a connection portion, is provided with a conductive pattern, and is formed in a rectangular shape, wherein land portions for use in soldering or welding lead-in wires of a voice coil are formed on long connection portions disposed on long sides.Type: GrantFiled: August 23, 2012Date of Patent: February 20, 2018Assignee: EM-TECH. Co., Ltd.Inventors: Cheon Myeong Kim, Kyu Dong Choi, In Ho Jeong
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Publication number: 20170359649Abstract: The present invention discloses a microspeaker enclosure with porous materials, including a microspeaker, an enclosure with the microspeaker therein, the enclosure defining a resonance space and having an upper casing and a lower casing, a sound absorber arranged in the resonance space and defining a space, and porous materials filled in the space defined by the sound absorber.Type: ApplicationFiled: June 8, 2017Publication date: December 14, 2017Inventors: Kyu Dong Choi, Seul Ki Nam, Heung Woo Jeong
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Publication number: 20170353785Abstract: The present invention discloses a microspeaker enclosure with porous materials, including a microspeaker, an enclosure with the microspeaker therein, the enclosure defining a resonance space and having an upper casing and a lower casing, porous materials filled in the resonance space of the enclosure, and an anti-noise structure which prevents at least one of a collision between the porous materials, a collision between the porous materials and the enclosure, a collision between the porous materials and the microspeaker, and introduction of the porous materials into the microspeaker.Type: ApplicationFiled: June 6, 2017Publication date: December 7, 2017Inventors: Kyu Dong Choi, Jong Heon Ha, Hyeon Taek Oh
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Patent number: 9693145Abstract: The present invention relates to a suspension structure for a high power micro speaker and, more particularly, to a shape of a suspension which ensures a lightweight of the suspension as well as high reliability and a conductive pattern which applies electric signals. The present invention provides a suspension for a high power micro speaker that includes an outer peripheral portion, a central portion and a connection portion, is provided with a conductive pattern, and is formed in a rectangular shape, wherein land portions for use in soldering or welding lead-in wires of a voice coil are formed on long connection portions disposed on long sides.Type: GrantFiled: August 23, 2012Date of Patent: June 27, 2017Assignee: EM-TECH. Co., Ltd.Inventors: Cheon Myeong Kim, Kyu Dong Choi, In Ho Jeong
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Publication number: 20170049968Abstract: Disclosed herein is a length-reducing syringe driving device, the length-reducing syringe driving device wherein a drive for syringe device is installed at a syringe device (10), and pushes and drives a piston (12) equipped at an injection cartridge (11) which has a discharging outlet (13) at one dead end thereof. The length-reducing syringe driving device (100) comprises: a rotation driving part (110) installed at one or more places at an outer sidewall surface at the other dead end of the injection cartridge (11); and a one-way bending member (120) provided to be contacted to the piston (12) at one dead end thereof, configured to be bended exclusively to one direction, and having a sidewall surface of a bending direction driven by the rotation driving part (110) and pushing the piston (12).Type: ApplicationFiled: April 28, 2015Publication date: February 23, 2017Inventor: Kyu Dong CHOI
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Publication number: 20160331903Abstract: Disclosed herein is a method for injecting a medication, including injecting the medication into a subject by pushing the medication filled in a cartridge with a pusher, and moving the pusher backwards to a predetermined distance in a direction opposite to a direction of pushing the pusher when a prescribed dose of medication has been injected.Type: ApplicationFiled: February 28, 2014Publication date: November 17, 2016Inventor: Kyu Dong CHOI
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Patent number: 9473837Abstract: The present invention discloses a sound transducer with a ventilation structure capable of securing a flow path of air introduced from within and outside of the sound transducer to the maximum. The sound transducer with a ventilation structure includes a frame, a magnetic circuit installed within the frame, a voice coil vibrating according to mutual electromagnetic force with the magnetic circuit upon receiving an electrical signal, a vibration plate vibrating according to vibrations of the voice coil to generate a sound, and a drain hole formed to be adjacent to the corner of the frame and allowing air to flow between the interior and exterior of the frame.Type: GrantFiled: October 25, 2013Date of Patent: October 18, 2016Assignee: Em-Tech. Co., Ltd.Inventors: Kyu Dong Choi, Kil Dong Park, Ji Hoon Kim, Joong Hak Kwon
