Abstract: A memory module includes a circuit board, a plurality of memory devices, and a power management integrated circuit (PMIC). The circuit board includes first connectors, a second connector, and a third connector connected to an external device. The plurality of memory devices are mounted on the circuit board, and connected to the first connectors. The PMIC receives a first voltage through the second connector, generates a second voltage using the first voltage, and provides the second voltage to the plurality of memory devices The PMIC adjusts the second voltage based on a signal received through the third connector such that a voltage difference of the first voltage and the second voltage is reduced in a training mode of the memory module.

Abstract: A method of operating a memory system includes setting a secured area in a volatile memory device of the memory system during a secure mode, writing secure data in the secured area during the secure mode, and when a write command for the secured area is inputted in a normal operation mode, preventing a write operation from occurring and generating an error signal. Accordingly, the secured area is set in the volatile memory device so that the hacking and the data forgery may be prevented.

Abstract: A memory module includes a circuit board, a plurality of memory devices, and a power management integrated circuit (PMIC). The circuit board includes first connectors, a second connector, and a third connector connected to an external device. The plurality of memory devices are mounted on the circuit board, and connected to the first connectors. The PMIC receives a first voltage through the second connector, generates a second voltage using the first voltage, and provides the second voltage to the plurality of memory devices The PMIC adjusts the second voltage based on a signal received through the third connector such that a voltage difference of the first voltage and the second voltage is reduced in a training mode of the memory module.

Abstract: A memory module includes semiconductor memory devices, a power management integrated circuit (PMIC), and a control device. The semiconductor memory devices, mounted on a circuit board, operate based on a power supply voltage. The PMIC, mounted on the circuit board, generates the power supply voltage, provides the power supply voltage to the semiconductor memory devices, and stores a trimming control code associated with a minimum level of the power supply voltage when the semiconductor memory devices operate normally in a test mode. During the test mode, the PMIC adjusts a level of the power supply voltage, tests the semiconductor memory devices using the adjusted power supply voltage, and stores the trimming control code based on a result of the test. The control device controls the PMIC based on a first control signal received from an external device.

Abstract: A memory module includes semiconductor memory devices, a power management integrated circuit (PMIC), and a control device. The semiconductor memory devices, mounted on a circuit board, operate based on a power supply voltage. The PMIC, mounted on the circuit board, generates the power supply voltage, provides the power supply voltage to the semiconductor memory devices, and stores a trimming control code associated with a minimum level of the power supply voltage when the semiconductor memory devices operate normally in a test mode. During the test mode, the PMIC adjusts a level of the power supply voltage, tests the semiconductor memory devices using the adjusted power supply voltage, and stores the trimming control code based on a result of the test. The control device controls the PMIC based on a first control signal received from an external device.

Abstract: A memory module may include a first memory group and a second memory group; and a first clock signal line and a second clock signal line via which the first clock signal and the second clock signal propagate from the buffer chip to the first memory group and the second memory group, respectively, wherein distances that the first clock signals propagate from a buffer chip to a plurality of memory chips of the first memory group via the first clock signal line are identical to one another and are referred to as a first distance, and distances that the second clock signals propagate from the buffer chip to a plurality of memory chips of the second memory group via the second clock signal line are identical to one another and are referred to as a second distance.

Abstract: A method of operating a memory system includes setting a secured area in a volatile memory device of the memory system during a secure mode, writing secure data in the secured area during the secure mode, and when a write command for the secured area is inputted in a normal operation mode, preventing a write operation from occurring and generating an error signal. Accordingly, the secured area is set in the volatile memory device so that the hacking and the data forgery may be prevented.

Abstract: A heat radiating pipe (2) that is disposed in a hot water mat (1) is extended from the hot water mat (1) to provide an extended portion that is used as connecting pipes (2a and 2b) to a heat source machine (11). The construction makes it possible to prevent a water leak as there is no connection therebetween, and reduces costs for parts and installation as no connection tool, such as a coupler, is used. Further, guide pieces (13 and 14) attached with cover members (17) are arranged at positions where the connecting pipes (2a and 2b) are extended, and the connecting pipes (2a and 2b) are disposed by using the guide pieces (13 and 14), so as to efficiently utilize heat radiated from the connecting pipes (2a and 2b), and to prevent thermal loss.