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Patent number: 9277305Abstract: An object of the present invention is to provide a suspension for a sound transducer which has a central portion serving as a center diaphragm and which has a cover layer and a copper pattern partially removed to prevent a decrease in sound pressure from being caused by an increase in weight of a vibration system. According to the present invention, there is provided a suspension for a sound transducer which includes a central portion, a peripheral portion, and a support portion for connecting the central portion to the peripheral portion, the suspension comprising: a base film, a conductive film attached on the base film by means of an adhesive, and a cover layer attached on the conductive film by an adhesive, wherein at least part of the cover layer disposed on the central portion is removed.Type: GrantFiled: July 29, 2013Date of Patent: March 1, 2016Assignee: EM-TECH. Co., Ltd.Inventors: Joong Hak Kwon, Ho Il Jeong, Kyu Dong Choi, In Ho Jeong
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Patent number: 9185494Abstract: An inner magnet type microspeaker including a suspension is provided which can maximize the size of a magnet. The inner magnet type microspeaker includes: a frame; a yoke installed inside of the frame and including a bottom surface and sidewalls bent upward from the bottom surface; a magnet bonded to an inside of the yoke; a voice coil located in a gap portion between the sidewalls of the yoke and the magnet; a diaphragm that vibrates by the voice coil; and a suspension where the voice coil is attached, and which guides vibrations of the diaphragm and the voice coil and includes a ring-shaped inner peripheral portion and an outer peripheral portion that surrounds the inner peripheral portion, spaced a predetermined distance apart from the inner peripheral portion, with one end and the other end being connected to the inner peripheral portion.Type: GrantFiled: February 20, 2014Date of Patent: November 10, 2015Assignee: EM-TECH Co., Ltd.Inventors: Kyu Dong Choi, Jong Soo Yoon
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Patent number: 9088840Abstract: The present invention relates to a vibration module for a sound transducer and, more particularly, to a vibration module for a sound transducer which can prevent sound leakage by minimizing contacts between a diaphragm and a voice coil. The vibration module for the sound transducer according to the present invention comprises: a substrate having an inner portion and an outer portion, an electrical connection portion for applying electrical signals to a voice coil being provided on the inner portion and a terminal being provided on the outer portion, for performing electrical connection between the electrical connection portion and the terminal; a first diaphragm attached between the inner portion and outer portion of the substrate; and the voice coil mounted on the inside of the inner portion of the substrate with a certain distance from the first diaphragm and electrically connected to the electrical connection portion.Type: GrantFiled: October 25, 2013Date of Patent: July 21, 2015Assignee: EM-TECH. Co., Ltd.Inventors: Kyu Dong Choi, Kil Dong Park, In Ho Jeong, Joong Hak Kwon
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Patent number: 9025808Abstract: The present invention relates to a high-output microspeaker, and more particularly, to a high-output microspeaker which includes a damper for preventing lateral vibrations of a diaphragm.Type: GrantFiled: May 10, 2012Date of Patent: May 5, 2015Assignee: Em-Tech. Co., Ltd.Inventors: Joong Hak Kwon, Cheon Myeong Kim, Ji Hoon Kim, Kyu Dong Choi
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Publication number: 20140241566Abstract: An inner magnet type microspeaker including a suspension is provided which can maximize the size of a magnet. The inner magnet type microspeaker includes: a frame; a yoke installed inside of the frame and including a bottom surface and sidewalls bent upward from the bottom surface; a magnet bonded to an inside of the yoke; a voice coil located in a gap portion between the sidewalls of the yoke and the magnet; a diaphragm that vibrates by the voice coil; and a suspension where the voice coil is attached, and which guides vibrations of the diaphragm and the voice coil and includes a ring-shaped inner peripheral portion and an outer peripheral portion that surrounds the inner peripheral portion, spaced a predetermined distance apart from the inner peripheral portion, with one end and the other end being connected to the inner peripheral portion.Type: ApplicationFiled: February 20, 2014Publication date: August 28, 2014Applicant: EM-TECH Co., Ltd.Inventors: Kyu Dong Choi, Jong Soo Yoon
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Publication number: 20140169593Abstract: The present invention relates to a high-output microspeaker, and more particularly, to a high-output microspeaker which includes a damper for preventing lateral vibrations of a diaphragm.Type: ApplicationFiled: May 10, 2012Publication date: June 19, 2014Applicant: EM-TECH. CO., LTD.Inventors: Joong Hak Kwon, Cheon Myeong Kim, Ji Hoon Kim, Kyu Dong Choi
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Publication number: 20140119578Abstract: The present invention relates to a vibration module for a sound transducer and, more particularly, to a vibration module for a sound transducer which can prevent sound leakage by minimizing contacts between a diaphragm and a voice coil. The vibration module for the sound transducer according to the present invention comprises: a substrate having an inner portion and an outer portion, an electrical connection portion for applying electrical signals to a voice coil being provided on the inner portion and a terminal being provided on the outer portion, for performing electrical connection between the electrical connection portion and the terminal; a first diaphragm attached between the inner portion and outer portion of the substrate; and the voice coil mounted on the inside of the inner portion of the substrate with a certain distance from the first diaphragm and electrically connected to the electrical connection portion.Type: ApplicationFiled: October 25, 2013Publication date: May 1, 2014Applicant: EM-TECH. CO., LTD.Inventors: Kyu Dong Choi, Kil Dong Park, In Ho Jeong, Joong Hak Kwon
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Publication number: 20140119592Abstract: The present invention discloses a sound transducer with a ventilation structure capable of securing a flow path of air introduced from within and outside of the sound transducer to the maximum. The sound transducer with a ventilation structure includes a frame, a magnetic circuit installed within the frame, a voice coil vibrating according to mutual electromagnetic force with the magnetic circuit upon receiving an electrical signal, a vibration plate vibrating according to vibrations of the voice coil to generate a sound, and a drain hole formed to be adjacent to the corner of the frame and allowing air to flow between the interior and exterior of the frame.Type: ApplicationFiled: October 25, 2013Publication date: May 1, 2014Applicant: EM-TECH. CO., LTD.Inventors: Kyu Dong Choi, Kil Dong Park, Ji Hoon Kim, Joong Hak Kwon
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Publication number: 20140056463Abstract: The present invention relates to a suspension structure for a high power micro speaker and, more particularly, to a shape of a suspension which ensures a lightweight of the suspension as well as high reliability and a conductive pattern which applies electric signals. The present invention provides a suspension for a high power micro speaker that includes an outer peripheral portion, a central portion and a connection portion, is provided with a conductive pattern, and is formed in a rectangular shape, wherein land portions for use in soldering or welding lead-in wires of a voice coil are formed on long connection portions disposed on long sides.Type: ApplicationFiled: August 23, 2012Publication date: February 27, 2014Applicant: EM-TECH. CO., LTD.Inventors: Cheon Myeong Kim, Kyu Dong Choi, In Ho Jeong
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Publication number: 20140029784Abstract: An object of the present invention is to provide a suspension for a sound transducer which has a central portion serving as a center diaphragm and which has a cover layer and a copper pattern partially removed to prevent a decrease in sound pressure from being caused by an increase in weight of a vibration system. According to the present invention, there is provided a suspension for a sound transducer which includes a central portion, a peripheral portion, and a support portion for connecting the central portion to the peripheral portion, the suspension comprising: a base film, a conductive film attached on the base film by means of an adhesive, and a cover layer attached on the conductive film by an adhesive, wherein at least part of the cover layer disposed on the central portion is removed.Type: ApplicationFiled: July 29, 2013Publication date: January 30, 2014Applicant: EM-TECH. CO., LTD.Inventors: Joong Hak Kwon, Ho Il Jeong, Kyu Dong Choi, In Ho Jeong