Abstract: A flexible substrate for a display panel and a manufacturing method thereof is disclosed. The flexible substrate may include a first film having a glass cloth located within a first heat-resistant resin, and a second film laminated on at least one side of the first film. The second film may include a second heat-resistant resin. The flexible substrate may further include an intermediate material between the first film and the second film. The intermediate material may be applied to an outer part of the first film and may adhere the first film to the second film.

Abstract: A flexible substrate for a display panel and a manufacturing method thereof is disclosed. The flexible substrate may include a first film having a glass cloth located within a first heat-resistant resin, and a second film laminated on at least one side of the first film. The second film may include a second heat-resistant resin. The flexible substrate may further include an intermediate material between the first film and the second film. The intermediate material may be applied to an outer part of the first film and may adhere the first film to the second film.

Abstract: There is provided a surface light source device, including: a light source body having a first substrate and a second substrate between which a plurality of discharge spaces are formed, a discharge gas being provided into the discharge spaces; a reflecting layer formed on an inner surface of the first substrate; a first adsorption preventing layer formed on the reflecting layer, for preventing the discharge gas from being adsorbed to the reflecting layer; a first fluorescent layer formed on the first adsorption preventing layer; a second fluorescent layer formed on an inner surface of the second substrate; and an electrode applying a discharge voltage to the discharge gas. Accordingly, since the discharge gas is uniformly distributed in the discharge spaces, the surface light source device has improved brightness uniformity.

Abstract: In method for freeze-crushing waste resources, freezing gas is first created by collecting freezing heat source of liquefied petroleum gas during a heat exchange process between the liquefied petroleum gas and cooling gas, and then the waste resources stored in a freezing tank is frozen to a temperature where the waste resources can be easily crushed by supplying the freezing gas to the freezing tank. Next, the frozen waste resources is crushed in an crushing apparatus, after which the freezing gas is separated from the crushed waste resources in a separate apparatus and the freezing gas for is collected the purpose of reuse.

Abstract: In method for freeze-crushing waste resources, freezing gas is first created by collecting freezing heat source of liquefied petroleum gas during a heat exchange process between the liquefied petroleum gas and cooling gas, and then the waste resources stored in a freezing tank is frozen to a temperature where the waste resources can be easily crushed by supplying the freezing gas to the freezing tank. Next, the frozen waste resources is crushed in an crushing apparatus, after which the freezing gas is separated from the crushed waste resources in a separate apparatus and the freezing gas for is collected the purpose of reuse.

Abstract: A system for manufacturing a print board assembly, which is implemented in a system having a computer for storing parts insertion instruction diagrams and displaying parts insertion instructions, and a soldering unit for soldering a printed circuit board, includes: assembling different types of the printed circuit boards from pieces of parts and inspecting them in a multitude of cells; installing different types of the printed circuit boards in carriers to assemble them separately according to the parts insertion instructions displayed by the computer of each cell, and moving them to the soldering unit through a transfer conveyor line; and returning the carriers having the printed circuit boards completely soldered to each cell identified for the carriers through a return conveyor line.

Abstract: A method of manufacturing a print board assembly, which is implemented in a system having a computer for storing parts insertion instruction diagrams and displaying parts insertion instructions, and a soldering unit for soldering a printed circuit board, includes the steps of: assembling different types of the printed circuit boards from pieces of parts and inspecting them in a multitude of cells; installing different types of the printed circuit boards in carriers to assemble them separately according to the parts insertion instructions displayed by the computer of each cell, and moving them to the soldering unit through a transfer conveyor line; and returning the carriers having the printed circuit boards completely soldered to each cell identified for the carriers through a return conveyor line.